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2002-05-29 PCI Express may alter PC interconnect landscape
As engineers start preparations for the arrival of PCI Express (formerly 3GIO), predictions vary on the extent of change that the fast serial interconnect will bring to the architectural landscape of the PC.
2003-09-09 Pacific Digital adopts Agere interconnect technology
Pacific Digital Corp. has integrated Agere Systems Inc.'s interconnect technology into its next-gen host adapter for SAN apps.
2006-11-01 Outsource the interconnect
Outsourcing the SoC interconnect design is a direct, straightforward measure to significantly reduce the impact of the OEM software-shift phenomenon on the semiconductor industry.
2010-09-01 Oscilloscope interconnect speeds data transfer
The Dolphin Express has been selected as the interconnect for Agilent's Infiniium 90000 X-Series oscilloscope, claimed to be the world's fastest real-time oscilloscope.
2008-08-27 Orion interconnect services: Service assurance for converged networks
An increasing number of voice minutes between carriers are completely bypassing the legacy PSTN and using end-to-end IP connections. This approach is enabling service providers to realize improved call quality, control and cost savings through lower termination rates or bill and keep commercial models.
2013-04-30 Optical MT interconnect system aimed at VPX architecture
The VITA 66.1 optical MT interconnect system meets the defined requirements for blind mate fibre optic interconnects used with VITA 46 backplanes and plug-in modules.
2012-05-24 On-ground molded interconnect antenna touts tiny footprint
Molex's 2.4GHz SMD on-ground antenna weighs in at only 0.03g measuring 3 x 3 x 4mm for tablets, headsets, smart meters and other portable electronic devices running Bluetooth, WiFi, ZigBee and other wireless standards.
2014-03-28 On-chip interconnect costs head for further study
With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes.
2005-05-27 Noise canceller accelerates interconnect speeds by 400%
The 6.25Gbps quad wideband noise canceller from Quellan is designed to significantly improve system interconnect speeds.
2003-05-02 National teams with Quellan on interconnect devices
National Semiconductor Corp. and Quellan Inc. have formed a strategic alliance to jointly deliver 10Gbps interconnect solutions.
2005-04-18 Nanowires corralled for interconnect tasks
A research group has demonstrated a way to position and control the growth of organic nanowires atop a pre-patterned substrate.
2014-06-09 Molex touts plastic substrate interconnect for CoB arrays
With a low overall package height of about 2mm, Molex PSI boasts a slim design for space-limited applications while minimising substrate costs.
2012-04-25 Molex looks into 25Gb/s interconnect
The Molex ZXP Modular I/O Interconnect System is a small form-factor pluggable interface supporting data transmission at speeds beyond SFP+ and protocols such as 100 Gigabit Ethernet.
2002-08-01 MIPS offers on-chip interconnect to link SoC blocks
MIPS Technologies Inc. has introduced an on-chip switch for SoC developers to provide a high-performance link between a MIPS processor and multiple third-party IP cores.
2002-04-01 Matrix approach for on-chip interconnect
This technical article describes how an innovative matrix technique can easily simplify SoC interconnect processes for complex IC designs.
2005-08-01 Low-latency interconnect delivers value
HyperTransport technology is well-positioned for continued growth over the next five to 10 years.
2005-12-27 Litton Interconnect acquired by EMS company
Simclar Inc. has signed a definitive agreement to acquire certain assets of the Northrop Grumman-owned Litton Interconnect Technologies assembly business in the United States.
2002-05-10 LG.Philips develops LCD interconnect technology
LG.Philips LCD Co. Ltd has developed a copper-based interconnect technology in a bid to become the world's first display manufacturer to leverage copper-based interconnect technology in TFT-LCDs.
2004-12-16 Interconnect variation: Garbage in, out
The transition to copper and 90nm process nodes has raised the specter of increased interconnect process variation.
2005-07-25 Interconnect system targets high-speed SAS, SATA apps
Molex has announced the development of its new iPass Interconnect System that will support the higher density requirements of Serial Attached SCSI and Serial ATA high-speed, multi-lane internal and external systems.
2005-11-22 Interconnect system targets apps in severe environmental conditions
The PRO BEAM connector series from Tyco Electronics is a fiber optic interconnect specifically designed for high data rate connections where resistance to severe environmental conditions is important.
2004-12-06 Interconnect system provides high density for high-speed signals
W. L. Gore & Associates introduced its new cable-to-board and cable-to-cable coaxial interconnect system.
2015-12-23 Interconnect system from ECT aimed at high-speed apps
The VG Mass Interconnect System acts as the connector interface between test instruments (PXI, VXI, LXI, GPIB, SCXI & PCI) and devices/units under test (DUT/UUT).
2005-10-13 Interconnect standards set to flourish, says In-Stat
Three emerging chip-to-chip interconnect standardsHyperTransport, PCI Express, and RapidIOare being included in integrated circuits and systems at an increasing rate and their use will grow over the next several years according to market research company In-Stat.
2013-04-23 Interconnect sol'n offers cloud scalability, high ROI
The ConnectX-3 Pro Adapter from Mellanox boasts hardware offload support for VXLAN and NVGRE, and enables cloud providers to build large-scale infrastructures with lower CPU overhead.
2008-07-04 Interconnect links processing, memory channels
Sonics Inc. rolls out a new chip-level interconnect technology, addressing what it says is a growing memory bandwidth problem faced by a broad range of people who develop video processors.
2003-04-23 Intel launches I/O interconnect labs in Beijing
Intel has announced the formation of I/O Interconnect Labs to allow the testing of next-gen interconnect technologies.
2006-11-10 Infineon test chip avoids vertical interconnect defects
Infineon claimed to be the 'first' to deliver the test chip for avoiding VIA defects in the production of highly integrated semiconductor circuits by a factor of 10.
2005-10-26 IC Interconnect announces Ni/Au process qualification
Wafer bumping service company, IC Interconnect has announced the qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications. The new process produces high-temperature stable bonds with a thinner gold layer. These wire bonds can be used in avionics and automotive apps, and does not require additional lead time for production.
2011-03-14 Hynix supports Sematech 3D interconnect program
By joining the 3D Interconnect program, Hynix hopes to help accelerate the commercialization of wide I/O DRAM and realize 3D's potential as an affordable path to IC production growth.
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