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2011-05-27 IMEC extends 3D research agreement with Qualcomm
IMEC and Qualcomm will continue to be partners in researching for and designing advanced technologies related to 3D technology.
2010-06-15 IMEC expands cleanroom, lab in Belgium campus
IMEC has officially opened the extension of its cleanroom at its campus in Belgium and kicked off the construction of a new office building fitting in its plan for further expanding its high-tech ecosystem.
2012-06-15 Imec evaluates gate-last HKMG alternatives
Researchers are looking at RMG integration options for different applications, materials selection and engineering, and compatibility with advanced modules and device architectures.
2007-06-25 IMEC energy harvester yields power from vibrations
IMEC announced it has built a piezo-based energy harvester prototype that generates energy from mechanical vibrations.
2011-05-30 IMEC develops GaN-on-silicon wafers for power devices
IMEC International has successfully produced device quality wafers with GaN/AlGaN layers on 200mm silicon wafers.
2013-11-07 Imec demos III-V FinFET devices on 300mm Si wafers
The devices enable continual CMOS scaling down to 7nm and below, and also enable new heterogeneous system opportunities in hybrid CMOS-RF and CMOS-optoelectronics.
2013-07-11 Imec demos damage-free cryogenic etching of ultra low-k mat'l
By applying very low temperatures during etching, a condensation of etch products in the pores of the low-k material results in a protection of the dielectrics' surface.
2008-02-14 IMEC debuts mobile SDR baseband processor platform
A chip-level baseband platform capable of supporting 802.11n, 802.16e, mobile TV and 3GPP-LTE communication standards has been taped out by IMEC.
2010-06-21 IMEC cuts down germanium-based TPV cell costs
IMEC is offering an improved processing technique for germanium-based thermophotovoltaic (TPV) cells resulting in reduction of cell cost, an essential step to develop a market for TPV applications.
2013-06-25 Imec creates dielectric to scale NAND flash below 20nm
Researchers from Imec have created a dielectric that is scalable in thickness, making the material promising for further scaling of 2D NAND flash memory below 20nm.
2004-10-20 IMEC claims silicide gate could enable 45nm process
IMEC has demonstrated the integration of fully-silicided NiSi gates on top of high-k gate stacks, claiming a potential breakthrough that would enable development of a 45nm manufacturing process.
2010-05-27 IMEC China signs 65nm CMOS deal with Huali
IMEC China has signed a joint development project on advanced chip process technology with semiconductor company Huali.
2011-04-25 IMEC bares new bulk FinFET fabrication process
IMEC introduces a new process flow to fabricate bulk finFETs using a plasma-free dry oxide removal process that shows good morphological and electrical characteristics.
2015-03-02 imec announces WDM hybrid CMOS silicon photonics transceiver
The SiPh chip, fabricated on imec's 25Gb/s Silicon Photonics Platform, includes an array of four compact 25Gb/s ring modulators, coupled to a common bus waveguide to allow WDM transmission.
2012-12-14 Imec advances UHF Schottky diode, 10nm FinFETs
Imec presented a ultra-high frequency Schottky diode based on amorphous IGZO as semiconductor and announced its collaboration with Synopsys for 10nm FinFETs.
2007-05-28 Hynix joins IMEC research for 32nm, below
Hynix is tying up with European research center IMEC to tackle memory challenges at the 32nm and below process nodes.
2014-12-08 Huawei, Imec join hands for high-bandwidth optical interconnect
The joint research on silicon-based optical interconnects is expected to provide benefits including in speed, power consumption and cost efficiency.
2013-06-14 Holst Centre, Imec develop fully-organic imager
The imager is sensitive in the wavelength range between 500 and 600nm, making it compatible with typical scintillators and therefore suitable for x-ray imaging applications.
2015-02-18 GlobalFoundries, imec join forces on RF CMOS
The foundry will collaborate with technical experts from imec to investigate low-power and compact high-performance agile radio solutions that will enable a broad range of radio architecture design.
2014-02-18 Fujitsu-Imec partnership yields wireless transceiver tech
The wireless transceiver for BAN applications features the digitally controlled receiver and the high-speed digital three-point modulation technologies, lightening the burden on patients using sensors.
2004-10-11 Freescale embraces IMEC multiprocessor approach
In the hope of establishing its own proprietary hardware-software platform for future mobile electronics applications, Freescale Semiconductor Inc. has signed up to perform collaborative research with IMEC on reconfigurable multiprocessor systems.
2003-10-15 Five "core" partners join IMEC 45nm project
Intel Corp. and Samsung Electronics Co. are among the five " core" partners of a research effort here aimed at developing 45-nm-and-beyond process technologies.
2007-03-19 Elpida joins IMEC for sub-32nm design project
Japan DRAM manufacturer Elpida Memory Inc. has signed a multiyear contract that allows the company to join the IMEC research platform for sub-32nm geometries.
2010-04-12 Dow Corning, IMEC team on solar cell research
Dow Corning and IMEC have signed a three-year contract for joint research on next generations of crystalline silicon solar cells.
2013-07-10 Dow Corning boards Imec's 3D IC packaging initiative
Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging.
2005-03-09 CoWare joins IMEC multimedia development project
CoWare Inc., a U.S. based systems-level design tool company, has agreed to work with the IMEC (Leuven, Belgium) engineering group to develop an integrated design flow for multimedia and wireless applications on a programmable platform as part of IMEC's multi-mode multimedia (M4) research program.
2015-10-09 Cadence, Imec announce 5nm test chip tapeout
Imec and Cadence optimised design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence Innovus Implementation System.
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.
2003-04-07 ASML receives order for 157nm tool from IMEC
ASML Holding NV has delivered a 157nm step-and-scan tool to independent R&D chip consortium, Interuniversity MicroElectronic Center.
2005-01-18 Applied Materials, IMEC to develop 45nm transistor tech
Applied Materials Inc. and IMEC are working together to develop 45nm-generation transistor-level semiconductor processing technologies.
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