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| 2004-04-22 | TEL test handler supports WLCSP, KGD technologies Tokyo Electron has developed the WDF DP test handler that supports the WLCSP and KGD packaging and test technologies. |
| 2008-09-08 | KGD Assembly This application note is relevant for any die product not packaged and at risk of exposure to UV light, plasma clean or X-ray during module assembly. In addition to KGD, Known Tested Die (KTD) and Non-Singulated Wafers are available for commercial and industrial applications. |
| 2002-04-22 | Ismeca tape-and-reel machine system determines KGD via single test The MP 630 tape-and-reel machine from Ismeca Europe SA is claimed to be first integrated testing, marking, and handling system capable of determining known good die (KDG) packages through a single test. |
| 2012-11-23 | 4MB flash memory assures 1,000hrs operating life TI's SM28VLT32-HT allows data logging at extreme temperatures and targets harsh environment applications including oil and gas exploration, heavy industrial and avionics. |
| 2006-05-24 | Spansion, ADI to provide memory solution for automotive apps Spansion announced that Analog Devices is combining Spansion KGD Flash memory with its Blackfin processor in a MCM for automotive applications. |
| 2011-03-11 | TI MCU endures extreme temperatures TI's SM320F28335-HT Delfino 32-bit floating-point MCU targets extreme applications such as downhole drilling, military applications, and medical and and surgical tools requiring sterilization. |
| 2003-04-10 | SUSS MicroTec, LNL collaborate on wafer optical probing solution SUSS MicroTec AG and LNL Technologies have agreed to jointly commercialize LNL's optical probe technology. |
| 2008-08-14 | SST updates serial flash line with 4Mbit offering Silicon Storage Technology Inc. has added a 4Mbit device to its 1.8V 25WF Series SPI serial flash memory family. |
| 2007-04-13 | Spansion, Qimonda to supply memory subsystems for mobile Spansion and Qimonda announced a strategic supply agreement that will combine Qimonda's low-power DRAM with Spansion's MirrorBit NOR and ORNAND devices into MCP memory solutions. |
| 2003-06-18 | Silicon Wave Bluetooth die provides high-density integration Silicon Wave's UltimateBlue 3000 radio processor and the SiW1712 radio modem are available as standalone bare die products. |
| 2007-07-24 | Qimonda ships samples of 75nm Mobile DRAM Qimonda is sampling its first 512Mbit Mobile DRAMs in 75nm geometries. |
| 2010-10-14 | Pseudo SRAMs join SRAM ease, DRAM density, cost The memory products cut the need for an external refresh controller, and offer partial array refresh, low standby current and deep power down modes that cut power use. |
| 2005-11-18 | M-Systems, Infineon sign supply agreement M-Systems and Infineon Technologies AG have signed an agreement on the supply of low-power Mobile-RAM for mobile devices. |
| 2009-06-10 | Low-power options for Async/Page CellularRAM This application note describes the low-power operational modes available on the asynchronous/page CellularRAM devices and the use of the ZZ# input in conjunction with the configuration register (CR) settings to control these modes. |
| 2003-03-05 | Etron PSRAM draws 45?A during standby Etron Technology Inc. has introduced a 16Mb Pseudo SRAM that draws a standby current of 45?A and exhibits a cycle time of 50ns. |
| 2011-12-08 | Designing 3D-ICs (Part 2) Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
| 2011-12-07 | Designing 3D-ICs (Part 1) Learn about the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
| 2003-07-28 | Cascade device enables more die per wafer Cascade Microtech has released its high-performance dc parametric pyramid probe cards that have the ability to contact small process control devices. |
| 2012-02-03 | Advances in 3D-IC testing Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution. |
| 2011-03-09 | 3D TSVs get boost from IMEC, Microtech Cascade Microtech and IMEC are working together to develop standards, test methods and methodologies for emerging 3D-TSV structures. |
| 2010-03-19 | 32Mbit mobile SDRAMs run up to 166MHz Integrated Silicon Solution Inc. is rolling out the latest members of its ultralow-power mobile SDRAM family that has an operating voltage of 1.8V, a maximum speed of 166MHz. |
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