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2006-06-20 LGA sockets target desktop, server MCUs
Tyco Electronics unveils its latest land grid array sockets targeted at desktop and server microprocessors.
2006-01-20 LGA coupler provides high directivity
AVX Corp. has developed a family of high directivity LGA termination couplers that delivers high-frequency performance in a small 0402 package.
2006-06-26 LGA capacitor offers very low ESL
AVX developed a land-grid array capacitor that offers extremely low equivalent series inductance.
2009-11-10 Land grid array (LGA) package rework
This application note describes rework considerations for the land grid array (LGA) style package. Freescale has introduced RF modules such as the MC1320x and MC1321x in LGA packages as an alternative package to BGA.
2001-06-07 Land grid array (LGA) handling, mounting and thermal considerations
This application note presents handling, mounting and thermal guidelines on land grid array (LGA) packaging.
2009-05-12 Evaluating the integrity of LGA package, 2nd level interconnect for ?Module family of products
A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds industry reliability requirements for any application. When the LGA component interconnect was introduced, board level makers were given the task of incorporating the new component interconnect with their existing process.
2009-11-16 Considerations for the application of land grid array (LGA) style packages
This application note describes general considerations for application of the land grid array (LGA) style packages. Freescale has introduced RF modules such as the MC1320x and MC1321x in LGA packages as an alternative package to BGA.
2005-07-13 Actel makes LGA package available to RTAX-S FPGA offering
Actel disclosed that it has expanded its package selection to include a Land Grid Array option for its RTAX-S FPGA family.
2008-04-08 .65mm LGA socket runs up to 60GHz
Ironwood Electronics has released the XG-LGA-7000 LGA socket for 0.65mm pitch LGA devices designed for a 12mm package size, and operates up to 40GHz with less than 1dB of insertion loss.
2001-04-01 Power distribution for high-performance processors
A new architecture not only addresses issues such as rising current transients, but also considers the limited space available for semiconductor devices and their associated power delivery systems.
2007-10-19 Low-profile 8A DC/DC regulator saves space
A complete 8A DC/DC ?Module regulator system with on-board DC/DC controller, power switches, inductor compensation and input/output bypass capacitors has been introduced by Linear Technology Corp.
2013-09-13 How to avoid PCB engineering change orders
Prevent engineering change orders in printed circuit board designs by paying attention to seven key areas where problems are likely to occur.
2004-11-26 ADDA CPU coolers rated at 115W
ADDA has released its latest series of CPU coolers designed for use with Intel's LGA-775 microprocessors.
2002-02-11 Vishay single-package dc/dc converters cut down on mobile space
Vishay Intertechnology's FunctionPAKs for cell phones, notebook computers and digital cameras are complete synchronous dc/dc converters in a single 20-pin BGA/LGA package measuring 14.7-by-12mm with a 1.8mm-high profile.
2013-06-13 Two-axis magnetic sensor operates from single 1.8V supply
MEMSIC's MMC246xMT Two-Axis Magnetic Sensor is provided in a miniature 2.0x2.0x1.0 mm. Land Grid Array (LGA) package and is capable of operating from a single 1.8 V supply.
2005-10-04 ST's latest acceleration sensors
STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm.
2007-01-15 SBC supports Intel's latest dual-core processor
Based on the Intel 865 chipset and LGA 775 socket, Portwell's new SBC supports the latest Intel Core 2 Duo dual-core processor.
2004-01-22 ASAT to provide flip-chip technology to Shanghai Fudan
ASAT Holdings Ltd and ASAT Inc. will provide flip-chip land grid array (LGA) technology to Shanghai Fudan Microelectronics Co. Ltd.
2008-04-18 Accelerometers fit for ultrasmall applications
STMicroelectronics has added two new accelerometers to its ultracompact portfolio of devices in 4mm x 4mm x 1.5mm LGA packages, with full-scale range selectable between 2g, or 6g for those super-small applications where high performance is required.
2010-09-21 15A DC/DC uModule regulator gives more power per mm2
Linear Technology introduced its LTM4627, a 15A DC/DC uModule regulator with onboard inductors, MOSFETs and supporting components in a 2.6g, 15 x 15mm and grid array (LGA) package.
2010-02-02 'Smallest' triaxial accelerometer handles 2g-16g
Bosch has released the BMA220 triaxial digital accelerometer, claimed to be the smallest at 2mm x 2mm x 0.98mm, a 55 percent reduction in surface area over current 3mm x 3mm LGA housings.
2007-03-30 Zigbee platform supports up to 20yrs battery life
Freescale's MC1322x Zigbee platform is engineered to support battery life of up to 20 years, doubling the expectations for current Zigbee solutions.
2007-01-11 XYZ-axis accelerometers roll for mobile CE apps
Freescale Semiconductor has unveiled three XYZ-axis accelerometers that provide motion-sensing for CE devices that require fast response times, low current consumption, low-voltage operation and sleep mode in small-profile packages.
2009-09-11 Xeon processors make intelligent PCs
Intel's new processors bring the Nehalem microarchitecture to mainstream desktop and entry server markets.
2010-10-27 Xeon gets embedded for flight
Mercury's Xeon embedded computer houses two quad-core Jasper Forest Xeon processors in an OpenVPX module for use in high-end radar, multi-sensor electro-optical/IR and other embedded applications.
2007-04-25 WiMAX front-end module targets 4G applications
JMD has launched the M30001 WiMAX front-end module intended for 4G multimode, multiband applications.
2002-06-17 Vishay buck converters deliver >100W/inch3 power density
Vishay Intertechnology Inc. has announced the release of its FunctionPAK series of synchronous buck dc/dc converters that measures a maximum 14.7-by-12.2-by-3mm and delivers a power density of >100W/in3.
2016-03-15 Vicor's 48V modules support Google's 48V server infrastructure
The modules allow for more efficient, dense, cost-effective and reliable power distribution, meeting what Google aims to promote as server and distribution infrastructure standard for data centers.
2010-09-16 Using LSM303DLH for a tilt compensated electronic compass
This application note describes the method for building a tilt compensated electronic compass using an LSM303DLH sensor module.
2012-10-08 u-blox unveils ultra-small GSM modules for M2M apps
u-blox's SARA module is is targeted at M2M applications requiring dual or quad-band GSM/GPRS, voice and/or data, optional Internet suite applications.
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