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2003-06-29 Zone plate signals 525 lines Standard M/NTSC
This application note talks about the characteristics of zone plate signals in NTSC and their importance in providing valuable information on analog systems and components.
2004-01-05 Yifeng optical fiber has 1,000?m(?) core
Shenzhen Yifeng Electronics Co. Ltd has announced the availability of its Q-119 optical fiber with a polymethyl methacrylate core.
2003-03-12 Yi-Phone TFT-LCD exhibits 350cd/m? brightness
The YIP 7901 7.9-inch TFT-LCD of Yi-Phone Inc. provides a resolution of 1,440-by-234 pixels and a minimum brightness level of 350cd/m?.
2008-09-05 X-Fab Sarawak all set to start 0.35?m process tech
X-Fab Silicon Foundries' Malaysian facility in Kuching, Sarawak, with its 200mm production line, now is fully qualified for volume production and second sourcing of the company's 0.35?m high-voltage process technology called XH035.
2014-05-20 Wireless M-Bus software streamlines smart meter designs
The Wireless M-Bus software solution includes a comprehensive sub-GHz wireless protocol stack that supports the S, T, C and N modes from the physical layer to the application layer.
2015-05-29 What's the deal with the Avago-Broadcom M&A?
This merger begs a big question: Where will Broadcom integration vision turn? Will Broadcom's team be allowed to sustain its discipline in execution? Most important, will Henry Samueli stay?
2004-02-20 Virage to support DongbuAnam 0.13?m CMOS processes
DongbuAnam Semiconductor and Virage Logic Corp. have entered into a licensing and royalty-bearing agreement that provides for the delivery of Virage Logic's technology-optimized platforms for DongbuAnam's new 0.13?m CMOS processes.
2004-01-14 Vimic metal tube in-surface roughness >0.5?m
Vimic Electronic Corp. has announced the availability of a hollow metal tube that is made from nickel alloy material.
2014-07-28 Utilising ARM Cortex-M based SoCs (Part 2)
The second instalment compares the capabilities of a standard microcontroller approach to the design of an embedded application to that of a system on chip approach.
2014-07-17 Utilising ARM Cortex-M based SoCs (Part 1)
Learn how internal SoC peripherals, such as an op-amp, ADC, PWM, and most importantly a processor core, are used to develop a system with the least number of components on the PCB.
2002-01-18 UTAC teams up with M-Systems on MCPs
United Test and Assembly Center Ltd (UTAC) is collaborating with M-Systems to deliver MCP (Multi-Chip Package) leaded and array packages.
2007-07-09 UMC, Melexis develop 0.18?m embedded flash for cars
Melexis and UMC have collaborated to deliver chips using the latter's 0.18?m eFlash process and eFlash macro, aimed at various automotive applications.
2006-12-12 UMC, Integrand expand collaboration to 90nm, 0.13?m RFCMOS
Integrand Software and UMC announced that their ongoing collaboration has resulted in enhanced capabilities for RF/mixed mode IC designers designing into 90nm and 0.13?m nodes.
2005-03-09 UMC makes Virage embedded memories using 0.18?m process
United Microelectronics Corp. (UMC) and Virage Logic Corp. have announced the availability of Virage Logic's patented non-volatile electrically alterable (NOVeA) embedded memories for production on UMC's 0.18?m CMOS logic process.
2005-02-04 UMC adopts Magma extractor tool on 0.13?m process
United Microelectronics Corp. (UMC) has validated Magma Design Automation Inc.'s QuickCap NX extractor tool on its 0.13?m process.
2005-03-02 UMC 0.13?m HS process developed JMicron Serial ATA II PHY core
United Microelectronics Corp. (UMC) and JMicron Technology Corp. revealed that JMicron's Serial ATA (SATA) II PHY Technology has been developed and proven on UMC's 0.13?m HS (high speed) process.
2012-07-27 UCSB fellows develop the first m-plane nitride based nonpolar VCSELs
The first violet nonpolar m-plane VCSEL based on gallium nitride, developed and demonstrated at UCSB, marks new chapter in laser technology.
2005-11-28 Two-leaded SC-79 package now available from M/A-COM
Many of M/A-COM's high volume discrete diodes are now offered in the SC-79 small surface mount package, which are RoHS compliant and meet the 2600C maximum rating often required for Pb-free processing.
2004-09-24 TSMC registers 1 million wafers using 0.13?m tech
Taiwan Semiconductor Mfg Co. (TSMC) has reached the one millionth mark in its shipment of 8-inch equivalent wafers made with the company's 0.13?m technology.
2007-06-27 TSMC qualifies Magma Quartz tech for 65nm, 0.13?m
Magma Design Automation Inc. announced that Taiwan Semiconductor Manufacturing Co. has qualified Quartz RC extraction technology files for 65nm, 90nm and 0.13?m designs.
2004-11-26 TSMC moves 40V 0.18?m process to volume production
Taiwan Semiconductor Mfg Co. Ltd said Tuesday (Nov. 23) that it has a 40V, 0.18?m, manufacturing process in volume production.
2004-12-28 TSMC 0.18?m, 0.13?m processes required in mainland China
Chipmaker Taiwan Semiconductor Mfg Co. (TSMC) recently announced that it sees a necessity of putting up advanced processes in mainland China despite restrictions from the Taiwan government.
2006-03-28 Transmitter, T&M solutions focus on mobile TV standards
The test and measuring equipment and transmitter from Rohde & Schwarz aim to address new future-oriented standards such as DVB-H, MediaFLO and T-DMB.
2002-03-14 Tower yields first 0.18?m wafer output
Israel wafer manufacturer Tower Semiconductor Ltd has produced its first 0.18?m wafer output from its Fab 2 pilot line with higher-than-expected yields.
2004-07-23 Tower stays with Virage for 0.13?m libraries
Israeli foundry chip maker Tower Semiconductor Ltd has signed a licensing agreement for Virage Logic Corp. to provide semiconductor intellectual property for Tower's 0.13?m CMOS manufacturing processes, Tower said Tuesday (July 20, 2004).
2005-09-21 Tower Semicon produces SanDisk memory controller using 0.18?m technology
Tower Semiconductor Ltd is manufacturing SanDisk Corp.'s memory controller at its 0.18?m technology platform.
2005-04-15 Tower Semi debuts 0.18- and 0.13-?m libraries
Pure-play independent specialty foundry Tower Semiconductor announced the introduction of its in-house set of 0.18?m and 0.13?m design libraries.
2006-08-04 Tower inks MOU with SanDisk on 0.13m process
Tower Semiconductor has signed an memorandum of understanding with SanDisk Corp. to invest in the expansion of its 0.13 logic wafer capacity.
2003-02-28 Toshiba Flash disk uses M-Systems technology
Toshiba Corp. has announced the development of the Mobile DiskOnChip G3 Flash disk, which is touted to be the first memory based on MLC NAND Flash.
2005-11-25 Toshiba denies OneNAND plans, backs M-Systems
Toshiba Corp. has denied that is considering or has any plans to license OneNAND flash memory technology from South Korean chipmaker Samsung Electronics Co. Ltd and has reiterated its support for M-Systems Flash Disk Pioneers Ltd.
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