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total search942 articles
2005-03-18 Wafer tester monitors RF chip quality in realtime
Keithley Instruments is now introducing a third-generation on-wafer RF measurement capability with some very promising features that address the conundrum
2004-06-23 SI Semiconductor IC wafer park to open soon
SI Semiconductor Co. Ltd's 5-inch power IC wafer production park, located in the Baolong Industrial Park in Shanghai China, will open soon.
2007-11-19 Report: Foundry wafer starts fly high in Q3
A new report from SICAS found that foundry wafer starts increased 13.3 percent in Q3 from the previous quarter, and 19.1 percent compared with the same quarter in 2006
2015-07-07 Powerchip to build display, sensor IC fab in China
The total investment is estimated at $2.2 billion with the fab scheduled for completion in 2018-2019 and a manufacturing capacity of 40,000 wafer starts per month, with support from Hefei Construction
2006-11-13 Outsourced IC packaging to reach $13.1B
The market scale of outsourced IC packaging is estimated to hit $13.1 billion in 2006, with Taiwan gradually becoming a powerhouse in the test and packaging industry segment, according to Research and Markets
2010-03-03 NXP mulls turning wafer fab to solar facility
NXP BV is in talks on the possibility of converting a 6-inch wafer fab at Nijmegen, The Netherlands, to solar cell manufacture
2010-07-13 EVG, IME join hands on 3D IC integration
EV Group and Singapore's Institute of Microelectronics (IME) signed a two-year agreement to cooperate on developing 3D IC integration technologies
2014-01-29 Cost-efficient 3D IC wafer processing without adhesives
AML showcased a unique solution to get rid of the adhesive and to allow for a vacuum to be created between the carrier and the wafer to be processed in 3D IC production.
2002-04-08 China's IC swagger on display in Shanghai
The huge commercial potential of China's IC market was reflected in the bustle of this year's Semicon China exhibition, where China's chip makers and government officials showcased the industry's rapid ascent from back-end operation to what many predict will become an emerging semiconductor power over the next decade
2008-07-24 Analyst sees glory days ahead for IC market
Malcolm Penn, founder and principal analyst, Future Horizons Ltd, believes the market forces are at last moving into place to deliver a couple of years of booming growth for the IC industry
2007-07-12 Anadigics sets up GaAs wafer fab in China
Anadigics Inc. broke ground for construction of a new 6-inch GaAs IC wafer fab in the Kunshan New and Hi-Tech Industrial Development Zone in China.
2013-09-04 AMS spends $33 million for analogue 3D IC production facility
AMS investment aims to increase production capacity in response to a surge in demand outlook for ICs fabricated with 3D IC integration technology
2013-10-24 Xilinx, TSMC announce CoWoS 3D IC volume production
The programmable Virtex-7 HT family claims to be the industry's first heterogeneous 3D ICs in production that feature up to sixteen, 28Gb/s and seventyCtwo, 13.1Gb/s transceivers.
2004-05-06 Winbond plans 300mm wafer fab in 2005
Looking to ride a recovery in the semiconductor market, Winbond Electronics Corp. is putting into motion plans for a long-awaited 300mm wafer fab that will come on line in late 2005
2009-09-25 Will IC market recovery continue until Q4
The IC market may be recovering but will there be a sustained uptick or another dip, especially in the Q4 09
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field.
2008-01-14 Wafer probe stations cut cost in 45nm node
Cascade Microtech has launched the next step in 300mm wafer probe stations designed to meet the need for advanced on-wafer measurements for semiconductor devices
2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2014-10-10 Wafer foundry market teeters on edge of growth
The market's growth has fluctuated between a high of 39.4 per cent in 2010 and a low of 6.8 per cent in 2013, due mainly to the differentiation in wafer foundry industry
2012-02-17 Wafer fab shut downs on the rise
Suppliers closed or upgraded their fabs that were manufacturing using smaller wafers and shifted operations to produce more cost-effectively on larger wafers.
2015-07-13 Wafer fab closures projected to grow in the coming years
Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009 and more recently, ProMOS and Powerchip closed 300mm wafer fabs in 2013
2010-04-15 VLSI sees IC shortage, inventory growth
The semiconductor industry is recovering but there are signs of growing chip inventories in the channels, according to VLSI Research Inc.
2012-12-21 UMC touts 55nm display driver IC process
The 55nm SDDI process claims to feature an ultra-small SRAM size and provides an ideal balance of power consumption, performance and chip size for integration into high-end Full-HD smartphones.
2009-01-19 Ultrathin wafer bonding system installed in Taiwan lab
EV Group (EVG) has installed an EVG 500 series wafer-bonding system at Brewer Science Inc.'s Taiwan applications lab
2013-10-11 TU Delft, Imec co-author test flow for 3D IC optimisation
3D-COSTAR aims to optimise the test flow of 3D stacked ICs by compiling the yields and costs of design, manufacturing packaging and logistics.
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate
2009-12-04 TSMC launches auto-grade IC manufacturing spec
The automotive process qualification specification was first proposed at the Automotive Electronic Council in 2008.
2008-04-30 TSMC IC design collaboration strategy stirs controversy
TSMC has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2005-04-05 TSMC expects higher wafer shipments next quarter
Due to the growing demand for LCD driver ICs, Taiwan Semiconductor Mfg Co. (TSMC) expects its semiconductor shipment to grow significantly next quarter.
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