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| 2004-06-25 | Cypress acquisition sees growth opportunities in imaging Cypress Semiconductor Corp. is looking for a stronger position in the image-processing market with the acquisition of Belgium-based FillFactory NV. |
| 2005-08-22 | Constructing the next transistor The planar metal-oxide-semiconductor field-effect transistor appears to be approaching the end of its useful life |
| 2008-11-21 | Confab to highlight nanotech for bio Advances in nanotechnologies for medicine and biology will be detailed at the December International Electron Devices Meeting in San Francisco. |
| 2012-10-09 | Commercialisation of 14nm chips moved back due to EUV delays In order to lay down patterns on next-gen chips that target sizes as small as 14nm, EUV systems need light sources that are nearly 20 times more powerful than the ones that are currently available. |
| 2008-12-23 | Coming soon: Universal memory A slew of promising "universal memory" technologies were unveiled at the International Electron Devices Meeting (IEDM), but don't look for mass adoption anytime soon. |
| 2014-03-20 | Chip stacks feature near-zero TSV keep-out zones GlobalFoundries describes a middle-of-line layer stack technique that uses nitride, PMD oxide, and a contact protection layer with a high coefficient of thermal expansion. |
| 2008-07-21 | Chip industry preps for 'More than Moore' era Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore." |
| 2002-09-05 | Chartered preps 0.185m SiGe process Chartered Semiconductor Mfg will expand its foundry service offerings to the communications sector by rolling out a 0.185m SiGe BiCMOS manufacturing capability in 2H of 2003. |
| 2015-06-30 | CEA-Leti realigns research focus: FD-SOI takes centre stage Leti, equipped with 200nm and 300nm wafer fabs, pioneered in its labs one of the key technologies in manufacturing SOI wafers, transferred it to Soitec, and worked with ST in chips based on FD-SOI. |
| 2014-11-05 | BSI sensor chip minimises reflection losses The chip features new anti-reflective coating that targets the UV range, claiming to show excellent performance at near UV wavelengths, with quantum efficiency values above 50 per cent. |
| 2005-12-14 | ASML, Nikon tie in litho share race Preliminary data indicates that ASML will retain the lead in revenues with a 53.2 percent share of the $4.8 billion market for new lithography tools, up from a 50.3 percent share in 2004, according to The Information Network. |
| 2005-10-18 | ASML's EUVL alpha tool shipments slip to Q2 European lithography equipment vendor ASML Holdings NV now expects to ship its two alpha extreme ultraviolet lithography (EUVL) tools in the second quarter of 2006, the company said. This is a change from previous expectations that the tools would ship in the first quarter. |
| 2009-10-12 | ASML details EUV lithograpohy roadmap ASML showed a rough road map for extreme ultraviolet (EUV) lithography systems that could be ready for commercial use in late 2012. |
| 2012-05-30 | ARM CTO calls for architecture scaling for 2020 soln's Major advances have been made regarding systems, hardware, operating systems and applications but Muller outlined the needs of architecture scaling for 2020 solutions. |
| 2010-07-15 | Applied boosts high-volume TSV manufacturing Applied Materials Inc. announces the Applied Producer Avila system for high-volume manufacturing of stacked or 3D chips using through-silicon via (TSV) technology. |
| 2007-12-19 | Anxiety high as race begins for high-k 32nm While foundries are just beginning to ramp their 45nm processes, vendors are already eyeing the next big challenge—the race to develop and ship high-k dielectrics and metal gates for the 32nm node. |
| 2010-10-08 | Android app offers personal "tricorder" health monitor Sensors and application combine to offer new, high-tech way of monitoring health indicators |
| 2011-05-27 | Analog partner program targets first-time silicon success Analog Bits started launching its partnership program to enhance the semiconductor design ecosystem prioritizing first-time silicon success among its analog partners. |
| 2008-09-24 | Albany NanoTech beefs up cleantech efforts Eyeing to achieve its success in semiconductors, Albany NanoTech, together with its parent organization, is bringing its collaboration model over to clean technology. |
| 2012-04-09 | Advantages of resistive RAM for next-gen NVM Here's a discussion on the strengths of hafnium-oxide-based resistive RAM cells, and the main challenges ahead for this technology. |
| 2011-09-27 | A primer on 3D-IC design challenges Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals. |
| 2014-05-26 | 7nm, 5nm scaling compels adoption of new materials Shifting advanced nodes involve exploring alternatives—from silicon to graphene, FinFET to SOI—and considering how to apply the strengths associated with 3D device architectures to new technologies. |
| 2015-02-12 | 7 communications tech that will shape 2015 Developing technologies such as LTE and LTE-Advanced, voice over LTE, small cells, heterogeneous networks, NFV/SDN are predicted to make a huge impact this year. |
| 2010-12-15 | 3DS-IC group to fast-track TSV standards SEMI worked with SEMATECH to launch the Three-Dimensional Stacked Integrated Circuits (3DS-IC) group to develop manufacturing standards for through-silicon via (TSV) technology. |
| 2013-12-05 | 3D NAND industry-wide adoption still shaky Development and production of 3D NAND is ramping up, but 2014 will clearly be a shakeout year. |
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