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What is flip chip?

A type of semiconductor mounting technique that does not require any wire bonds. The final wafer processing step deposits solder bumps on the chip pads, which are used to connect directly to the associated external circuitry.

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2013-07-29	Vishay Precision Group debuts foil resistor flip-chip VPG's FRFC 0805 ultra-high-precision Z1-Foil flip-chip resistor noise-free and provides ESD protection of 25kV or more for increased reliability.
2007-07-10	Understanding flip-chip and chip-scale package technologies and their applications This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2003-07-07	TSMC, Amkor partner on flip-chip packaging Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies.
2003-08-27	TriQuint, Amkor partner on flip-chip process TriQuint Semiconductor Inc. has teamed with Amkor Technology Inc. to commercialize a low-cost flip-chip assembly process for GaAs semiconductors.
2010-07-09	TI turns to pillar flip-chip for 45-/40nm node Texas Instruments Inc. is embracing an emerging technology called fine-pitch copper pillar flip-chip packages for devices at the 45-/40nm node and below.
2001-02-01	Testing dimensional limits of high I/O flip-chip design The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2002-03-22	SUSS flip-chip bonder has up to 200kgf handling force The FC259 flip-chip bonder features a handling force of 10gf, which is suitable for handling brittle substrates used for optoelectronic devices, but can be configured up to 200kgf for thermocompression processes.
2010-12-15	STATS ChipPac flip chip biz grows over 50% Semicon test and packaging provider STATS ChipPAC announced its flip chip business grew more than 50 percent in 2010. The company shipped more than 250 million flip chip packaging units.
2005-09-02	Singapore packager to expand flip-chip capacity Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly.
2008-04-30	Singapore inventor gets patent for flip-chip IC assembly tech Teck Kheng Lee of Singapore has been granted U.S. patent for his development of a method for assembling a flip chip semiconductor device.
2004-10-29	SDK blue LED features flip chip structure Showa Denko K.K. announced that it has developed a blue LED based on gallium nitride.
2007-06-19	RF switch packs four switches in flip-chip housing Peregrine Semiconductor Corp. has unveiled the UltraCMOS PE42110 multiple switch IC for advanced multi-band WCDMA handsets.
2001-08-01	Preventing flip-chip solder joint failures Learn about the degradation of solder joints in FCOBs as a result of thermal cycling. The article also seeks to answer how solder joint cracks are initiated and propagated.
2000-06-01	Novel ACF for flip-chip attach This paper focuses on determining the advantages achieved with the new 'ordered' ACF on actual flip-chip assemblies. In particular, the distribution of conductive particles are determined on the flip-chip bumps and results are compared to theoretical predictions.
2011-04-15	New flip-chip techs, apps loom ahead Factors such as the rising cost of gold used for wire bonding, need for low-thickness devices and continued CMOS downscaling have triggered interest in flip-chip technologies.
2005-02-25	Kyocera expands flip-chip assembly Kyocera America Inc. has expanded its flip-chip assembly operations to include 12-inch (300mm) wafer dicing.
2004-02-12	Kulicke & Soffa sells flip-chip business Kulicke & Soffa Ind. Inc. has sold all the assets associated with its advanced packaging technology segment.
2010-06-04	IPAD 500?m Flip Chip: package description and recommendations for use This application note provides package and usage recommendation information for 500?m pitch Flip Chips.
2001-09-16	Improving compression-type flip-chip bonding This technical article describes the compression-type flip-chip bonding technique that enables high-quality, high-density and low-cost processes in LSI packaging.
2005-09-29	IDT's flip-chip packaged monolithic NSEs now RoHS-compliant IDT disclosed that it has begun volume production of its RoHS-compliant flip-chip packaged monolithic 512Kx36 (18Mb) and 256Kx36 (9Mb) network search engines with dual Network Processor Forum Look Aside interfaces.
2005-09-21	IDT offers network engines in RoHS-compliant flip-chip packaging Integrated Device Technology Inc. (IDT) has begun volume production of its RoHS (Restriction on Hazardous Substances)-compliant flip-chip packaged monolithic 512Kx36 (18Mbit) and 256Kx36 (9Mbit) network search engines (NSEs) with dual Network Processor Forum (NPF) Look Aside (LA-1) interfaces.
2003-12-17	Fujitsu announces breakthrough in solder bumping, flip-chip bonding Fujitsu Ltd has developed new technology that enables formation of ultrafine pitch 35&3181;m (center-to-center distance of bumps) solder bumps, and high-precision flip-chip bonding interconnection.
2006-01-25	Flip-Stack packaging supports wirebond-to-flip-chip transition Amkor announced the Flip-Stack package solution that is specifically designed to support emerging transition from wirebond to flip chip interconnect for high-performance DSPs, ASICs and RF chips.
2013-03-07	Flip-chip platform to lift wafer shipments Yole Développement expects a threefold growth for the flip-chip platform to reach over 40 million 12" equivalent wafer start per year by 2018.
2009-06-16	Flip-Chip 300?m recommendations for audio power amplifier This application note describes the Flip-Chip CSP features and species how ST's customers can use them.
2011-03-10	Flip chip packaging boasts 40% lower cost STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes.
2009-03-18	FCI, SMIC: new 300mm flip chip allies FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging.
2001-04-19	Epoxy die attachment for GaAs flip-chip devices This application note outlines the epoxy die attach process outlined for Alpha Industries' GaAs flip-chip devices.
2002-10-24	Epoxy die attachment for GaAs flip-chip devices This application note discusses the process of attaching epoxy die for GaAs flip-chip devices.
2000-07-01	Controlling process parameters for flip-chip underfill With new substrates adding new challenges to the flip-chip technology, engineers must tackle the difference in TCE between the die and the substrate in order to avoid the fracturing of outermost connectors during thermal cycling.