Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > IC packaging

IC packaging Search results

?
?
total search797 articles
2009-08-25 Vietnam IC manufacturing hits roadblocks
Vietnam has hit a few speed bumps along the road in its dreams to develop an IC manufacturing industry
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate.
2008-04-30 TSMC IC design collaboration strategy stirs controversy
TSMC has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
2004-01-23 Toshiba develops nine-layered packaging technology
Toshiba Corp. said it has developed a multichip package that can stack up to nine chips in its 1.4-mm high package.
2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed
2002-07-19 Tegal joins the IC packaging alliance
Tegal's membership is expected to strengthen APiA's position in the IC packaging and interconnect industry.
2002-11-28 Taiwan IC industry up by 40 percent in Q3
A TSIA survey showed that the total revenue of the domestic IC industry in Q3 of this year reached NT$161.6 billion ($4.63 billion), a 40 percent increase over Q3 of 2001
2006-05-03 Taiwan allows IC assemblers in China
The Taiwan government has reportedly relaxed the rules for Taiwanese IC-packaging and assembly houses to invest and set up shop in China.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2011-09-26 Specialized foundry processing yields high-performance analog IC
Learn about the impact of foundry process on achievable specifications.
2015-09-28 SiP, PVS tech enabled for TSMC InFO packaging
Cadence said the Allegro SiP design tools and PVS allow TSMC customers to cut the InFO design and verification cycle by offering an integrated solution that automates the design-rule checking (DRC) flow.
2007-01-16 QFN packaging guidelines for RF designers
It seems such an irrelevant detail, but the component package is a strong determinant factor over layout flexibility.
2002-10-07 Philips-Fairchild alliance to create packaging standard
Fairchild Semiconductor and Royal Philips Electronics have formed a working relationship to become a multi-source supplier for small-scale logic packaging
2002-04-17 Philips IC package is 75 percent smaller
null
2014-06-10 Path Finder streamlines IC packaging across multiple PCBs
The suite features a path-finding methodology that automates optimisation and connectivity from a chip through multiple packaging variables, while targeting multiple and different PCB platforms
2011-04-28 Packaging tool offers advanced miniaturization
Cadence has unveiled the Allegro 16.5 PCB and IC packaging technology, offering capabilities that increase both productivity and predictability across silicon, SoC and system development.
2006-11-13 Outsourced IC packaging to reach $13.1B
The market scale of outsourced IC packaging is estimated to hit $13.1 billion in 2006, with Taiwan gradually becoming a powerhouse in the test and packaging industry segment, according to Research and Markets.
2003-06-16 OSE, Winstek collaborate for high-end IC testing
Orient Semiconductor Electronics, an IC packaging and testing firm, has partnered with IC testing firm Winstek, to increase its testing capabilities.
2004-04-28 Optimal design tools suit IC, packaging, PCB
Optimal has released its O-Wave series of products for 3D, full-wave signal integrity simulation, analysis and verification for high-speed IC, packaging and PCB.
2011-05-10 Microchip acquires Thai IC-assembly firm
Microchip has decided to buy Millennium Microtech Thailand, a provider of assembly and test services for semiconductor manufacturers, instead of building its own IC-assembly plant
2012-04-10 MEMS packing leapfrogs IC packaging growth
The MEMS packaging market is growing twice as fast as the overall IC packaging market in terms of units shipped and is expected to grow at a CAGR of about 20 percent over the next five years.
2002-04-29 Maxwell IC packaging protects against nuclear radiation
Maxwell Technologies Inc. has announced the availability of the Xray-Pak packaging solution that is intended to shield ICs that process and store data in military satellites from the radiation effects of nuclear blasts
2009-08-18 Intel Vietnam IC-assembly ramp hits snags
It seems that chip giant Intel Corp. has pushed out the production schedule for its IC-packaging and test plant in Vietnam by three or so quarters due to some unforeseen snags.
2007-11-14 Infineon reveals new packaging technology
Infineon Technologies unveils a new package technology, and has tapped Advanced Semiconductor Engineering as its IC packaging partner.
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies.
2005-12-27 IC packaging providers upbeat
Continued strength in the IC packaging and test sector during the fourth quarter and possibly beyond has prompted an investment banking firm to raise its estimates for Amkor, Siliconware and STATS ChipPAC.
2009-10-23 IC packaging becomes more challenging
Analog design remains challenging but IC packaging is becoming an issue in the arena.
2005-07-08 IC packaging and testing companies expect high revenues in Q3
Most IC packaging and testing companies in Taiwan are anticipating significantly higher revenues in the second half of the year, as increasing demand has shown signs of market potential in June.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top