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2011-05-03 ITRS chairman: Tunnel FET possible transistor option
ITRS chairman, Paolo Gargini, believes that a field effect transistor (FET) combined with quantum tunneling can reduce power consumption, while maintaining adequate performance.
2005-07-19 TI exec sees chip industry entering new era
In a keynote speech at Semicon West, Texas Instruments (TI) executive and SIA representative to the International Technology Roadmap for Semiconductors (ITRS) Roadmap Committee, Dr. Bob Doering, has discussed critical issues facing the industry and provided a long range outlook on semiconductor technology development.
2005-09-01 Road map rethinks process reductions
The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions.
2004-06-30 Toshiba extends bulk CMOS life to 22nm
Toshiba Corp. has developed technologies that it says will extend the life of bulk CMOS as far as the 22nm technology node, which won't reach production until 2016, according to the timetable set out in the 2003 edition of the International Technology Roadmap for Semiconductors (ITRS).
2002-06-14 Rudolph develops enhanced metrology solutions
Rudolph Technologies Inc. has developed an enhanced metrology solutions roadmap to address the technology requirements outlined in the 2001 ITRS.
2010-06-14 Will EUV litho be ready for 22nm?
EUV is creeping closer to the technical specifications that would allow high volume manufacturing but it now looks unlikely to arrive in time to take much part in the 22nm node.
2005-03-18 Wafer tester monitors RF chip quality in realtime
Keithley Instruments is now introducing a third-generation on-wafer RF measurement capability with some very promising features that address the conundrum.
2009-04-09 Unlock Micron's 50nm DRAM technology
With their latest 50nm process technology, Micron Technology Inc. seems to have struck the right balance between investment in new technologies and conservative design decisions.
2003-06-27 Ultratech readies gear to fab sub-65nm chips
Ultratech said that it has optimized its laser thermal processing (LTP) technology to form junctions down in the 20nm technology node, and is now ready to enter the commercialization phase of its LTP program.
2012-08-29 U.S. defense researchers say future is in analog
DARPA proposes searching for new methods outside of the digital universe for intelligence gathering and analysis.
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2011-02-03 TSMC bares plan to build 450mm fab
TSMC's announcement that it will build a 450mm fab could push rivals Samsung and GlobalFoundries to follow suit and include 450mm into their plans immediately.
2011-08-11 Tri-gate rouses Intel-ARM rivalry
Intel's announcement of its low-power tri-gate transistor triggers anew its competition with ARM.
2005-10-19 Tool suite 'lays foundation' for extending TCAD to DFM
Synopsys introduced early this week a new TCAD tool suite that integrates features of former TMA and ISE products as well as adding new capabilities that enable TCAD to be used in the manufacturing space.
2004-07-13 TEL, IMEC team up in immersion lithography
Tokyo Electron Ltd (TEL) has collaborated with IMEC for the research of 193nm immersion lithography.
2012-10-23 TCAD eases FinFET design and variability analysis
FinFET is the first fundamental change in transistor architecture since the time MOSFET replaced bipolar transistor as the transistor of choice for logic applications.
2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
2004-03-31 Synopsys CEO defends MoSys acquisition
Responding to user questions on a variety of topics, Aart de Geus, Synopsys CEO, defended his company's proposed acquisition of MoSys in a new E-Mail Synopsys User's Group (ESNUG) mailing.
2006-10-25 Software cuts MEBES file size, data transfer times
SoftJin has announced a software that compresses mask data files in MEBES format by a factor of 5-15X and reduces file size as well as data transfer times.
2005-08-19 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2005-08-22 Soaring tool costs to delay 450mm fabs
Soaring IC-equipment development costs could push out the appearance of next-generation 450mm wafer fabs to between 2020 and 2025 ? a delay of more than a decade from its current schedule, warned an analyst at VLSI Research Inc
2004-01-27 SIA's road map affirms 3-year cycles for chips
The 2003 International Technology Roadmap for Semiconductors, formally announced by the Semiconductor Industry Association, reaffirms the three-year technology cycles first outlined in the 2001 edition of the road map.
2004-06-30 SIA sets national research initiative
The Semiconductor Industry Association has approved formation of the Nanoelectronics Research Initiative to develop exotic nanoscale devices.
2012-02-09 SIA reveals tech roadmap
The roadmap lays out what SIA sees as the path for semiconductor design and manufacturing through 2026, taking into account near and long-term challenges, as well as potential innovations.
2015-07-21 Semicon West highlights 10 chip trends
During the recent Semicon West, executives from a number of chip companies discussed the ongoing developments on semiconductors technology.
2005-07-15 Semi industry roadmap subject of Semicon West keynote
An aggressive future roadmap for semiconductor technology development will unveiled by Texas Instruments executive Bob Doering during a keynote speech at Semicon West in San Francisco today.
2008-08-14 Sematech reports progress on EUV litho for 22nm
Sematech has disclosed a way of using extreme ultraviolet (EUV) lithography to define silicon devices with a half-pitch resolution as small as 22nm.
2003-07-16 Schlumberger, LSI announce joint development program
Schlumberger Verification Systems and LSI Logic have established a JDP in advanced metrology for the 65nm process node.
2014-06-18 Qualcomm advocates monolithic 3D adoption
The chipmaker appears to be making a concentrated effort to employ 3D integration technology to stretch out the semiconductor roadmap beyond the scaling trajectory predicted by Moore's Law.
2007-09-18 Proposed organization to give voice to IP community
A proposal is circulating to form a new and independent organization which will give the semiconductor IP community a new and much-needed voice in the arena.
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