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2007-06-01 Micron CEO: Of memories and foundry models
Micron Technology Inc. has grabbed its share of headlines. What will Micron do next? To get a handle on the company, EE Times caught up with Steve Appleton, its president, CEO and chairman, who talked about the IC industry, foundry/fab-lite models, private-equity buyouts, its diversification strategy and universal memory.
2005-08-11 MEMS work uses polysilicon-germanium over CMOS
A gyroscope developed under a European Commission supported project, is intended to serve as a demonstrator of a combined MEMS sensor and signal conditioning circuit.
2013-08-15 Memory-oriented optimisation techniques (Part 2)
Part 2 discusses loop buffer, data transfer, and storage management.
2010-03-11 Long road still to e-beam direct-write litho
While multiple development efforts on e-beam direct-write lithography have reported progress, a one prominent lithography researcher claims production tools are still a minimum of five years away.
2005-08-01 Little time, big decisions for 45nm node
Technologists face some tough decisions as they ponder which knobs to turn for the 45nm node.
2007-04-16 Litho woes weigh down semicon industry
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternativea version of 193nm immersionis proving expensive.
2010-03-17 Lighting initiative to drive flexible electronics
The PLACE-it initiative aims to realize an industrial platform for thin, lightweight and flexible optoelectronics systems that will create unique opportunities for on-body healthcare applications.
2011-11-04 Joint effort pushes for low-cost tandem organic PV cells
The European FP7 project X10D aims to develop efficient organic PV technologies for the thin-film PV market.
2011-11-22 Issues of EUV lithography
Chip makers need EUV to be ready well in advance of when they plan to use it in volume manufacturing so they can establish chip design rules and tweak their manufacturing processes.
2015-07-03 Is a FinFET + FD-SOI marriage possible?
A number of companies have committed to FD-SOI and others to FinFET, but for fabless and semi-fabless chipmakers, the foundries offer both choices, so why not mix and match or even combine the two?
2012-03-07 Introduction to 2.5D
We need evolutionary, instead of revolutionary, adjustments to current design flows and the supply chain to successfully leverage 2.5D.
2010-11-23 International Solid State Circuits Conference's limelight on medical
Medical electronics will be front and center at this year's International Solid State Circuits Conference which has chosen the 2011 theme of Electronics for Healthy Living.
2009-06-23 Intel scales down 193nm litho to 15nm
Intel claims that it has pushed 193nm immersion lithography down to 15nmat least in the lab.
2013-05-28 Intel maps out plans for 3D NAND
Intel VP Keyvan Esfarjani discussed the transition of non-volatile NAND flash memory from cells in a 2D array to strings of NAND transistors integrated monolithically in the vertical direction.
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
2013-12-18 Industry collaboration seen to ease advanced-node issues
In theory, increased industry collaboration in research areas such as materials and better EUV sources would help address unrelenting schedule pressures, noted a Globalfoundries executive.
2007-10-18 Industrial affiliation program tackles 32nm IC packaging
Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies.
2005-02-21 In IP age, hard to say just who owns what
The electronics industry feeds on constant innovation, so safeguarding new ideas from predators is a given.
2014-06-17 III-V MOSFETs rival Si-based transistors
The transistors are fabricated with indium-gallium-arsenide atop an indium-phospide substrate. They possess 20nm gate lengths, 0.5mA per micron width on-current and 100nA off-current when operating at voltages similar to Si.
2004-07-08 IEEE pushes WLANs to 'nth' degree
The IEEE 802.11n task group will start sorting through 61 proposals for next-generation WLANs in Portland, Oregon, next week.
2010-11-26 IEDM zooms in on energy saving
One keynote speaker will argue that the biggest potential for energy savings lies in the way we use our available energy, and that state-of-the-art power semiconductors and circuitry can help reduce losses along the entire electrical energy chain.
2007-03-16 IDM firms go for 'fab lite'
The unraveling of the Crolles2 Alliance, coupled with Texas Instruments' decision to use foundry partners for its future process technology, had observers wondering whether the entire semiconductor industry was about to go fabless.
2008-04-01 ICs ready for medical practice
Recent semiconductor advances in the medical field give credence to a rising belief that biology will be one of the next big application areas in electronics.
2008-04-07 IC industry addresses multicore, programming 'software gap'
The IC industry is starting to address what's being called a software gap between a rising tide of multicore processors and a lack of parallel programming tools and techniques to make use of them.
2013-01-17 IC firms promising memristive microchips as early as 2013
Memristors mimic the process flow of the human brain thereby making it a solid architectural foundation for a new era of cognitive computers.
2004-12-07 IBM used Albany immersion tool to make power processor
IBM Corp. used a Twinscan AT:1150i lithography machine from ASML Holdings NV installed at the Albany Nanotech campus in New York state to make examples of a 64bit power processor,
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production.
2010-09-02 HP, Hynix push memristor commercialization
HP and Hynix have forged a joint development agreement to develop materials and process integration technology to shift memristors from R&D to commercial resistive RAM (ReRAM).
2005-03-16 Hope floats for new DRAM
A potentially revolutionary 90nm DRAM technology, claiming gains in speed, size and power consumption, has been developed by a Swiss startup.
2011-05-13 GSA forms alliance with MEMS Industry Group
GSA and MEMS Industry Group form an organizational alliance aiming to promote the greater commercial use of MEMS and MEMS-enabled technology.
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