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2013-06-06 Windows RT 8.1 devices to run on Snapdragon 800 processors
Qualcomm promises high performance, low power and integrated 3G/4G LTE with the latest Snapdragon 800 processors geared for Windows RT 8.1 tablets, convertibles and notebooks.
2008-07-04 WiMAX, 3G drive India wireless market growth
India's wireless market is up for a big change with the launch of WiMAX and 3G services, along with industry consolidation in 2009.
2012-02-07 Wilocity to roll multigigabit tech
According to the company, its technology will enable users to connect at whatever band that is offering the best available performance while delivering multigigabit data rates at 60GHz.
2009-09-25 Will IC market recovery continue until Q4?
The IC market may be recovering but will there be a sustained uptick or another dip, especially in the Q4 09?
2007-04-02 Wi-Fi/Bluetooth combos flood market
Wireless chipmakers have unleashed a barrage of similar-sounding products for cellular handsets that offer simultaneous support for Bluetooth and WLANs.
2007-02-14 Wi-Fi/Bluetooth combos continue to spread
In the days leading up to the 3GSM World Congress, wireless chip makers unleashed a barrage of similar-sounding products for cellular handsets that offer simultaneous support for Bluetooth and WLANs.
2010-04-16 When will memristors be ready for prime time?
While memristors represent a potential revolution in electronic-circuit theory akin to the invention of the transistor, it will take a killer application to get it off the ground.
2010-01-04 What's the next big application?
Here's a list of the 10 technology applications to watch for in 2010, examining examine the features that make them so compelling as well unresolved issues that might keep them from breaking out.
2009-05-20 What went wrong with MIPS-Chipidea merger?
Most mergers and acquisitions rarely work. When they do, it's because both parties have time, patience, commitment and money to burn in the process of integrating the two organizations. An examination of the recent MIPS Technologies-Chipidea breakup strongly suggests that neither one had sufficient amounts of these key attributes.
2015-01-12 Weighing in on predictive analytics: Drawbacks and challenges
Although only 13 per cent of 250 executives surveyed by Accenture said they use big data for predictive purposes, as many as 88 per cent said big data analytics is a top priority for their company.
2014-10-27 Wearables in enterprises: Good, bad, inevitable
Innovations are expected to happen first in the enterprise, with the first wave of employees to use them include technicians, doctors, police and construction workers. However, chief information officers should brace themselves for security and integration challenges.
2002-03-06 VSIA takes hard look at embedded software reuse
The Virtual Socket Interface Alliance has set up a development working group to create standards for the reuse of embedded software, in a bid to address what may be the next big challenge in SoC design.
2004-06-09 Verisity eyes 10x verification boost with VPA
Verisity hopes to address the growing complexity in IC development with a series of applications for both engineering-level and project-level problems.
2016-04-29 UMC to get back on its feet by 2016
The company expects its wafer output to rise by about 5% during the quarter while its utilisation rate will rise to the "high 80% range" from 83% last year.
2011-11-10 Tussle for cloud dominance pushes on
Competition among various platforms in cloud computing and applications, as well as mobile technologies and IOT, will heat up until next year.
2007-04-25 TSMC's IP moves stir up concern among providers
TSMC's move to broaden its portfolios of internally developed semiconductor IP and third-party IP has some observers asking whether the company is migrating to a more ASIC-like business model.
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2008-11-19 TSMC ramps 40nm volume production
TSMC Ltd. has announced the volume production of the first semiconductor foundry 40nm logic manufacturing process with the successful ramp of its 40nm General Purpose (G) and Low Power (LP) versions.
2009-08-19 Trade group remains dubious of Taiwan DRAM plans
Despite the launch of Taiwan Memory Co. (TMC) and its subsequent investment in Japan's Elpida Memory, broader issues of consolidation and high levels of debt among Taiwan's DRAM players remain unresolved.
2009-03-18 Toward a greener IT landscape in Asia
Environmental protection is somewhat more complex than the old "3Rs" rule of "Reduce, Reuse, Recycle," and IT firms and Asian governments have major roles to play to provide a greener Asia.
2009-01-09 Tough '09 awaits fab-tool, materials sector
Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009. And don't expect the market to improve, prompting the possible acceleration of a shake-out in the sector.
2009-02-25 Touch controller runs on all-digital process
Fujitsu Microelectronics America has begun distribution FMA1127 flexible touch sensor controller that converts capacitance generated by the human body and conductive touch pad to digital data with no analog processing.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2006-08-01 Tool startups bet on autonomy
Two analog/mixed-signal design automation startups recently stepped into public view, chasing a goal that has eluded most of their predecessors: building a viable, independent company that doesn't fold or end up being acquired.
2003-06-02 Tool analyzes power dynamically, at cell level
Apache launched its 2nd product designed for power analysis, the RedHawk-SDL.
2008-03-26 TMSC unveils 40nm 'half-node' step to 32nm
TSMC has unveiled an interim, 'half-node' step toward 32nm, which the foundry giant expects to ramp starting late next year.
2014-11-07 TI expands presence in China with 300mm bumping facility
The company's new 300mm wafer bumping facility will rise in a second shell that came with the Chengdu site TI purchased back in 2010. The facility is scheduled to begin production in early 2016.
2011-04-06 TI buys National Semiconductor
TI has signed a merger agreement to procure National Semi for $6.5 billion in cash.
2004-01-26 TI builds 1GHz DSP in 90nm process
Setting marks in DSP speed and process geometry, Texas Instruments Inc. (TI) is sampling a 1GHz device built in a 90nm process.
2008-06-13 The truth behind the 'Xbox 360 issue'
When Microsoft announced a mammoth global recall of its Xbox 360 a year ago, the software giant never disclosed the exact source of the game console's heat problem that led to the fiasco, but recently it was revealed.
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