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2003-12-10 Tower Semiconductor standardizes on TriCN interface IP
IC wafer-manufacturing foundry Tower Semiconductor has selected TriCN's base I/O library and a suite of interface IP for use in their 0.18&3181;m process. Tower will make this IP available to customers designing high-performance chips for production at its Fab 2 facility.
2005-04-15 Tower Semi debuts 0.18- and 0.13-?m libraries
Pure-play independent specialty foundry Tower Semiconductor announced the introduction of its in-house set of 0.18?m and 0.13?m design libraries.
2002-12-19 Tower Semi adopts Artisan design platforms
Chipmaker Tower Semiconductor Ltd has enhanced its Fab 2 IP portfolio by licensing design platforms from Artisan Components Inc.
2015-03-24 Top 5 problems with programmable logic controllers
PLC's duties are crucial for complex processes. However, like most things in life, they can be both advantageous and disadvantageous. Read this article to discover what can possibly go wrong.
2010-09-03 Tool suite eases deployment of virtual servers
The management suite lets VMware users configure Exar's I/O virtualization features for fast and easy deployment and management of virtual servers.
2003-04-16 Too many specifications confuse server design
There seem to be more "industry-standard" technologies available than ever before for connecting together server sub-systems, but many of these technologies overlap.
2008-07-30 Tiny DC/DC converters render easy scalability
Aimtec has added a 3W line of single and dual output DC/DC converters to its low output power AMxG-Z family, which is housed in a compact SIP8 package for easy scalability.
2007-07-06 TI: HDQ communication basics
This report compares the communication timing specifications for the different battery gas gauge and battery monitor products.
2011-07-13 Thunderbolt lacks efficacy to oust USB
Thunderbolt provides attractive prospects but there are serious technical and economic disadvantages that should be checked.
2007-10-16 The challenges and potential of GPIB
GPIB continues to serve as a reliable I/O interface for a vast number of instruments that are still in use. GPIB also provides a convenient way to manage complex hardware handshaking.
2005-01-03 Test experts ponder cost of defects
Is 100 DPPM too tough to be practical for designs in 100nm or finer processes?
2010-11-04 Test dev software, PXI, FPGA products launched
Geotest updates ATEasy and launches new PXI digital & FGPA products.
2008-10-06 Temperature, voltage, and current calibration in Fusion FPGAs
Actel Fusion mixed-signal FPGAs integrate configurable analog features, including I/Os, prescalers, lowpass filters, and an ADC, enabling customers to perform temperature, voltage, and current measurements in their applications.
2006-01-01 Taiwan design house innovates to succeed
Design houses have to face important challenges by being more innovative and not "one-hit-wonders" in the electronics design arena.
2007-03-12 Synthesizable CIO DDR RLDRAM II controller for Virtex-4 FPGAs
This application note describes how to use a Virtex-4 device to interface to Common I/O (CIO) Double Data Rate (DDR) Reduced Latency DRAM (RLDRAM II) devices. The reference design targets two CIO DDR RLDRAM II devices at a clock rate of 200/235MHz with data transfers at 400/470Mbps per pin.
2010-10-11 Switch advances SRIO ecosystem
Integrated Device Technology reports on the adoption of its Serial RapidIO Gen2 switch for applications in wireless baseband, semiconductor processing, medical imaging, and radar and sonar markets.
2009-02-20 STMPE2401 GPIO port expander hardware interface guide
STMPE2401 is the first in STMicroelectronics' family of I/O port expanders. This application note deals with the setup and hardware interfacing of STMicroelectronics' STMPE2401 to perform various functions and the different modes for reducing power consumption.
2004-09-16 Start thinking out of known 'design box'
Package is not simple anymore: IC and package have become a whole and must be treated as such.
2004-11-01 Standard interface eases partitioning
Engineers opt for smart partitioning in wireless systems instead of integrating all components into a single system chip.
2006-07-17 ST unveils NOR Flash memory solutions for mobile apps
STMicroelectronics has introduced a high-frequency step-down DC/DC converter particularly suited for use in data-storage applications and portable devices.
2012-12-13 ST ready to roll out 28nm FDSOI
ST boasted that the FDSOI planar process holds advantages over other manufacturing process variants in terms of trade-offs between performance, power consumption and manufacturability.
2005-05-30 SST discloses flash memory support for Intel chipsets
Silicon Storage Technology Inc. (SST) announced a serial flash memory support of Intel Corp.'s latest Intel 82573E LAN chipset featuring Intel Active Management Technology (Intel AMT), and Intel 945 Express chipset family with Intel 82801GB and 82801GR I/O Controller Hub.
2003-08-01 Specification targets clock distribution
Multipoint low-voltage differential signaling technology will fill this need to support clock distribution for future infrastructure equipment.
2003-06-19 Sony, SanDisk move closer on Memory Stick
Sony Corp. and SanDisk Corp. announced an expanded cross licensing agreement that will make SanDisk the first full partner in Sony's Memory Stick business.
2002-06-28 SONET rate conversion in Virtex-II Pro devices
This application note targets Virtex-II Pro designs that require the direct use of Rocket I/O transceivers in 16-bit mode.
2005-07-01 Software unsnarls embedded connections
Network links and other smart interfaces are changing the face of embedded systems design.
2006-03-07 Slim connector provides dual capability
Designed for panel applications, the Slim I/O cable connector from Tyco Electronics provides power and/or signal I/O capability for short and long-reach cable.
2002-12-02 Simulation takes off with hardware
This article talks about how simulation can help develop firmware in advance for a safe and successful integration
2002-06-11 Silterra launches IP initiative
Silterra Malaysia Sdn Bhd has launched a silicon intellectual property initiative.
2004-09-01 Signal integrity issues rise with 500Mbps rates
SoC designs with data transfer rates beyond 500Mbps fall in a gap between traditional design methods and the proposed chip-package-virtual board co-design method.
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