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2007-02-19 Crolles2 continues work despite alliance issues
The Crolles2 alliance continues to work diligently to ramp up its 65nm process and complete qualification of 45nm despite the loss of some long-term partners in the technology-sharing arrangement.
2002-02-08 Broadcom implements OC-192 chips in CMOS
Broadcom Corp. engineers described CMOS transmitter and receiver ICs for SONET operating at 10Gbps in back-to-back presentations at the 49th International Solid-State Circuits Conference.
2002-02-07 Ambient intelligence gains traction
Future electronic systems will bring ambient intelligence into everyone's lives, but not without extraordinary improvements in circuit and system design, an ISSCC keynoter said Monday (Feb. 4).
2008-02-08 Wi-Fi, WiMAX soon to invade handsets
An afternoon session on wireless networks at the ISSCC concluded that cost of the latest Wi-Fi and Bluetooth links are going down, and WiMAX will soon find its way to cellphones.
2005-02-15 TI to begin sampling initial 65nm DSP devices
At the International Solid State Circuits Conference (ISSCC) here, Texas Instruments Inc. disclosed that it will shortly begin sampling its first 65nm devices amid an aggressive ramp on the 90nm front.
2009-02-16 Silicon resonator consumes 1,000x less power
By adding a piezoelectric thin-film atop its silicon resonator and using a switched capacitor method for performing temperature compensation, the Swiss Center for Electronics (CSEM) is claiming a 1,000-fold decrease in power consumption in a paper presented during the ISSCC.
2005-02-10 Seiko Epson tips flexible processor via TFT technology
At the International Solid-State Circuits Conference (ISSCC) here, Japan's Seiko Epson Corp. presented a paper on a flexible, 8bit asynchronous microprocessor, based on a low-temperature, poly-silicon TFT technology.
2004-02-23 Processor designers debate faster clocks
An evening panel session held at ISSCC here Tuesday (Feb. 17, 2004) debated some of the consequences of clocking processors at multi-GHz rates.
2009-02-16 Panel questions future of MID market
The outlook is unclear for mobile Internet devices (MIDs) according to a panel of marketing executives at the International Solid State Circuits Conference (ISSCC).
2014-02-19 Microsoft gears Kinect for time-of-flight sensor upgrade
In its ISSCC presentation, Microsoft described a time-of-flight sensor that will supplant an infrared-based depth sensing system.
2009-02-13 Implantable SoC improves drug therapy
Engineers at National Taiwan University have developed an implantable SoC capable of drug delivery within a living person that has shown potential for improving the effectiveness of drug therapy through precision control, according to a paper presented on Feb. 10 at the IEEE's International Solid State Circuits Conference (ISSCC).
2009-02-17 Implantable ICs to advance medical R&D
Researchers described at the International Solid State Circuits Conference (ISSCC) two implantable wireless chips that could advance medical research on multiple fronts.
2005-02-09 IBM, Sony, Toshiba tip 'Cell' processor at 90nm
At the International Solid State Circuits Conference (ISSCC) on Monday (Feb. 7), IBM Corp., Sony Corp., Sony Computer Entertainment Inc., and Toshiba Corp. disclosed more details of the long-awaited &quote;Cell&quote; processor.
2015-02-27 Glimpse at 5G highlights role of air interface
This year's ISSCC revealed a prototype 5G base station, as well as a number of 5G cellular research projects racing to a conclusion so proposals for formal standards can begin as early as next year.
2014-02-20 Differential pairs provide higher bandwidth across two wires
Kandou Bus founder Amin Shokrollahi demoed a 40nm chip at the ISSCC last week, sending 12Gbit/s per wire at less than 4picojoules/bit and dispersing eight bits across eight wires.
2000-07-01 Wireless future: At what cost?
I recently attended "Bluetooth Geneva," a conference sponsored by UK-based IIR Limited. Bluetooth, a proposal by cellphone makers Nokia and Ericsson along with computer makers IBM, Intel and Toshiba, is now endorsed by over 1,600 manufacturers. That this technology is hot is evidenced by the questions from the Taiwanese engineers at the executive panel discussion, "Interfacing for the Millennium," sponsored by Global Sources during the IIC-Taipei conference in May. Bluetooth was intended to link portable PCs and cellphones with a short distance wireless link. In principle, it will enable you to download an address book from your PC to your cellphone. Though it frequency hops at 2.45GHz, the Bluetooth transceiver was conceived as dumb, low power (10mW), and cheap.
2014-09-08 Will innovation drive displays into post-touchscreen era?
At the Touch Taiwan event, a Nikkei BP executive predicted the future of display technology to be ambient, free-form and wearablewith images that can be projected on any surface or in the air.
2011-02-25 Vendors keen on pushing mobile DRAM to higher speeds
While 800- or 1,066MHz LPDDR2 devices could serve as a bridge to next-gen technologies, they could also push out other next-gen candidates.
2015-05-20 Using plastic waveguides for future comm networks
Here's a look at a multi-gigabit communication link using a plastic fibre as transmission channel. It is developed by the KU Leuven ESAT-MICAS research group in Belgium.
2008-02-15 Tweaks behind delay of ST-Intel phase-change memory
Researchers from Intel and STMicroelectronics could have produced samples of 128Mbit phase-change memories in 90nm process technology as early as June 2007 but opted instead to take time to improve the memory.
2011-02-22 TSMC, Taiwan university create multi-angle 3D chip
The 3D TV chip allows TV viewers to see an object in stereo from various angles. It also comes with traditional HDTV and 3DTV functions.
2005-02-10 Toshiba, SanDisk to enable 8Gbit of storage on a chip
Toshiba Corp. and SanDisk Corp. on Monday (Feb. 7) announced an 8Gb NAND flash memory chip fabricated with 70nm process technology.
2005-02-23 Toshiba, SanDisk move up opening of 300mm flash fab
Toshiba Corp. and SanDisk Corp. plan to open a new 300mm flash memory fab as early as June, several months ahead of scheduled.
2011-02-23 Toshiba develops power-saving flip-flop circuit
Toshiba's new flip-flop boasts power dissipation up to 77 percent less than that of a typical flip-flop. When used in a WLAN chip, it can reduce total power consumption by up to 24 percent.
2005-12-14 Toshiba builds 128Mb capacitorless DRAM
Toshiba has fabricated a 128Mb capacitorless DRAM on an SOI wafer and verified operation of the chip.
2009-11-23 The path to gigabit-per-second wireless
When WiMedia stumbled, the path to gigabit-per-second wireless suddenly became not clear anymore. All eyes turnedor should have turnedto 60GHz.
2013-07-03 The outlook for charge-trapping flash memory
The planar cell structures will enable continued scaling of these charge-trap technologies, while new architectures will emerge and further extend the density-growth trend.
2011-10-14 The move toward 3D chips
Semiconductor fabrication is moving toward 3D ICs and by next year, 3D chips will be available for commercialization.
2008-02-04 Sun stirs industry support for Rock CPU
Sun Microsystems is rallying an industry consortium around its approach to supporting transactional memory, a key piece of the puzzle of next-generation parallel programming systems.
2009-02-11 Startup readies RRAMs for mass production
Australian startup 4DS Inc. claims to have made a major breakthrough in resistive RAM (RRAM) technology.
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