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2002-02-07 Taiwan strikes out again at ISSCC
Organizers of the International Solid-State Circuits Conference are trying to figure out why papers from universities and companies in Taiwan were shut out of the conference for a fifth straight year.
2012-11-21 Samsung to debut ARM-based SoC at ISSCC
Several major new microprocessors will be showcased at next year's International Solid-State Circuits Conference. Samsung's SoC using ARM A15 and A7 cores and Renesas' 28nm integrated handset SoC are some of the expected unveilings.
2012-11-21 Memory to make a splash at ISSCC 2013
Non-traditional memory architectures could steal the show from more structured analytical papers to be presented at the International Solid State Circuits Conference.
2016-03-11 ISSCC: RF CMOS on the edge of transceiver chain
At the ISCC, Steve Ohr finds that what has happened is not a replacement of GaAs power amps by RF CMOS amps. The RF power amp function is performed at the edge of a radio transceiver chain.
2012-02-24 ISSCC witnesses first terahertz CMOS
Researchers from the University of Texas have integrated a terahertz imager on-a-chip by fabricating high-speed Schottky diodes in CMOS.
2008-11-27 ISSCC to unravel next-gen cellphones
The International Solid State Circuits Conference slated on February 2009 is expected to demonstrate future concepts of cellphones such as ones with 32Gbit of flash capable of playing high-definition video ranging across networks from the oldest GSM to the latest 3G.
2015-11-17 ISSCC to see advancements in vision processors, 3D chips
Samsung is set to unveil its 10nm process technology and enhancements in its SRAM, DRAM and flash technologies while Mediatek will showcase a 10-core CPU, featuring three ARMv8a CPU clusters.
2010-11-25 ISSCC highlights emerging technologies
The 2011 International Solid State Circuits Conference has accepted 211 papers, including a sleep monitoring system, a two-dimensional wideband antenna array for 3D imaging, and an AC power meter.
2010-02-10 Intel, AMD techs go head-to-head at ISSCC
Intel Corp. is holding a significant, if temporary, edge over archrival Advanced Micro Devices based on news and papers emerging at the International Solid State Circuits Conference (ISSCC).
2010-02-18 Editors list ISSCC surprises
The focus on power management, lack of papers on nanotechnology and software and slow recovery of attendance were among the surprises for EE Times editors at the 2010 ISSCC.
2011-02-28 DRAM, CPU built on organic substrates shown at ISSCC
Organic innovations include an 8bit processor handling up to six instructions per second in an averaging routine, a 64bit organic DRAM and a technique for printing CMOS structures on plastic substrate.
2002-02-12 Commercial drumbeat resonates at ISSCC
Even as technologists dazzled the International Solid-State Circuits Conference with presentations claiming to blow past worries about the future of CMOS, many of the engineers who gathered here last week seemed more preoccupied with the commercial viability of those advances than their technical bravura.
2009-02-16 At ISSCC, transceivers reach giga-heights
Researchers pushed wireless transceivers to new giga-heights at the International Solid State Circuits Conference (ISSCC), with Fujitsu describing what it claimed was the world's first working 77GHz, and an NEC researching discussing UWB device capable of 2.88Gbit/s data rate.
2009-02-13 40G building blocks showcased at ISSCC
Engineers showed progress pulling transceivers and other building blocks for 40Gbit/s networking into CMOS at the International Solid State Circuits Conference (ISSCC).
2002-02-07 Toshiba, Samsung show 1Gb Flash designs
Serial Flash reached the gigabit density at the International Solid-State Circuits Conference, where Toshiba Corp. and Samsung Electronics Co. Ltd each described 1Gb NAND Flash designs on Monday (Feb. 4).
2002-02-11 Toshiba cuts capacitor from DRAM cell design
Toshiba Corp. has developed a one-transistor, no-capacitor cell structure that it claims solves the difficulties encountered in producing DRAMs in sub-0.15m process technology.
2002-02-06 Technologist backs low-voltage CMOS for SoC devices
Plenary speaker Dennis Buss, technology vice president of Texas Instruments Inc., told thousands gathered for the ISSCC that low-voltage CMOS offered the best hope for building portable Internet appliances.
2002-02-12 Scaling debate stalks chip conference
From the wide range of panels and tutorials at the International Solid-State Circuits Conference, from the myriad papers, from the conversations in the hotel halls, a single gnawing issue grew from hints and whispers to a groundswell of concern: Will IC technology continue to scale?
2013-11-08 Samsung, SK Hynix set to unveil next-gen memory chips
Samsung will demo low-power DDR4 SDRAMs for smartphones while SK Hynix will unveil its High-Bandwidth Memory, a stack of four memory chips fueling next-gen comms, graphics and server chips.
2014-02-12 Redefine algorithm design for energy-efficient machines
Mark Horowitz opens the ISSCC tackling alternatives to create better computing devices.
2002-02-07 Party's over for low-voltage CMOS, academics say
2002-02-13 NEC IP core targeted for system LSI Chips
NEC announced at the recently concluded International Solid-State Circuit Conference the development of a super-fast serial interface IP core for system LSI chips used in next-generation broadband networks and high-end servers.
2005-02-14 MIT debuts 'bionic ear processor' for hearing impaired
A team from the Massachusetts Institute of Technology described an analog "bionic ear processor7quot; with zero-crossing detection for the hearing impaired.
2015-02-25 Marvell unveils novel interconnects, memory architectures
Marvell's MoChi interconnect is based on the ARM AXI link running at 8Gb/s or faster, while its Final-Level Cache technology aims to cut the amount of DRAM main memory needed in a system.
2010-11-23 International Solid State Circuits Conference's limelight on medical
Medical electronics will be front and center at this year's International Solid State Circuits Conference which has chosen the 2011 theme of Electronics for Healthy Living.
2015-02-25 Intel's 14nm process churns out world's smallest SRAM
The company will describe a 0.0500 ?mm2 SRAM bitcell capable of storing 14.5Mb per mm2, which is part of a memory array that will be widely used in Intel's future SoCs such as cellular modems.
2005-02-10 Intel reveals MIMO radio, dual-core Itanium processor
Intel will introduce a dual-core Itanium processor along with one of the first CMOS radio chips using multiple-input/multiple output antenna technology.
2015-03-06 Intel recommends 2.5D, 3D integration for next-gen chips
Intel emphasised that heterogeneous integration enabled by 3D IC is essential to the development of future SoCs, especially in terms of scaling lithography processes.
2014-02-12 Intel Labs to focus on high risk, high reward projects
The new director of Intel Labs, Wen-Hann Wang, pledges that the research unit will continue to "take risks, fail fast, improve innovation yield."
2006-02-09 Hitachi advances paper-thin RFID chip
Targeting radio-frequency identification, Hitachi has developed what it says is the smallest and thinnest IC in the world for those applications.
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