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2002-08-20 Solicore, ICP to jointly make power products
Solicore Inc. and ICP Global Technologies have signed an agreement to jointly develop and market a range of solar energy products for consumer and industrial applications.
2002-10-03 Solicore, ICP end development pact
Solicore Inc. has ended a joint development agreement with solar energy products manufacturer ICP Global Technologies.
2002-02-04 Rainbow to provide crypto accelerator to ICP on OEM basis
Rainbow eSecurity Inc. has revealed that its Taiwan office will OEM the company's FastMAP cryptographic acceleration chip to ICP Electronics, a Taiwan-based industrial computer manufacturer.
2002-01-03 ICP SBC houses Pentium 4 CPU, Intel 845 chipset, SiS315 graphics IC
The ROCKY-4782E2V is a Pentium 4-class single-board computer (SBC) that supports Socket 478 Pentium 4 processors and Intel 845 chipset.
2002-04-26 ICP licenses ARM922T for industrial PC applications
Taiwan-based ICP Electronics Inc. has licensed ARM922T microprocessor core for its SoCs used in industrial applications.
2004-06-18 How to use the LPC900 in-circuit programming (ICP)
This app note gives an overview of how the in circuit programming on the P89LPC9xx can be done.
2001-10-11 Depth profiling of materials and coatings by laser ablation ICP-MS
This application note discusses the use of the CETAC LSX-200 Plus Laser Ablation System to provide an effective tool for depth profile analysis of materials and coatings.
2005-04-21 Rapid control development tool simplifies system modeling
Tailored to reduce the time and cost of model and controller development in aerospace and automotive apps, Maplesoft has developed the intelligent controller parameterization for the Maple suite of rapid control development tools.
2002-03-15 Inova 6U SBC integrates Pentium III
The ICP-PIII-6U CompactPCI SBC features a Pentium III processor and a 21554 non-transparent PCI-PCI bridge, and is designed for use in embedded systems, industrial automation, military, medical, robotics, and multiprocessing applications.
2006-12-07 Electronic polymer market to grow by 14.5% until 2008
Global demand for conductive electronic polymer products will expand by 14.5 percent per year until 2008, reported Frost & Sullivan.
2003-12-18 Mattson equips Trecenti 300 mm fab
Mattson Technology Inc., a supplier of advanced process equipment used to manufacture semiconductors, announced that it has installed its 300 mm Aspen III ICP Strip at Trecenti Technologies' 300 mm chip manufacturing facility in Hitachinaka, Japan, where several Aspen III systems are already installed. The Aspen III Strip system is being used for the production of Trecenti's most advanced 130nm logic devices.
2016-03-09 Corial touts novel etching process for device deprocessing
In the failure analysis flow, the Corial 200I ICP system features etching processes targeted specifically at deprocessing of electronic devices down to 20nm.
2004-04-28 Zymet rolls out silica-filled encapsulant
Zymet has developed a new reworkable BGA underfill encapsulant that is a silica-filled version of its earlier CN-1432.
2006-02-02 Yokogawa Analytical Systems now wholly owned by Agilent
Agilent Technologies and Yokogawa Electric announced that their joint venture, Yokogawa Analytical Systems, is now a wholly owned Agilent subsidiary.
2006-04-21 Wealth Metal preps for RoHS compliance
Expecting a consistent rise in the market for electric audio and power jacks, Wealth Metal Fty Ltd ensures that all its products comply with overseas export standards.
2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2004-09-24 Vishay resistor chips in new cases0402, 0603, 0502
Vishay Intertechnology released its E/H MIL-qualified resistor chips in three new sizes (0402, 0603 and 0502 cases).
1999-09-01 Using sockets and adapters with BGAs
BGA sockets and adapters are being purchased by chipmakers in various Asian countries for debugging and testing production models of motherboards. Their low profile designs and optional heat sinks allow them to compete with direct attach methods.
2001-06-16 UltraVia thin-film substrate for advanced BGA apps
A reliable high-routing-density substrate is needed to meet future market requirements. Thin-film build-up substrates offer unique advantages.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm.
2002-11-08 TO-92 Packing Options/Ordering Instructions
This application note describes the two packing/shipping methods of the TO-92 axial leaded flat index package.
2002-11-08 TO 220 Leadbend Options
This application note discusses the TO-220 package designed with exposed heat sink for efficient heat dissipation.
2001-10-01 Thin-film process enables low-cost MCPs
This technical article describes a low-cost multi-chip packaging (MCP) technique with appropriate expansion that triples volume capacities.
2001-01-01 Thick photoresist patterning for WLP applications
Solder bumps, gold bumps, copper posts and copper wires for redistribution in wafer-level chip-size packaging require a resist mold that is later electroplated to form the final metal structures in advanced interconnect technologies.
2003-10-03 Thermal Considerations for PAs
This application note describes the thermal considerations for ANADIGICS power amplifiers.
2004-11-09 The subsidiary will operate as the China business hub engaging in development, manufacturing, sales and after-sales service of SII NanoTechnology's analysis and measurement instruments.
SII NanoTechnology Inc. has established SII NanoTechnology (Shanghai) Inc.
2000-02-29 The PowerPAD Thermally Enhanced Package
The package provides greater design flexibility and thermal efficiency in a standard size IC package. This application note focuses on the specifics of integrating a PowerPAD package into PCB design.
2001-06-01 The new century of high-density functional circuits
With every "electronic" product getting smaller and more powerful, manufacturing will need more innovation, denser interconnect schemes and better tools to meet the challenges ahead.
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
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