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2012-10-09 LPDDR2 to take up 70% of 2013 mobile DRAM shipments
With LPDDR2 prices breaking even with those of LPDDR1, shipments for LPDDR2 grew over 60 per cent of total mobile DRAM supply, in effect ensuring its status as a mainstream within the market.
2008-05-19 Hynix debuts 1Gbit device for LPDDR2 market
Hynix Semiconductor has introduced what it claims to be the world's first and fastest 1Gbit mobile LPDDR2.
2013-05-03 EDGE base band solution supports 400MHz 32bit LPDDR2
The RDA8810 integrates the RF transceiver, EDGE modem, 1GHz A5 applications processor, power management unit, analogue base band, and even the 32kHz oscillator, all onto one 40nm SoC.
2010-04-27 2Gbit LPDDR2 delivers 1066Mit/s transfer speed
Micron Technology Inc. has begun sampling a monolithic 2Gbit LPDDR2 memory chips designed to provide mobile products with improved battery life and speedier system performance.
2011-02-25 Vendors keen on pushing mobile DRAM to higher speeds
While 800- or 1,066MHz LPDDR2 devices could serve as a bridge to next-gen technologies, they could also push out other next-gen candidates.
2013-05-02 Samsung intros 4Gb LPDDR3 mobile DRAM
The 4Gb LPDDR3 can transmit data at up to 2,133Mb/s per pin, which is more than double the performance of LPDDR2) with a data transmission speed of 800Mb/s.
2011-02-25 Samsung chief discusses what's limiting PRAM adoption
Samsung's CEO admits that systems houses have been reluctant to adopt next-generation memory types in mass quantities because they are not compatible with today's technology.
2012-09-19 Samsung begins 2GB LPDDR3 mobile memory prod'n
Using 30nm class technology, the LPDDR3 can transfer data up to 1600Mb/s per pin, which is said to be about 50 percent faster than a LPDDR2 DRAM.
2012-05-28 PCM progress report no. 7: A look at Samsung's 8-Gb array
Here's a discussion on the features of Samsung's 8-Gb array.
2013-05-23 Mobile memory contract price decline eases amid tight supply
In Q2, the drop in mobile DRAM contract prices has eased, and price-competitive mainstream products such as LPDDR2 4Gb, 8Gb and 16Gb underwent price drops of less than 10 per cent QoQ.
2012-05-07 Mobile DRAM enters low profit era
Turning to mobile DRAM is a logical option, but with so many makers jumping on the bandwagon, Q2 mobile DRAM contract price has fallen by 10-15 percent QoQ.
2012-11-19 Micron memory skips a node, looks at 2Xnm process
Micron has skipped a generation of PCM before, introducing a couple of 128Mbit memories in a 90nm process in December 2008 before launching a 45nm 1Gbit PCM.
2011-12-21 JEDEC to release 3D IC standard
JEDEC will release in late December or early January 2012 the first 3D IC interface standard.
2013-08-15 Global mobile DRAM revenue in Q2 grows 11 per cent QoQ
Along with inventory stocking for the coming sales season, mobile DRAM revenue approached $3 billion in Q2, comprising 34 per cent of total DRAM revenue.
2007-11-05 Elpida announces 512Mbit DDR2 Mobile RAM
Elpida Memory, Inc. announced that it has developed the world's first 512Mbit DDR2 Mobile RAM operating at an ultra-low voltage of 1.2V.
2009-04-09 New standard to reduce handhelds' power consumption
JEDEC Solid State Technology Association has announced the publication of JESD209-2 LPDDR2 Low Power Memory Device Standard. The standard will enhance the design of mobile devices by enabling increased memory density, improved performance, smaller size, overall reduction in power consumption as well as a longer battery life.
2008-08-01 Mobile memories advance to lower voltage use
Low-power DDR2 (LPDDR2), a next-generation low-power memory technology for mobile and embedded designs being defined by companies participating in JEDEC standards, offers higher speed, lower-voltage operation, larger capacities and lower pin count than the current generation. This lets NVM share the same bus as SDRAM.
2011-11-29 DDR3 mobile RAM touts 6.4GB/s data transfer rate
Elpida's 30nm LPDDR3 claims to consume 25 percent less power and has data transfer rate twice as fast than LPDDR2.
2008-05-02 Work underway on mobile DRAM interface spec
The Serial Port Memory Technology Working Group has been formed to devise an open standard for a next-generation DRAM interface technology in mobile products.
2012-03-09 Wide I/O driving 3-D with TSV
Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks.
2014-03-28 WCDMA baseband addresses low-end smartphone market
The WCDMA baseband SoC from RDA is based on a 1GHz ARM Cortex A5 processor, and integrates several components including RF transceiver, WCDMA modem and EDGE modem
2015-05-11 Verilog-AMS vs SPICE view for DDR, LCD verification
In this instalment, we comparatively analyse the usage of both views from the perspective of DDR interfaces, LCD controllers and on-chip memories.
2012-08-22 Unified 3G platform supports TD-SCDMA, WCDMA
Marvell's PXA988 and PXA986 integrate high-performance, 1.2GHz dual-core processors with cellular modems to support advanced multimedia capabilities consumers demand for their mobile devices.
2011-11-08 TI exec discusses Omap future
TI sees the future of mobile applications processors as capable of handling neuro, fuzzy-based and even humanistic intelligence.
2010-08-06 Thermal implications for die stacks
This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2015-02-12 Synopsys rolls out DDR Explorer for memory sub-systems
Using DDR Explorer, designers can analyse their DDR memory sub-system and optimise their architecture to increase efficiency by up to 20 per cent, while achieving 10 times faster turnaround time.
2010-09-24 Smartphone memory problems down the road
Smartphone makers face several new challenges on the memory front, especially as mobile products become more sophisticated and data-intensive, says RIM.
2012-05-29 Smartphone makers spend less on DRAM
IHS iSuppli reports that while smartphones are using more DRAM, the share of DRAM in the total cost of the phones has declined sharply due to its falling price.
2009-06-26 Samsung, Numonyx tie-up on PCM
Samsung Electronics and Numonyx are cooperating on market specifications for phase change memory p change memory (PCM) products.
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