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2009-05-26 Infineon, India team report ESD advance
The joint research initiative of Infineon Technologies and the Indian Institute of Technology, Bombay, is claiming an advance in the integration of high-voltage functionality for advanced CMOS technologies.
2009-04-22 Infineon, Ident ink license deal for game consoles
Ident Technology has signed up Infineon Technologies AG as a license partner from the semiconductor industry.
2004-06-30 Infineon, IBM unveil MRAM prototype
Infineon and IBM presented one of the most advanced prototype of a computer memory to date - a 16Mb Magneto-resistive RAM (MRAM) prototype.
2001-06-16 Infineon, IBM prep 256Mb magnetic RAM
The two companies are expected to build the first products in a 0.13?m process at their Altis Semiconductor joint venture in Corbeil-Essonnes, France.
2003-06-12 Infineon, IBM partner on breakthrough MRAM technology
Infineon Technologies AG and IBM have collaborated to develop an advanced MRAM technology by integrating magnetic memory components into a high-performance logic base.
2007-03-19 Infineon, Hyundai partner on car electronics
Infineon Technologies AG and Hyundai Motor Company are working together for the development of automotive electronics.
2009-03-23 Infineon, Huawei ink framework purchase agreement
Infineon Technologies AG has signed a letter of intent for framework purchase agreement amounting $68 million with China's Huawei Technologies Co. Ltd. This deal is intended to supply end-to-end chip solutions to Huawei's wireline and wireless communication systems.
2007-10-04 Infineon, Hosiden co-develop silicon microphones
Infineon Technologies and Hosiden announced they have partnered on silicon microphones activities.
2010-11-26 Infineon, Goldwind sign agreement for wind turbine components
Infineon and Goldwind signed a license agreement for core components needed in manufacturing of wind turbines. In their agreement, Goldwind obtains the license to make Infineon IGBT stacks utilized in converters of MW-grade wind turbines, while Infineon shall provide IGBT stacks to Goldwind.
2013-05-02 Infineon, Globalfoundries develop 40nm embedded flash
To maintain its position in automotive and security Infineon is turning to Globalfoundries to provide its MCUs with embedded flash at 40nm.
2004-10-15 Infineon, Global Locate develop A-GPS chip for cell phones
Infineon Technologies AG and Global Locate are jointly developing Assisted Global Positioning System (A-GPS) chip for mobile telephones, smart phones and PDAs.
2002-07-02 Infineon, Delta enter technology transfer agreement
Infineon Technologies AG and Delta Electronics Inc. have entered into an agreement for the licensing and transfer of MegaDIP, Infineon's transfer mold packaging technology, to Delta subsidiary Cyntec.
2008-01-11 Infineon, Delphi co-develop Autosar-based platform
Infineon has partnered with automotive system manufacturer Delphi on the development of a new generation of body control units based on the Autosar standard.
2003-05-07 Infineon, Cypress, Micron rolls out 32Mb CellularRAM products
Infineon Technologies AG, together with Cypress Semiconductor Corp. and Micron Technology Inc., is sampling 32Mb CellularRAM devices.
2005-11-21 Infineon, Chartered expand foundry ties
Amid a major shakeup in its organization, Germany's Infineon Technologies AG on Thursday (Nov. 17) announced plans to expand its silicon foundry relationship with Singapore's Chartered Semiconductor Manufacturing Pte. Ltd.
2004-06-21 Infineon, Broadcom develop ADSL2+ CPE chips
Infineon will make its first foray into the DSL customer premise equipment chip market with the release of an integrated ADSL2/2+ chipset.
2009-03-25 Infineon, Bosch to collaborate on power ICs
Infineon Technologies AG and Robert Bosch GmbH are widening their cooperation to include power semiconductors.
2004-09-27 Infineon, Axon confirm nonvolatile memory license
Axon Technologies Corp. Tuesday (Sept. 21) announced that Infineon Technologies AG has licensed its next-generation, nonvolatile memory technology.
2009-11-24 Infineon, ARM forge license deal on security apps
Infineon Technologies AG and ARM have entered a long-term strategic collaboration in the field of security microcontrollers for chip card and security applications.
2003-05-27 Infineon, APT enter purchase agreement
Infineon Technologies has agreed on the purchase of its COOLMOS power MOSFET die by Advanced Power Technology.
2002-06-21 Infineon, Agere, Motorola form DSP company
Infineon Technologies AG, Agere Systems Inc. and Motorola Inc. have established StarCore LLC, a company focused on developing and marketing DSPs for use in comms systems and consumer products.
2002-10-17 Infineon, Agere partner to drive WLAN tech deployment
Agere Systems and Infineon Technologies AG have formed an alliance to jointly develop high-performance chips based on the 802.11 standard to offer next-generation wireless networking solutions.
2007-10-04 Infineon's Ziebart: European chip industry needs subsidies
Infineon CEO Wolfgang Ziebart called for more subsidies for the European chip industry, or the industry would be forced to relocate.
2007-09-12 Infineon's Ziebart in an acquisition spree
Infineon CEO Wolfgang Ziebart is determined push the company's acquisition plans, obviously expecting the consolidation in the semiconductor market to continue and intending to use acquisitions as a measure to strengthen its own position.
2016-03-23 Infineon's SupIRBuck regulators drive flexibility in FPGA-based design
The SupIRBuck regulator easily adapts to rapidly changing design requirements. Featuring integrated PWM controller and MOSFETs in a single package, it delivers 90% more efficiency for all rails.
2004-03-30 Infineon's Schumacher unexpectedly resigns
Ulrich Schumacher, the hard-charging CEO of Infineon Technologies AG, has resigned, the company confirmed Thursday (March 25, 2004).
2005-11-17 Infineon's MP-EU platform speeds up next-gen mobile phone designs
Infineon Technologies announced the availability of its latest multimedia mobile phone reference design platform. The MP-EU platform enables mobile phone manufacturers to speed up introduction of next-generation UMTS phones by up to 30 percent from today's 14 months on average.
2005-02-22 Infineon's memory strategy: invest during downturn
Executives of Infineon Technologies' North America operations said its plan to ramp up a new 300mm fab here is part of a simple strategy: bigger wafers, smaller die size, maximum capacity utilization and continuing investment in its memory technology during a downturn.
2004-05-24 Infineon's memory boss resigns, management shuffles
Harald Eggers, memory group CEO at Infineon Technologies AG, is leaving the company and is to be replaced by Thomas Seifert, head of the wireline communications group with effect from June 1, the company said Wednesday, May 19, 2004.
2008-04-17 Infineon's Dresden fab to shift to Cu technology
Infineon will switch production in its Dresden, Germany fab from aluminum to copper conductive path technology.
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