Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > Logic Module

Logic Module Search results

?
?
total search491 articles
2006-01-13 Using software synthesis for multiprocessor OS and software development
The next great revolution in computer architecture is certain to be multiprocessing, just as it has always beenalways right around the corner.
2012-05-03 Use FPGAs to harness potential of flash for enterprise apps
The design challenges associated with flash are readily addressed via deployment of FPGA-based PSM for memory management and I/O.
2006-03-31 Tyco DC/DC converters suit IBA apps
Tyco Electronics Power Systems Inc. announced the EUK240 series of DC/DC converters, which provides 240W of output power in an eighth-brick package.
2004-01-21 Two IP vendors pave the road to low power
The push for low-power ICs in advanced processes has produced little consensus beyond the notion that no single fix will do.
2015-01-12 Turning tiny, boring designs into fun tasks
In this article, we explain how letting analogue do much of the work can simplify the task of adding some functionality to a control system.
2003-04-23 TSMC will expand test, assembly services to spur demand
In an effort to remove barriers to chip production, Taiwan Semiconductor Mfg Co. will announce an expansion of its test and assembly services and additional guidance for chipmakers on how to prevent manufacturing delays.
2012-10-16 TSMC preps CoWoS test car with JEDEC Wide I/O DRAM Interface
The company's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component.
2007-08-23 TSMC begins 0.13? embedded flash production
Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has qualified its 0.13? embedded flash process and has entered production.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2002-05-17 Toshiba to license MeP-based MPEG-2 codec
Toshiba Corp. has developed a single-chip MPEG-2 MP@ML codec based on its configurable Media Embedded Processor architecture.
2004-07-13 Toshiba photocoupler supports up to 400ns
Toshiba America Electronic Components introduced a high-speed, high-gain photocoupler that supports signal transmission and switching speeds up to 400ns.
2015-12-22 Top 10 innovative products of 2015
Many companies have introduced products in preparation for the growing IoT. There are also innovations in computing devices, where chips have not only become smaller but more powerful as well.
2005-11-28 TI's new unregulated DC/DC converter with 17V output
Texas Instruments' new 1W isolated, unregulated DC/DC converter operates from a 5V input and features dual 17V outputs.
2006-06-16 TI unveils DaVinci-based development kit
TI's new digital video software development kit provides designers greater access to its DaVinci video technology.
2005-07-01 TI offers new jitter cleaner with 'lowest phase in class noise'
Texas Instruments Inc. recently unveiled a clock synthesizer and jitter cleaner that offers one of the lowest phase noise and jitter in its class. According to the company, this new product addresses customers' growing requirement for higher performance and increased design flexibility in applications such as 2.5G/3G wireless base stations, data communications, medical imaging, and test and measurement.
2008-10-15 The PC/104 evolution: PCIe in the mix
The PC/104 bus is an ISA-compatible, 3.550-inch x 3.775-inch, stackable board-level architecture that evolved from the MiniModule mezzanine bus fielded by Ampro Computer in 1987 and was standardized under the auspices of the PC/104 Consortium in 1992.
2014-03-27 The move to 100A at POL and beyond
While current demand is beginning to exceed the 100A level at the point of load, adopting a SEPIC-fed buck topology could prove useful in improving power conversion efficiency and transient response.
2015-09-28 The lowdown on MIPI D'PHY RX
MIPI D'Phy, a physical serial communicating layer connecting the application processor to the display device or the camera, offers advantages as the physical layer. Learn more about it.
2013-12-23 The lowdown on high-perf timing in board design
Know the various scenarios facing board designers when working with high-performance timing.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2005-09-01 The basics of implementing DSP functions on low-cost FPGAs
For cutting-edge designs where cycles are tight, requirements are fluid, and expected volumes are uncertain, system companies implement most core functionality and DSP in low-cost FPGAs.
2008-01-21 Tested, effective methods for optimizing DSP algorithms
This article describes the optimization process basics and various practical 'C' level skills needed to accelerate an algorithm. Processor and complier specific options are excluded as they are typically found in the respective vendor documents.
2006-11-22 Test solution rolls for Obsai base station interfaces
Elektrobit claims the first commercial test solution to provide comprehensive support for verifying the functionality and performance of Obsai RP3 and RP3-01 interfaces.
2008-03-19 Test solution rolls for DDR2, DDR3 SDRAM
Tektronix has released a comprehensive test tool set for DDR2 and new DDR3 SDRAM technology, developed to deliver higher performance data rates.
2010-11-04 Test dev software, PXI, FPGA products launched
Geotest updates ATEasy and launches new PXI digital & FGPA products.
2015-07-22 Tearing down Hynix's high bandwidth memory
In this article, we explore the composition of Hynix's high bandwidth memory (HBM), which addresses bandwidth limitations with DDR4 type SDRAM and DDR5.
2012-11-14 Teardown: The 4th-Gen iPad unraveled
UBM TechInsights takes a peak into what makes Apple's 4th generation iPad tick.
2010-05-14 Take a peek inside Apple's A4 processor
UBM TechInsights has analyzed the iPad and the A4 to establish some facts about the product and the processor.
2011-12-05 Taiwan's solar end market foray, not a sunny one
With rising deficits since the beginning of the year, solar cell makers in Taiwan face compounding pressures from the price squeeze and end market challenges.
2002-08-12 Taiwan prepares for MEMS technology battle
Taiwan is looking to repeat its success with semiconductors by tackling both the design and manufacture of microelectromechanical systems.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top