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2007-01-11 Rad-hard 16Mbit SRAM MCM suits space apps
Atmel's new 16Mbit SRAM is packaged in a hermetic MCM for space applications, and was produced on the company's radiation-hardened 0.25?m CMOS process.
2001-08-01 Few-chip packaging: An MCM renaissance
Kevin Rinebold explains how FCP is a more attractive risk management strategy than SoC for combining IP from multiple sources or mixed semiconductor technology.
2002-06-18 Ericsson Bluetooth MCM is 70 percent smaller
Ericsson Microelectronics' ROK104001 Bluetooth multichip module is 70 percent smaller than its predecessor and is designed to speed time-to-market by enabling designers to implement qualified and tested alternatives to chipset solutions.
2001-05-07 EDI's x32 MCM-L SRAM family: Integrated memory solution for TMS320C3x DSPs
This application note shows how the benefits of current memory modules can be taken advantage of in a system design using Texas Instrument's TMS320C3x DSP family.
1999-11-01 EDA tools for high-performance MCM
In this paper we discuss a high density interconnect design methodology and describe the Tanner MCM Pro integrated MCM and IC design environment which combines strong features of both IC and PCB approaches to EDA and addresses shortcomings of existing tools and design flows.
1999-11-27 16M(512K32) flash memory MCM typical operating curves for Icc
This application note describes the ACT-F512K32 Flash module. This note presents the active operating currents during read, program, and erase modes of the device.
2000-11-01 Ultrafine-line lithography for next-gen apps
This technical article describes the ultrafine-line technology applied by researchers at the Georgia Institute of Technology for next-generation silicon device technology.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2001-10-01 Thin-film process enables low-cost MCPs
This technical article describes a low-cost multi-chip packaging (MCP) technique with appropriate expansion that triples volume capacities.
2016-03-15 The endless pursuit of smaller packages
In this article, we explore the creativity in semiconductor package integration, while anticipating the release of the Samsung's Galaxy S7 and the iPhone 7.
2001-04-15 Solder flux jetting technology
Advances in jetting technology improve film thicknesses and provide excellent edge definition in selective flux applications.
2006-01-12 Sirenza, Digi-Key ink distribution agreement
Sirenza Microdevices and Digi-Key have signed a worldwide distribution agreement, which stipulates that Sirenza's products will be featured in Digi-Key's printed and online catalogs and will be available for purchase directly from Digi-Key.
2008-09-18 Power supplies are ready for military tasks
XP Power launches the MCM series of rugged, metal-cased convection cooled power supplies that are for deployment in harsh and physically demanding environments.
2004-02-03 Phoenix to take 10 percent of Day Shine
Phoenix Precision Technology Corp. will acquire 10 percent of Day Shine Technology Inc.'s paid-in capital which is worth NT$230M.
2005-09-27 Multichip module broadens its dc-dc horizons
Addressing the demand for higher current and higher frequency power solutions for dc-dc converters, Toshiba America's TB7001FL multichip module (MCM) combines a driver IC with a MOSFET and the company's MOSBD, a single-die combination of a power MOSFET and a Schottky barrier diode, in one package measuring just 8-by-8-by-0.85 mm.
2004-06-16 Module approach ups 5GHz WLAN front-end integration
This article describes a single-package 5GHz WLAN RF module comprising a BiCMOS IC, commercial GaAs PA and Tx/Rx switch, high-quality integrated RF filters and a patch antenna.
2007-03-19 MMIC power amps target military, space amps
Hittite Microwave announced five GaAs PHEMT 1W and 2W MMIC power amplifiers that cover the 6-13GHz range for point-to-point and point-to-multipoint radios, test instrumentation, military and space applications.
2002-01-16 Making the leap to 4G wireless
While 3G has not quite arrived, designers are already thinking about 4G technology. With it comes challenging RF and baseband design headaches.
2004-10-01 Ensuring structural integrity in hybrid modules and MCMs
The structural integrity of hybrid circuits and MCM modules is critical to their long-term reliability since they are often used in harsh environments.
1999-06-29 Design of multi-channel modem for remote access server
This paper describes a scalable architecture, in terms of hardware and software, using Motorola's powerful digital signal processor DSP56303 for multi-channel modem (MCM) application in the remote access server.
1999-12-17 Design and fabrication of a high-speed multichip module
This paper will report on the design and fabrication of a Multichip Module (MCM) using affordable software tools developed by the company and fabricated through the MIDAS wafer sharing brokerage service of USC/ISI.
2003-09-05 Chipmos to expand FBGA, TSOP monthly outputs
Chipmos Technology will be expanding its FBGA packaging devices by 100 percent this month.
2001-04-01 Back-end copper metallization for flip chip
The IC industry's move toward the broad implementation of copper for back-end metallization is being driven by cost reduction that results from the use of an electroplating process.
2006-05-24 Spansion, ADI to provide memory solution for automotive apps
Spansion announced that Analog Devices is combining Spansion KGD Flash memory with its Blackfin processor in a MCM for automotive applications.
2009-06-15 Power quad flat pack no-leads (PQFN) board mounting application note
This application note contains guidance applicable to Power QFN package. There are device outlines, substrate layouts and stencil designs for Power QFN MCM.
2000-03-07 Pantheon installation notes for Windows 95/98/NT
This application note describes in detail the installation of the Pantheon software for PCB, Hybrid, and MCM design applications.
2001-09-11 MIL-PRF-19500 Qual chips versus MIL-PRF-38534 Qual chips
This application note defines two qualification levels in purchasing discrete chips for use in highly reliable hybrid and MCM systems.
2006-11-01 MEMS resonator operates at 5.1MHz
The SiT0100 MEMS resonator from SiTime measures 0.8(H)-by-0.6(W)-by-0.15(T)mm, and is compatible with standard semiconductor packaging for SIP and MCM.
2001-09-13 Frost-free environment for the thermal testing of high performance MCMs with RF circuitry
This application note describes a frost-free enclosure, with plug-and-play ATE interface, for the thermal testing of high-performance multichip module (MCM) with RF circuitry.
2012-11-20 Yoshida: Can Renesas be saved by the Wii U?
Junko Yoshida offers analysis on the upcoming launch of Nintendo's Wii U console and how Renesas will be impacted by its sales.
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