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2009-06-16 Intel, TSMC to tap ASML's EUV litho tool
Hynix Semiconductor, IMEC, Intel, Samsung, Toshiba and possibly Taiwan Semiconductor Manufaturing Co. are the initial customers for ASML Holding NV's "pre-production" extreme ultraviolet (EUV) lithography tool.
2013-05-27 Intel shoots for extensive research beyond 10nm
At the Imec Technology Forum Intel's director of component research contemplated the end of the road for conventional silicon and said more varied research would be needed to catch the next opportunity.
2012-10-08 Improved tracking for revamped wireless EEG headset
Panasoni, Imec and the Holst Centre releases second-generation wireless electroencephalogram headset.
2013-02-05 Hyperspectral imager ready for industrial vision apps
imec's latest product monolithically integrates hyperspectral filters on a CMOSIS CMV4000 imager and scans 100 spectral bands in the 600-1000nm wavelength range.
2010-12-02 Huawei acquires 4G RF chipset firm
The deal involves IMEC spin-off company M4S NV, which was formed in 2006 to commercialize IMEC's ADRES parallel processing DSP technology for use in software-defined radio.
2011-01-28 High-bandwidth optical I/O affiliation program launched
Imec has launched a new industrial affiliation program on high-bandwidth optical I/O. The primary objective of the new program is to explore the use of optical solutions for realizing high-bandwidth I/O between CMOS chips.
2008-02-27 GaAs solar cell on Ge touts 24.7% conversion efficiency
IMEC has announced the development of a single-junction GaAs solar cell on a germanium substrate with a record conversion efficiency of 24.7 percent.
2011-06-20 FinFET outperforms planar CMOS
In a test comparing impact of process variability, Imec has found out that FinFET technologies emerge superior than planar CMOS, with results allowing creation of better technology and higher yields
2010-06-10 ExaScience lab rises in Belgium
Intel Corp., IMEC and five Flemish universities have set up the Flanders ExaScience Lab at the IMEC research facilities in Leuven, Belgium.
2013-09-19 Epitaxy process integrates GeSn MOSFET device on Si
KULeuven, Imec and AIST developed a solid phase epitaxy process to incorporate germanium tin metal-oxide semiconductor field-effect transistor devices on silicon.
2007-12-17 Electronic wires stretch to double their length
An IMEC laboratory at the University of Ghent in Belgium has realized interconnections for elastic electronic wires that can be stretched to twice their original length while maintaining electrical conductivity.
2008-03-25 Demistifying software-defined radio platforms
In general, an SDR is a reconfigurable and programmable hardware platform that can potentially tune to any frequency band and receive any modulation. The SDR solution that IMEC envisions has a reconfigurable front-end combined with a (re)programmable baseband platform. It targets 802.11n, 802.16e and 3GPP-LTE.
2012-11-08 Customised lenset array prepped for advanced e-beam tool
Imec has designed and fabricated an electrostatic micro-lens array for KLA-Tencor's Reflective Electron Beam Lithography (REBL) tool.
2012-12-07 Curved LCD display key to pixelated contact lens
Imec and the Centre of Microsystems Technology have unveiled a spherical curved LCD display which can be embedded to create a fully pixelated contact lens.
2011-12-01 Cu electroplating cuts solar cell fabrication cost
Kaneka and Imec have detailed a silver-free approach in manufacturing heterojunction silicon solar cells that tout higher efficiencies.
2009-12-01 Chip lets electronics talk to biological cells
IMEC has created a micronail chip that enables precise recording of electrical signals and electrical stimulation of single cells.
2008-04-14 Body heat, ambient light power wireless EEG
In the framework of Holst Centre, IMEC has developed a battery-free wireless 2-channel EEG system powered by a hybrid power supply using body heat and ambient light.
2008-08-22 Belgian tech firms improve health monitoring
IMEC and i.Know NV have developed on a technology that provides real-time relevant medical data extraction
2009-06-08 ASML details EUV litho production plan
ASML Holding NV has tipped the roadmap for the introduction of its first extreme ultraviolet (EUV) lithography machines at the IMEC Technology Forum.
2013-10-07 Ansys tech enables modelling of mm-wave for wireless comms
ANSYS's partnership with Imec allows the research centre to use ANSYS' modelling tools to perform advanced research on antenna design and antenna/package-chip co-design in integrated mm-wave SiPs.
2008-02-13 Acquisition ASIC rolls for EEG systems
IMEC rolled out a complete 200?W 8-channel EEG acquisition ASIC suitable for miniaturized ambulatory EEG measurement systems.
2013-10-21 3D memory improved via laser thermal anneal application
Laser thermal anneal application can enhance the current in vertical polysilicon channel devices for 3D memory, as demonstrated by Imec and Excico.
2013-02-25 2.4GHz 1.9nJ/b radio compliant to BLE, Zigbee
Imec and Holst Centre revealed a short range radio that, in addition to compliance with MBAN, IEEE802.15.6, claims to be 3-5 times more power-efficient than current Bluetooth Low Energy solutions.
2009-04-28 'First' 22nm SRAM cells from EUV litho debut
IMEC has presented what it claims is to be the first functional 22nm CMOS SRAM cells made using extreme UV (EUV) lithography. The SRAM cells are made with FinFETs and have both the contact and metal-1 layer printed using a full-field EUV alpha demo tool from ASML.
2008-02-06 Will EUV litho ever cross over from R&D to production?
The procurement of an R&D EUV lithography tool from Nikon has reportedly been put off by Intel, raising more questions about the viability of EUV for mass chip production.
2010-06-14 Will EUV litho be ready for 22nm?
EUV is creeping closer to the technical specifications that would allow high volume manufacturing but it now looks unlikely to arrive in time to take much part in the 22nm node.
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2012-03-09 Wide I/O driving 3-D with TSV
Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2014-02-03 Wearable Technologies Innovation World 2013 winners
Here are six innovative devices out of the 20 winners from last year's Wearable Technologies Innovation World Cup that emerged victorious among 600 entrants from 69 different countries.
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