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2013-05-30 Collaboration to yield low cost interposers for 2.5D ICs
A*STAR Institute of Microelectronics, Qualcomm Technologies and STATS ChipPAC teamed up to address issues related to high volume manufacturing of 2.5D interposers.
2003-04-01 Signature authentication brings new opportunities
Biometric signature authentication system can identify a person by using an electronic pen and extracting characteristic vectors of a person's signature.
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