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2007-07-24 Keithley, French lab enter nanotech testing pact
Keithley has agreed to jointly develop advanced nanotechnology and chip materials testing technology with France's CEA Leti Laboratory
2009-11-23 Intel, French R&D orgs set up computing center
Intel will support the Exascale Computing Research Center with a multi-million Euro investment over a three-year period.
2009-10-01 French solar market gets partnership, VC boost
Several initiatives have emerged to foster solar energy in France from energy companies, solar cell manufacturer, material and equipment supplier, academic research and VC firms
2004-07-08 French groups combine for opto, semis research
French telecoms to defense groups Alcatel and Thales have formed a joint research laboratory that will focus on optoelectronic and semiconductors devices based on III-V process technologies
2012-10-04 French company plans 1024 high-end DSP cores on single die
Kalray has recently sampled a Purpose Processor Array MPPA-256 processor integrates 256 processors onto a single silicon chip and is planning a 1024 processor version.
2013-10-07 Fraunhofer team finds way to mass produce lab-on-chips
LOCs, or pocket labs, can automatically perform a complete analysis of even the tiniest liquid samples, integrating all the required functions onto a chip that's just a few centimeters long.
2003-07-11 Altis' MRAM project gets French government backing
Boosted by a $28.3M financial windfall from the French and local governments, Altis Semiconductor reaffirmed expectations that it would be among the first companies to bring MRAM from the lab to full-scale production.
2009-10-12 NTU, CRNS, Thales set up nanotech lab in Singapore
The alliance known as the CNRS International-NTU-Thales Research Alliance (CINTRA) will set up a joint laboratory at NTU's Research Techno Plaza.
2008-07-08 Alcatel-Lucent, INRIA open R&D lab for future networks
Alcatel-Lucent and The French National Institute for Research in Computer Science and Control have opened their joint research laboratory for next-generation networks
2002-06-19 TRONIC'S Microsystems, CEA form MEMS R&D alliance
TRONIC'S Microsystems, a MEMS foundry in France, and the CEA Laboratory for Electronic and Information Technologies of the French Atomic Energy Commission, a major European R&D lab in the MEMS field, have signed a three-year R&D contract.
2008-06-05 ST, CEA concoct tiny fuel cell for wireless phones
Tapping miniaturized energy sources, the French Atomic Energy Agency and STMicroelectronics NV created a hydrogen fuel cell for mobile phones that is expected to reduce the use of electrical power supplies to recharge batteries
2013-04-22 Record operating range at 880m by single impulse radio chip
French fabless BeSpoon and the CEA-Leti research institute demonstrated an impulse radio ultra-wideband IC able to measure distances to within centimetres at a range of kilometres
2009-03-09 Intel invests in high-performance computing R&D
Intel Corp. is investing in a new academic research facility dedicated to high-performance computing (HPC) in France, marking the start of a five-year collaboration and is the company's first major investment in academic research in France
2005-08-05 Alcatel, Amdocs to team on IPTV
France-based telecom supplier Alcatel and software and services supplier Amdocs are teaming on a platform solution to help communications service providers deploy Internet Protocol or IP-based television (IPTV) and other next generation broadband IP services
2004-04-23 VLSI papers weigh 65nm, new circuits
While technologists look to 65-nanometer nodes, circuit designers by and large are two generations back.
2005-09-21 TSMC promises MEMS platform in '06
After three years of research and development, foundry Taiwan Semiconductor Manufacturing Co. believes 2006 will be the year it begins to see results from its efforts to merge IC process technology with microelectromechanical systems (MEMS).
2008-02-22 TES expands multimedia workforce in India
TES is increasing its embedded hardware, software and system design team in India from the current 50 engineers to over 100 in over the next six months.
2008-04-21 Teramobile laser triggers lightning strikes
Scientists have triggered lightning strikes using a Teramobile laser. The goal is to create miles-long plasma filaments that will extend from clouds to the ground, providing an economical conduit to channel surefire strikes for the purpose of studying lightning's mechanisms and its effects on infrastructure.
2002-08-12 Taiwan prepares for MEMS technology battle
Taiwan is looking to repeat its success with semiconductors by tackling both the design and manufacture of microelectromechanical systems.
2002-11-11 STMicro shows dual-function DNA analysis chip
STMicroelectronics demonstrated a dual-function microfluidic chip that can both amplify DNA and analyze the results of system reaction.
2013-05-09 Solliance reveals earth-friendly OPV production
The research initiative achieved a world first with an inkjet printing process for manufacturing environmentally friendly OPV cells that deliver benchmark efficiency.
2008-10-16 Setting the stage for 3DTV
Stereoscopic 3DTV could be the next home entertainment blockbuster, the logical sequel to today's high-definition flat-screen TVs. But the path to 3DTV winds through more twists and turns than the road to the Emerald City, passing through forests of alternative file formats, compression schemes, display technologies and patents.
2008-07-01 Roadrunner strives to lead supercomputer race
IBM Corp.'s Roadrunner will go down in history as the first computer to consistently crank out 1 petaflops.
2005-06-27 Philips Semiconductors CEO sets out platform for the future
Six months after taking charge of Philips Semiconductors as President and CEO, Frans van Houten, has survived the inaugural phase of his leadership with a smile.
2004-05-13 Nortel enters edge router sector
Nortel is ready to battle Cisco, Alcatel, Juniper and Laurel on the metro edge with the release of a MPLS edge router that provides switching capabilities.
2014-04-25 Nexeon scales up annual cell production capacity to 20t
The company's recently built process development and manufacturing facility in Oxfordshire deploys a modular process design to produce new materials for Li-ion cells, and to optimise it for commercial adoption.
2006-03-16 Mobile TV may not yet be ready for prime time
Receiver suppliers face a number of challenges in bringing mobile TV to the real world, including meeting the the Mobile and Portable DVB-T Radio Access Interface.
2002-10-08 Mitsubishi Electric supports G.729 Consortium
Mitsubishi Electric Corp. has joined the G.729 Consortium, an association that gathers IP rights of major players in the telecommunication industry.
2007-04-16 Making MEMS the new 'mouse'
This article features ST's MEMS Product Division General Manager Benedetto Vigna, who views MEMS as the new 'mouse.' ST first ventured into developing MEMS in 2001. Last year, the company inaugurated a 200mm semiconductor wafer fabrication line dedicated to MEMS devices.
2009-02-24 LTE: Up for a test
Long Term Evolution is the next big thing in mobile wireless broadband, but design engineers working on LTE, as well as the more mature WiMAX, have their work cut out for them in testing devices and infrastructure.
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