Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Imec

Imec Search results

?
?
total search385 articles
2010-06-21 Sematech welcomes Qualcomm as first fabless member
Qualcomm Inc. has joined chip-making consortium Sematech to gain an edge in next-generation technology, reportedly including 3D chips.
2009-11-25 Sematech expands, muses fabless push
Sematech is looking at ways to bring fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers,
2014-11-17 Samsung reveals new development projects
Digital health was one of four growth areas in which Samsung rolled out new software developer kits, seeking to build ecosystems around its smartphones and tablets.
2014-09-03 Samsung funds research for 7nm
The South Korean tech giant is financing Pennsyvania State University's work on III-V, which explores FinFET fabrication using the combination of silicon and indium gallium arsenide.
2007-06-20 Russia cooks up 300mm wafer fab plans
Russia is collaborating with a party known only as the "Kedah Group" to construct a 300mm wafer fab at the city of Nizhny Novgorod.
2005-09-01 Road map rethinks process reductions
The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions.
2013-04-01 RFID, sensor IC combined in flexible food tag
The CATRENE-Pasteur project combines RFID with multiple sensors on a tag which will be attached to transportation containers. The tag will estimate of how long the food they contain will stay fresh.
2013-01-14 Reprogrammable memory arrays on flexible substrate
The MOMA consortium has recently announced the development of the largest reprogrammable non-volatile memory arrays which will be made on flexible substrates.
2011-02-28 Reconfigurable transceiver eliminates SAW filters
A breakthrough toward fully reconfigurable radios, the new transceiver relaxes the requirements of antenna filters and works well with multiple wireless standards, including 3GPP-LTE.
2011-05-13 Rambus taps startups to explore next-gen memory tech
Keen on developing potential flash and DRAM successors, Rambus is investing in memory technology startups and lending support to universities researching next-generation memory technologies.
2007-11-28 Rambus shows alternative way to terabyte memory
Rambus has developed technologies that could enable links to memory chips delivering up to a terabyte per second and could provide a lower-cost alternative to 3D chip stacking.
2009-03-11 R3Logic to advance 3D design flow R&D
R3Logic announced that it has created a new R&D center in Grenoble, France to develop and enhance its design tools for 3D heterogeneous system and system-in-package design.
2009-09-10 R&D consortia help drive IC equipment growth
Semiconductor equipment R&D spending is set to be slashed, with an $8 billion decline seen over the next five years, according to market tracker Gartner.
2016-01-18 Qualcomm enters $280M joint venture with Chinese province
The joint venture will focus on the design, development and sale of advanced server chipset technology in China, which is the second largest country in the world for server technology sales.
2011-07-06 Pragmatic, Holst partner on printed electronics tech
The partnership between Pragmatic and Host is believed to significantly advance the practical commercialization of printed electronics technology.
2015-03-11 Power electronics companies take diverse roads to success
The power electronics market is changing. Chinese companies' vertical integration is challenging diverse historical market leaders, while Europe and U.S. companies are pushing horizontal integration.
2007-11-08 Physical sensors drive MEMS consumerization wave (Part 2)
ST's Benedetto Vigna notes that we are now living in the era of MEMS consumerization where mic, motion and pressure sensors are the main actors and he believes this trend will continue for the next five years.
2004-06-30 Philips opens R&D rent-a-lab
Seeking to change the way high-tech companies conduct corporate research, Philips Research has opened a multipurpose clean room here available for rent to internal R&D teams as wells as outside customers.
2012-12-17 Panel: No single approach in future of ICs
A group of experts at IEDM debated about the various technologies in semiconductor miniaturisation, with FinFETs being just one of many approaches.
2008-04-01 Organic RFID tags to zap bar codes
Researchers from the European Holst Center said their 64bit, inductively coupled, passive RFID tag achieved a record 780bit/s data readout.
2010-11-25 Organic processors run hardcoded program
The 2011 International Solid State Circuits Conference will host papers on a 5.2GHz processor from IBM and an Intel Itanium chip packing 54Mbytes cache.
2014-03-28 On-chip interconnect costs head for further study
With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes.
2013-11-25 Omron looks to enhance blood pressure monitors
According to the company, in order to win the next-generation smart healthcare battle, it is important to develop a technology that can sense, track, accumulate, analyze and send data to doctors.
2007-01-18 NXP, TSMC expand R&D partnership in CMOS
NXP and TSMC will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership.
2007-01-18 NXP withdrawal threatens ST's game plan
NXP's confirmation that it is pulling out of the Crolles semiconductor R&D alliance, is a problem for STMicroelectronics NV and could mean the end of the alliance.
2007-04-02 Next-gen chips bridge design, process
Morris Chang of TSMC cites two strategies foundries need to develop to remain profitable in the CE era.
2015-04-20 Multipurpose module predicts IC failure
The Multipurpose Electromigration (MPEM) module provides a low-cost user-friendly test suite for evaluating reliability of copper lines in modern integrated circuits.
2006-05-01 Multicore design strives for balance
The advantages of multicore architectures will be lost unless new approaches are developed for programming and debugging multicore systems.
2007-10-12 Multibillion market awaits energy harvesting tech
In application areas as diverse as aircraft construction, personal health care monitoring systems or burglary detection systems, energy harvesting is on the verge of developing a market with a multibillion dollar potential.
2016-04-07 Moore's Law extended: Intel roadmap reveals CMOS at its core
Intel's future processors at 10nm and beyond will continue to use CMOS, but the cores will be surrounded by novel circuit architectures using new materials that may extend Moore's Law indefinitely.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top