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2006-02-15 Synopsys licenses IC package design tech to Sigrity
Sigrity announced the acquisition from Synopsys of a worldwide perpetual unrestricted license to advanced single- and multi-chip IC package design technology, including technology embodied in Synopsys' Encore products.
2011-11-14 RTL sol'n yields ultra low-power design
The RTL Power Model predicts IC power behavior at the RTL level with consideration for how the design is physically implemented
2003-03-28 IC, package co-design proving elusive, techies say
IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium on the Quality of Electronic Design.
2005-09-06 Extraction tool for package designs integrated with Allegro
Fluent has released the latest version of its Icemax circuit extraction tool for advanced IC package designs
2015-01-29 Design solutions accelerate design signoff, analysis
The Sigrity Parallel Computing 4-pack and the Sigrity System Explorer from Cadence claim to speed up product creation efficiency by improving signoff-level PCB extraction accuracy.
2002-05-16 Avant! partners with STMicro in IC, package design
Avant! Corp. has entered into a strategic technology alliance with STMicroelectronics to develop and deploy concurrent IC and package design and analysis capability.
2010-04-16 Verify your PCB/IC thermal modeling
Shown here is a relatively easy way to determine if the design is the best it can be, thermally speaking, without cumbersome or time-consuming methods or expensive software analysis
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed
2000-02-29 The PowerPAD Thermally Enhanced Package
The package provides greater design flexibility and thermal efficiency in a standard size IC package. This application note focuses on the specifics of integrating a PowerPAD package into PCB design.
2012-09-21 The golden age of simulation-driven design
Find out what it takes to design for reliability nowadays
2004-09-16 Start thinking out of known 'design box
Package is not simple anymore: IC and package have become a whole and must be treated as such
2003-05-15 Silicon foundry speeds up design cycle with Agilent services
1st Silicon Sdn. Bhd. of Malaysia has selected Agilent Technologies Inc.'s mixed-signal semiconductor device modeling services to support its mixed-signal processes.
2006-10-26 Sigrity unveils new IC package characterization suite
Promising a new suite of tools that will enable 'fast, easy, accurate and complete' IC package characterization, Sigrity Inc. this week is releasing its SpeedPKG Suite
2004-12-01 Scan design called portal for hackers
Any chip that uses scan designand any system built around it--may be vulnerable to hackers
2012-09-17 QFN package design kit for ADS launched by STATS ChipPAC
The QFN package design kit enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation software for radio frequency
2014-06-10 Path Finder streamlines IC packaging across multiple PCBs
The suite features a path-finding methodology that automates optimisation and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms.
2013-02-19 Paper tackles 3D IC temperature solutions
The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation
2007-08-01 Overcome high-speed FPGA design challenges
When using high-speed FPGAs in a design, it is important to consider several design issues both before and during board development
2007-09-14 MediaTek, Apache take on 65/45nm design challenges
Apache Design Solutions announced that MediaTek has selected Apache as their EDA partner for addressing 65- and 45nm physical design challenges
2012-06-04 LED micro-module drivers ease lighting design
Texas Instruments' 450mA TPS92550 and TPS92551 DC/DC LED driver modules incorporate all the required power and passive circuitry into a single IC package to deliver up to 23W of power to the LED
2005-06-17 InCyte add-on spells out IC costs
A comprehensive IC economic analysis engine, designed to determine final chip cost, is the latest upgrade to InCyte, a chip estimation tool from Giga Scale Integration
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2005-02-16 Harvard Thermal tool integrates with Cadence package designer
Harvard Thermal announced the direct integration of Package Thermal Designer V2.0 with Allegro Package Designer from Cadence
2003-12-26 Greek EDA startup offers RF design tool
Helic SA has launched an inductance-modeling tool that the company says will slash development costs for wireless transceiver designs.
2006-06-01 Give PCB computer-aided design its due
PCB CAD gets no respect. With about 12 percent of overall EDA industry revenue, it is marked by sluggish growth, little or no startup activity and few announcements of new technology.
1999-10-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
1999-09-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
2014-12-22 Experimental methods for PCB design and manufacturing
EMS providers are being called upon to take on the task of design of experiments, also known as experimental designs, requiring them to work with OEMS to do the necessary research and development
2005-03-16 Design-for-manufacturability a must
Detailed processes and material-property characterization done early in the design phase can save cost and time in the manufacturing stage
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