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2007-09-19 Tiny strip connectors offer hyperboloid contacts
Hypertac has announced an ultra-miniature high density RD strip connector for PCB connections designed for particular use in aerospace and defense applications.
2012-04-02 TI expands IC packaging options with bare die
The bare die program allows customers to order small quantities as low as 10 pieces for initial prototyping purposes, and larger quantities of full waffle trays for production purposes.
2008-10-14 Slump marks EDA earnings in Q2
The EDA Consortium Market Statistics Service revealed that the EDA industry revenue for Q2 08 declined 3.7 percent to $1357.4 million, compared to $1408.8 million in Q2 07.
2009-06-16 Power QFN technology inspection application note
This application note contains guidance applicable to Power QFN package.
2011-08-29 Placement system touts high-speed die bonding
Single machine solution eases IC manufacturing with die bonding speeds at 3,500cph per head at 25?m.
2004-04-01 Optical switch benefits from off-chip drive
As more electrostatic MEMS-based optical-switch products penetrate the market, scalability, reliability and tilt precision take on increased significance.
2008-01-10 NI unrolls sound, vibration tools for interactive DAQ
NI has announced the NI Sound and Vibration Measurement Suite Version 6.0 and the NI PXI-4495, its newest 16-channel DAQ module for sound and vibration.
2013-09-25 NAND flash, combo radio device in 5s notable
TechInsights points out significant changes to the NAND flash and combo radio connectivity solution in the iPhone 5s.
2003-06-12 Mentor PCB acquisition boosts packaging design
The ongoing consolidation of the PCB CAD marketplace has resumed, as Mentor Graphics announced its purchase of the assets of Dansk Data Electronik-EDA A/S.
2015-03-19 Marvell pushes for FLC-MoChi approach
Marvell President Weili Dai explained that the FLC-MoChi approach will significantly reduce the cost, power and size of electronics systemswhether PC, server, smartphone or wearable.
2008-09-16 Manage growing complexity in automotive design
Electric power windows have become one of the standard features in cars today. Most car buyers see power window as a must-have comfort feature. While the current trend for doors is towards a modular and lightweight approach, another growing trend is toward the inclusion of side airbags in the car. Such increased reinforcement and added components of the airbag function drive the need to achieve a smaller footprint for the door/window-lift ECUs. Higher integration delivers the key to manage increasing complexity like anti-pinch functionality.
2010-05-31 Malaysia's Unisem sets sight on China market
Malaysia IC-packaging and test specialist Unisem plans to expand in China, develop an automotive expertise and look for acquisitions in the market.
2012-05-09 LeCroy launches 65GHz oscilloscope on the road to 100GHz
LeCroy pushes its LabMaster 10 Zi oscilloscope line from 60GHz to 65GHz, on its way to the 2013 release of its 100GHz real-time bandwidth oscilloscope.
2013-02-14 Is the demise of high-speed I/O near?
High-speed serial interfaces featuring equalisation may be the norm in the future, and high levels of SoC integration may no longer be the best solution.
2014-02-04 Intercept, Moss Bay EDA reveal low-cost EMC sol'n
The software solution pairs the EMSAT post-layout EMC and SI design rule checkers with a customized Pantheon EMSAT Viewer that displays each violation on the board in real-time.
2010-10-12 IMI finalizes acquisition of PSi
Integrated Micro-Electronics, Inc. announced its purchase of a 56-percent stake in PSi Technologies Inc, an independent Philippine semiconductor assembly and test services provider.
2006-06-01 IC design curve slowing down in Korea, Taiwan
Korea and Taiwan IC design industries made little progress in 2005, according to the IC Design House Surveys conducted separately by EE Times-Korea and EE Times-Taiwan in February this year.
2005-01-07 Hittite GaAs LNA spans 17GHz to 26GHz
Hittite announced the HMC517, a high dynamic range GaAs PHEMT MMIC low noise amplifier which covers the 17GHz to 26GHz frequency range.
2002-07-08 Hitachi mobile phone processor targets camera-equipped phones
Hitachi Ltd has announced the release of the SH7294 SuperHTM mobile application processor that incorporates enhanced camera-support and display functions.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2003-09-29 EDA revenue growth returns, says EDAC
For the first time in over a year, the EDA industry has returned to positive year-over-year revenue growth, according to EDAC's MSS.
2012-01-16 EDA posts 18% YoY sales growth
Industry revenue increased 18.1 percent for 3Q11 to $1543.9 million, compared to $1307 million in 3Q10.
2008-07-07 EDA market shows signs of weakness
The EDA Consortium Market Statistics Service announced that the EDA industry revenue for Q1 declined 1.2 percent to $1,350.7 million compared to $1,366.8 million in Q1 07.
2002-04-03 EDA industry revenues topped $4 billion in 2001
Electronic design automation has become a $4 billion industry, according to the latest report from the EDA Consortium's Market Statistics Service.
2002-01-04 EDA industry revenues rise 9 percent
The EDA industry revenues for the Q3 of last year reached $987 million, a 9 percent increase from Q3 in 2000, according to the EDA Consortium's Market Statistics Service (MSS).
2014-04-21 DRAM interfaces see favourable future
Wide-IO promises to provide a wider, faster bus for communication, while reducing interface power consumption to a fraction of today's level.
2011-11-10 Designing domain-driven device clouds using Monte Carlo methods
A class of computational algorithms from the Manhattan Project can help you calculate the result of complex processes using random variables in the device cloud.
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2005-07-28 Contactor combines high current rating with low cost for auto apps
Capable of carrying 500A, the new KILOVAC brand LEV200 contactor from Tyco Electronics targets power switching apps in electric and hybrid electric vehicles, forklifts, trains, generators and welding equipment.
2004-10-25 Cadence releases next-gen HW-based verification system
Cadence Design Systems Inc. released its Palladium II system, an integral part of the company's Incisive functional verification platform.
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