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2006-07-20 System enables fully automated inspection of 300mm wafer surface
Vistec Semiconductor Systems announced that its new-generation LDS3300 enables fully automated inspection of the complete 300mm wafer surface.
2005-07-29 Leica system cuts ownership cost of semiconductor manufacturers
The new LDS3300 C from Leica Microsystems complements its LDS series by an innovative system, combining micro and macro defect detection at simultaneous use for all 300mm wafer apps
2008-06-23 Vistec inspection system touts 30% increase in utilization
Vistec Semiconductor Systems has added a new option called "Parallel Control Job" for its macro inspection product line LDS3300 that increases the system utilization by up to 30 percent.
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