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2002-03-25 Hum and buzz in unbalanced interconnect systems
This application note discusses the causes of hum and buzz in unbalanced audio systems and offers tips on how to minimize them.
2014-12-08 Huawei, Imec join hands for high-bandwidth optical interconnect
The joint research on silicon-based optical interconnects is expected to provide benefits including in speed, power consumption and cost efficiency.
2013-04-02 HSAutoLink II interconnect system ready for 2.0Gbit/s
Molex's latest interconnect system supports USB 2.0, USB 3.0, LVDS, Ethernet AVB (Audio Visual Bridging), and modified HDMI, DVI and DisplayPort.
2003-02-26 Hitachi-IT licenses Sonics interconnect IP solutions
Sonics Inc., Hitachi Information Technology Co. Ltd, and Innotech Corp. have announced a business partnership and the licensing of the latter's SMART Interconnect IP solutions for use in complex SoC designs by Hitachi-IT.
2000-05-03 High-speed backplane interconnect solutions
This paper briefly describes the general performance characteristics of backplane systems and how best to select the connectors to yield a match between performance of the interconnect system and the backplane system.
2008-02-28 Functional interconnect chips cut development time, costs
IDT has launched a new family of CPRI-based functional interconnect chips that promise to reduce development time and cost, in part by offloading the translation and connection tasks from the current alternatives.
2004-10-26 Fujitsu expands high-speed interconnect system
Fujitsu added a new packaging option to its internal microGiGaCN mezzanine connector with the introduction of a right-angle surface mount plug connector.
2005-06-08 Experts mull interconnect beyond 65nm
A panel at the International Interconnect Technology Conference here examined the vexing question of the IC interconnect stack at 45nm and beyond
2011-08-24 Event showcases interconnect trends
The papers to be presented at the Hot Interconnects event reveals the divergence of technology roadmaps for networks used in supercomputers and data centers.
2009-05-12 Evaluating the integrity of LGA package, 2nd level interconnect for ?Module family of products
A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds industry reliability requirements for any application. When the LGA component interconnect was introduced, board level makers were given the task of incorporating the new component interconnect with their existing process.
2001-05-16 Effective interconnect space reduction formation
Significant technical progress has been made with newly developed materials and with the introduction of new components, this evolution has become possible. This paper describes the benefits of using microvias.
2004-10-04 Dow Corning, INVINT partner in interconnect processes
Dow Corning Corp. has signed a joint development contract with INVINT Ltd, a conductive polymer interconnect technology specialist.
2003-09-15 Darpa to fund optical interconnect research
IBM will team with Agilent Technologies to pursue fabled "terabit per second optical interconnect" technology for multiprocessing servers under a $30M effort backed by Darpa.
2004-09-01 Creating a third generation I/O interconnect
This paper looks at the success of the widely adopted PCI bus, and describes a higher performance next-generation I/O interconnect.
2012-04-26 Cray transfers interconnect hardware, IP to Intel
The supercomputer maker has signed a definitive agreement to sell its interconnect hardware development program and related intellectual property to Intel for $140 million but would retain certain rights.
2006-03-21 Coplanar interconnect targets ATCA Zone 3
Molex Inc. said the MTP-CPI is the only MT-ferrule-based interconnect designed specifically for coplanar applications.
2015-08-05 CoolCube 3D interconnect targets FinFET process
The research institute demonstrated the feasibility of CoolCube used to stack FinFET layers on its 300mm production line as well as with fully-depleted silicon-on-insulator manufacturing processes.
2001-01-01 Contract manufacturing and flip-chip interconnect design
This technical article describes present contract manufacturers' dilemma over the entire flip-chip manufacturing process. It also describes the use of a planarizing surface which provides a uniform surface to fabricate solder interconnect structures and redistribution metallization.
1999-12-13 Considerations when using the 66 MHz 21150 as an accelerated graphics port-peripheral component interconnect bridge
This document compares the PCI Local bus specification, Revision 2.1 and the AGP interface specification, Revision 2.0 as they apply to the 21150 PCI-to-PCI bridge. It highlights the relevant differences between these specifications, and indicates potential design issues where careful design considerations are warranted.
2009-04-01 Collaboration to drive interconnect solutions in autos
Altera and National Semiconductor are collaborating to drive the transmission, processing and display of digital data within automotive applications. The graphics interconnect solutions are being developing to address the growing use of digital video in automotive infotainment and driver-assistance applications.
2004-05-17 Co-design methodology for system interconnect
This article outlines a co-design methodology supported by a unique platform that enables design and analysis of the electronic system interconnect from IC to IC, across packages, connectors, backplanes and PCBs.
2006-04-27 Cinch unveils flex circuit interconnect solutions
Cinch Connectors has unveiled a solderless, board-to-board, interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system.
2005-06-01 Choosing the right interconnect
The march of technology has made it important for digital designers to use skills that were once only required of supercomputer engineers.
2005-07-18 Chip interconnect draws designers, too
The eighth annual ITTC opens to a growing and unfamiliar level of attention, the event has already begun to reach beyond its normal audience, attracting chip designers as well.
2011-07-01 China ramps USB 3.0 interconnect production
With the growing trend for faster data transmission in storage devices, connector and cable assembly makers in China are upping their production of USB 3.0 interconnects.
2000-12-01 Chemistry for the 0.13?m copper interconnect process
This technical article describes the advantages of the CUBATH ViaForm chemistry developed for the 13?m copper damascene process.
2005-05-02 Canadian system interconnect firm eyes Asia expansion
Tundra Semiconductor will invest heavily in the Asia-Pacific region, in hopes of boosting global sales by 50 percent.
2004-03-12 Cadence unveils "on-target" system interconnect
There is a major bottleneck between system interconnect design and today's complex ICs which delays time-to-market for electronics companies.
2004-03-11 Cadence platform accelerates interconnect design
The Allegro system interconnect design platform from Cadence is designed to accelerate high-performance, high-density interconnect design.
2002-09-01 Boosting interconnect bandwidth through HyperTransport
This technical paper discusses the advances of HyperTransport and how it provides scalable high-speed interconnection between Ics.
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