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2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2010-04-16 Verify your PCB/IC thermal modeling
Shown here is a relatively easy way to determine if the design is the best it can be, thermally speaking, without cumbersome or time-consuming methods or expensive software analysis.
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2004-07-01 Tool analyzes power across IC, package
Sigrity's XcitePI simulates power grids on the package plane to examine power integrity issues occurring between ICs and packages
2005-10-10 Tiny package meets random number generation needs
Japan-based FDK Corp. announced it would in November introduce a IC package for random physical number generation that occupies 69 percent of the mounting area of the standard RPG100 package.
2000-02-29 The PowerPAD Thermally Enhanced Package
The package provides greater design flexibility and thermal efficiency in a standard size IC package. This application note focuses on the specifics of integrating a PowerPAD package into PCB design.
2006-02-15 Synopsys licenses IC package design tech to Sigrity
Sigrity announced the acquisition from Synopsys of a worldwide perpetual unrestricted license to advanced single- and multi-chip IC package design technology, including technology embodied in Synopsys' Encore products.
2002-05-31 STATS PBGA package improves thermal performance
ST Assembly Test Services Ltd has introduced the Exposed Drop In Heat Spreader PBGA (XDPBGA) package that offers better thermal performance than traditional die-down packages
2002-08-26 STATS EBGA package offers more I/O
STATS Ltd. has launched the EBGA Multi-Tier package that offers higher I/O and multiple wire bonding zones for power, ground, and signal connection
2006-10-02 SMK makes IC sockets for game machines
SMK Corp. has released a new IC socket for SSOP or any high density mountable IC package typically used for internal mounting in game machines.
2006-10-26 Sigrity unveils new IC package characterization suite
Promising a new suite of tools that will enable 'fast, easy, accurate and complete' IC package characterization, Sigrity Inc. this week is releasing its SpeedPKG Suite.
2003-03-10 Sharp, Amkor to develop unified stacked package design
Sharp Corp. and Amkor Technology Inc. have agreed to unify the design for 3D system in package assembly that enables the stacking of very thin packages
2000-03-09 Quality and reliability engineering package certification
This application note is designed to provide a detailed description of the methods used to verify that the ?BGA package meets or exceeds the company's package certification Q&R requirements. Each test is described, and the results are presented
2002-04-17 Philips IC package is 75 percent smaller
2002-06-24 Philips IC package exhibits better thermal resistance
2002-10-24 Pericom pushes plastic package to replace SOT-23, SC-70
Pericom Semiconductor is offering 6- and 12-pin Thin, Fine Pitch, Dual-in-Line, and TDFN plastic packages to replace 6-pin SOT-23 and SC-70 packages.
2014-06-10 Path Finder streamlines IC packaging across multiple PCBs
The suite features a path-finding methodology that automates optimisation and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms.
2013-02-19 Paper tackles 3D IC temperature solutions
The methodology flow presented in the paper will demonstrate the link between the 3-D IC package thermal simulations with the system thermal simulation.
2004-04-28 Optimal design tools suit IC, packaging, PCB
Optimal has released its O-Wave series of products for 3D, full-wave signal integrity simulation, analysis and verification for high-speed IC, packaging and PCB
2001-04-20 Innovative mounting techniques enhance thermal performance of the surface-mount D3Pak Package
This application note is intended to compare the thermal performance of various mounting methods for the D3PAK including classic SMD PCB mounting, insulated metal substrate (IMS) mount down, etc.
2005-06-17 InCyte add-on spells out IC costs
A comprehensive IC economic analysis engine, designed to determine final chip cost, is the latest upgrade to InCyte, a chip estimation tool from Giga Scale Integration
2003-03-28 IC, package co-design proving elusive, techies say
IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium on the Quality of Electronic Design.
2005-02-16 Harvard Thermal tool integrates with Cadence package designer
Harvard Thermal announced the direct integration of Package Thermal Designer V2.0 with Allegro Package Designer from Cadence
1999-10-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
1999-09-01 Facing the challenges of advanced IC packages
This article chalks up the guidelines needed by IC, package, and board designers and engineers to bridge the gap between IC design, package design, package analysis, and board-level issues.
2005-09-06 Extraction tool for package designs integrated with Allegro
Fluent has released the latest version of its Icemax circuit extraction tool for advanced IC package designs.
2008-07-03 Confab stresses potential thermal crisis in IC design
At the Design Automation Conference in Anaheim, California, an educational panel addressed the thermal issue in IC design. Two key questions raised were when will this issue be emerging as a crucial concern? What are the solutions to solve this potential crisis
2008-08-27 Cadence tool steps up IC package, SiP designs
The release of SPB 16.2, due in November of this year, from Cadence Design Systems, delivers advanced IC package/system-in-package miniaturization, design cycle reduction and DFM-driven design, along with a new power integrity modeling solution.
2003-10-17 Cadence IC package, PCB design flow runs on Linux
Cadence Design Systems Inc. has announced what it claims is the industry's first complete front-to-back advanced IC package and PCB design flow to run on Linux.
2002-05-16 Avant! partners with STMicro in IC, package design
Avant! Corp. has entered into a strategic technology alliance with STMicroelectronics to develop and deploy concurrent IC and package design and analysis capability.
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