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| 2013-05-30 | Collaboration to yield low cost interposers for 2.5D ICs A*STAR Institute of Microelectronics, Qualcomm Technologies and STATS ChipPAC teamed up to address issues related to high volume manufacturing of 2.5D interposers. |
| 2003-04-01 | Signature authentication brings new opportunities Biometric signature authentication system can identify a person by using an electronic pen and extracting characteristic vectors of a person's signature. |
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