total search1910 articles
| 2006-07-20 | TSMC reference flow integrates Cadence platforms Cadence and TSMC announced the integration of the Cadence's Encounter digital IC design platform and Allegro system interconnect platform into TSMC's Reference Flow 7.0. |
| 2013-04-01 | Transceiver system ready for next-gen Ethernet standard FCI's single on-board transceiver system has a small footprint to save precious PCB real estate and offers different transceiver heat sink options to meet thermal application requirements. |
| 2012-12-24 | Tough UTL power connector handles up to 600V Souriau's UTL power connector is suited for the most demanding climates, withstanding all weather conditions, and UV radiation thanks to the use of a new moulded polyamide. |
| 2007-01-25 | Toshiba, Broadcom ink IP licensing deal with ARM ARM has extended its IP licensing deals with Toshiba and Broadcom, with the former agreeing to use ARM's PrimeCell products in its SoC designs, as well as the AMBA Designer tool. |
| 2004-04-01 | Toshiba unveils serial link cell agreement with Rambus Toshiba Corp. has signed an agreement with Rambus Inc. to incorporate the RaSer serial link cell technology from Rambus into the Toshiba 90nm process technology library. |
| 2004-02-18 | Toshiba licenses Rambus PCI Express PHY Cell Toshiba Corp. has licensed Rambus Inc.'s PCI Express physical layer (PHY) cell, part of Rambus' RaSer family of serial link technologies. |
| 2003-04-16 | Too many specifications confuse server design There seem to be more "industry-standard" technologies available than ever before for connecting together server sub-systems, but many of these technologies overlap. |
| 2003-04-30 | Tomen to support Intel R&D in China Tomen Corp. has collaborated with Intel Corp. to provide testing facilities in China that will evaluate emerging interconnect standards for use on Intel architecture server platforms. |
| 2003-11-13 | Tomen backs Fujitsu supercomputer project Tomen Corp. announced that the company has received an order from Fujitsu Ltd to deliver a high-speed computer interconnect system conforming to InfiniBand. |
| 2010-03-16 | Tiny interconnects handle 14A-23A per contact Samtec debuts PowerStrip/10 line of power interconnect solutions featuring an ultrasmall, space saving design and dual leaf blade contacts capable of carrying from 14A to 23A per contact. |
| 2001-04-15 | Timing closure in DSM design Timing closure has taken center stage as the toughest challenge for today's deep-submicron designs. Subsequently, the problem of accurate timing verification has become more important than ever before. Can engineers continue to predict the timing of ICs prior to manufacturing as technologies continue to scale? |
| 2004-10-22 | TI LIN transceiver provides 17kV, 12kV ESD protection TI developed a stand-alone local interconnect network transceiver for automotive applications with best-in-class ESD protection of up to 17kV and 12kV. |
| 2011-07-13 | Thunderbolt lacks efficacy to oust USB Thunderbolt provides attractive prospects but there are serious technical and economic disadvantages that should be checked. |
| 2000-05-03 | The opportunities for 1394-enabled PCs This paper describes the IEEE 1394 bus. It discusses the new applications for the IEEE 1394-enabled PCs. Additionally, the use of the 1394 standard in audio/video production studio environments is introduced. |
| 2015-05-07 | The clash of IoT IP policies: Intel vs Qualcomm How do the IP policies of Qualcomm-led AllSeen Alliance compare to Intel-led Open Interconnect Consortium (OIC), and how does the legality surrounding "free software" and "open source" affect you? |
| 2001-04-12 | The challenges of doing a PCI design in FPGAs This application note covers the issues Xilinx has discovered in doing PCI in FPGAs, how they have been surmounted and what the designer needs to think about when doing such a design. |
| 2004-08-02 | Testing SoC interconnects using boundary scan Delay violations occurring in the interconnects of high-speed SoCs can be tested using JTAG boundary scan architecture. |
| 2009-03-17 | Testing RF ICs with DigRF interconnects The content presented here covers four major areas—digital/physical, digital/protocol, RF/physical and RF/protocol—but focuses on the challenges of testing the RF ICs used in formats such as WiMAX and LTE. |
| 2005-05-12 | Teradyne, Gore to develop GbX cable assemblies Teradyne Inc.'s connection systems division has signed a licensing agreement with W. L. Gore & Associates Inc. to develop and manufacture high-speed cable assembly solutions for Teradyne's GbX interconnect platform. |
| 2005-10-12 | Teradyne sells connector division for $390 million Automatic test equipment company Teradyne Inc. has agreed to sell its connector division to Amphenol Corp. for $390 million in cash. |
| 2004-07-21 | Teradyne receives award for PCB production Teradyne Connection Systems' High Performance Circuits group has received the 2004 Customer Value Enhancement Award for its accomplishments in the PCB manufacturing and fabrication market at Frost & Sullivan's customer value enhancement awards banquet. |
| 2007-02-08 | Tektronix claims 'fastest' probes, scopes Tektronix Inc. touts its new family of active differential probes and four-channel real-time oscilloscopes as the world's fastest. |
| 2005-06-27 | Tektronix acquires test software supplier Test and instrumentation company Tektronix Inc. has acquired TDA Systems, a supplier of interconnect analysis software tools. |
| 2002-07-19 | Tegal joins the IC packaging alliance Tegal's membership is expected to strengthen APiA's position in the IC packaging and interconnect industry. |
| 2006-09-12 | Tech bonds different material-based elements without wire bonding Oki Electric Industry announced a new interconnect technology that allows bonding of different material-based device elements without using conventional wire bonding. |
| 2011-09-29 | Task force to enhance 100Gbit/s Ethernet The IEEE P802.3bj project aims to specify 100Gbit/s operations over backplanes to enable lower-cost, higher-density solutions. |
| 2009-09-07 | Tactile switches thrive in harsh environment C&K Components debuts tactile switches that are highly resistant to corrosion and chemical aggressions. |
| 2010-08-09 | System accelerates LS-DYNA car crash simulation A record performance was achieved on a Dell PowerEdge M610 with Intel Xeon X5670 chips and Intel Cluster Ready architecture networked by Mellanox ConnectX-2 InfiniBand adapters and switch. |
| 2005-06-08 | Synopsys enhances DesignWare with SATA addition Synopsys Inc. has added Serial ATA (SATA) verification intellectual property (VIP) to its DesignWare Library |
| 2006-11-10 | Surface-mount headers withstand 280°C Tyco Electronics has developed a line of RoHS-compliant surface-mount headers with 0.100-inch centerlines that can withstand up to 280°C soldering temperatures. |
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