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2008-04-08 Samtec tips networking products
Samtec Asia Pacific Pte Ltd has released its catalog of micro board-to-board, high-speed cable assembly, panel and I/O, power, rugged and custom high-speed transmission line interconnect solutions.
2002-02-12 Samtec micro interconnects made for blind mating
Featuring a 1.27mm pitch, the company's TFM and SFM series of micro interconnects are designed for applications requiring blind mating or a high number of mating cycles.
2002-02-14 Samtec interconnects function up to 5GHz
The Q-Pairs high-speed interconnects are fully-tested in 50-ohm or 100-ohm systems for impedance change, VSWR, crosstalk and propagation delay at frequencies from 10MHz to 5GHz.
2008-03-11 Samtec expands rugged wire cable offering
Samtec has added 1.27mm pitch Micro Mate Discrete Wire Cable Terminal assembly (TFSD Series) to its rugged discrete wire cable family.
2007-12-11 Samtec advances power offerings
Samtec has expanded its power board-to-board and cable-to-board interconnect systems with the addition of several new lines.
2008-02-26 Rugged discrete wire cable system rolls
Samtec has recently expanded its rugged Discrete Wire Cable family to include the 0.05-inch pitch Micro Mate Discrete Wire Cable Terminal assembly.
2013-11-07 Rockchip gains licences to ARM processor, GPU tech
The agreement gives Rockchip access to ARMv8-A and ARMv7 processors including the ARM Cortex-A57, Cortex-A53 and Cortex-A12 processors, the ARM Mali GPU family and ARM CoreLink technology.
2003-04-16 Robust designs cut vendor hype
Economic conditions combined with higher component and board integration needs are the factors that drive vendors to push for Express.
2002-10-17 Richardson to distribute Tyco products
Tyco Electronics has named Richardson Electronics as its authorized industrial electronic distributor in North America, Canada, and Mexico.
2002-08-27 RF series adds twin BNC model
The V-Bite RF edge board connector series from Bomar Interconnect Products Inc. now includes a twin BNC connector for video applications.
2002-01-16 RF Connectors rolls out Part 15-compliant reverse-thread connectors
The company has introduced a line of coaxial connectors and adapters that has been designed to meet FCC Part 15 regulations through the incorporation of reverse- or left-handed threads.
2003-01-07 RF connector snaps in without adhesive
Bomar Interconnect Products has expanded its E-Snap line of edge-board connectors with a low-profile MCX connector feature.
2002-08-22 Researchers offer alternative to common crossbar design
In a technical paper presented at the Hot Chips conference, Hong Kong University of Science and Technology (China) researchers offered an alternative pipeline approach to crossbar design.
2002-12-09 Researchers call for fundamental shift in timing analysis
Calling for a new approach to the design of digital circuits, researchers at the ACM/IEEE Tau workshop presented strong arguments for a move to statistical, or "probabilistic," timing analysis.
2006-06-16 Reining in IC power requires careful plan
Michael Burstein of Golden Gate Technology discusses tips on addressing power consumption as an integral part of any design methodology.
2007-02-05 Reference system: OPB PCI using the ML410 embedded development platform
This application note describes how to build a reference system for the On Chip Peripheral Bus Peripheral Component Interconnect (OPB PCI) core using the IBM PowerPC 405 (PPC405) Processor-based embedded system in the ML410 Embedded Development Platform.
2014-11-18 Reducing SoC power: Where should the focus be?
Typically, efforts to manage power consumption in SoC design are focused on the CPU and GPU. The SoC interconnect is one area that needs to be re-evaluated.
2011-10-19 Recent developments in 3D integration
Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed.
2013-07-19 RapidIO to overtake PCI Express in data centres
RapidIO will take the leap from wireless base stations to data centres as an enabler of everything from greener supercomputers to ARM-based microservers.
2004-09-02 RapidIO steps into data plane
The RapidIO Trade Association has finished two specifications considered key for using the packet-switched interconnect technology in data plane applications for communications systems.
2013-09-11 RapidIO based platform touts 20Gbit/s switching
The RapidIO-based reference platform from IDT supports up to 48 advanced mezzanine card based compute nodes per chassis, with intra-chassis backplane communication speeds up to 20Gbit/s.
2000-12-01 RapidIO architecture renders overall performance
RapidIO is a point-to-point packet-switched interconnect technology that is targeted primarily at networking, communications and high-performance embedded markets.
2003-04-16 RapidIO and PCI Express: so similar, yet so different
In this technical article, RTA president Sam Fuller attempts to dispel the myths and confusions surrounding two interconnect technologies - RapidIO and PCI Express.
2011-07-20 RapidIO 10xN enhancement to support 100Gbps
RapidIO Trade Association has released a technology roadmap to improve Serial RapidIO 10xN specifications that moves the protocol to serial lane speed of 10Gbps and supports higher speed.
2011-12-20 Rambus, ITRI team up for 3D packaging
According to the two organizations, they will work together as members of Ad-STAC to push system integration using silicon interposer technology.
2003-12-16 Rambus to purchase Velio assets
Rambus Inc., a developer of chip-to-chip interface products and services, has entered into an agreement with Velio Communications Inc. to acquire certain Velio signaling assets.
2010-12-03 Rambus files new round of patent suits
Two patent portfolios are involved in the suits, covering interconnects and memory interfaces and controllers, and involving Broadcom, Freescale, LSI, MediaTek, Nvidia and STMicroelectronics.
2009-05-28 Rambus details DDR4 DRAM roadmap
Rambus Inc. has unveiled a set of new and existing interconnect technologies it claimed will meet the needs of main memory in 2011 and beyond. It hopes the industry adopts the techniques as part of a pending DDR4 DRAM standard.
2004-06-07 R-NIC backers set up compliance lab
Backers of the R-NIC approach to enhanced Ethernet are forming a compliance and interoperability testing laboratory.
2002-01-22 R&D consortium eyes system-in-package substrates
Five Japanese companies have formed an R&D association to develop materials and technologies for high-density substrates that will be used in system-in-package devices.
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