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2007-04-27 SanDisk, Qimonda to develop MCPs for mobile apps
SanDisk Corp. and Qimonda AG signed an agreement to jointly develop and manufacture MCPs that target the growing market for high capacity, integrated memory solutions in data-intensive mobile applications.
2005-02-24 Samsung commences production of MCP for mobile apps
Samsung Electronics Co. Ltd revealed that it is mass producing what it claims to be the largest-capacity multi-chip package (MCP).
2006-12-18 MCPs drive today's handhelds
The adoption of multichip packages (MCPs) in such mobile systems as cellphones, digital cameras and MP3 players is nearing its peak, according to market research firm Portelligent
2007-04-16 1Gbit mobile DRAM, CMOS sensors aimed at cellphones
Micron Technology Inc. introduced a new line of CMOS image sensors for camera-based cellphones, as well as what it claims is the industry's 'first' 1Gbit mobile DRAM for multifeatured handsets to be based on a 78nm technology
2007-01-01 Samsung piles chips for thin MCPs
Samsung Electronics' advanced packaging technology piles 16 chips on top of each at an unbelievable height of only 1.4mm.
2002-05-02 Toshiba chip package is 30 percent smaller
Toshiba Corp. has announced that it has developed a stacked multi-chip package (MCP) that measures 7-by-10mm30 percent smaller than the company's current MCPs that measure 9-by-12mm
2005-05-26 Micron DDR devices offer increased reliability over standard DRAM
Micron launched a family of Mobile DDR devices, with product samples of multiple densities now available
2006-05-16 Advanced memories still struggle in mobiles
Memory research managers themselves have scaled back their rhetoric in the past, avoiding the term universal memory altogether. Freescale, Intel and Texas Instruments are dealing with memory designs.
2002-05-16 Flash, SRAM meld in multichip packages
Integrated Silicon Solution Inc. and Silicon Storage Technology Inc. have each tucked Flash with SRAM into multichip packages (MCPs
2014-11-05 Rethinking memory design for IoT and wearables
The space, power and application requirements of wearables and other mobile connected devices that collectively make up the growing IoT ecosystem require a fresh approach to system design
2007-06-26 Flash memory supports SLC, MLC on same chip
Toshiba Corp. and Toshiba America Electronic Components Inc. has unveiled a new series of embedded NAND flash memories for mobile phones offering both a configurable single-level cell (SLC) memory area and a multilevel cell (MLC) memory area
2010-06-11 STT-RAM geared to displace DRAM, flash
Grandis Inc. has updated its STT-RAM roadmap with some ambitious efforts in mind: It hopes to replace DRAM, and eventually, NAND, with its next-generation MRAM.
2010-09-13 Smart phone memory chips pioneer e-MMC 4.41 spec
The latest Samsung moviNAND embedded memory chips enable more efficient processing of orders with a high-priority interrupt feature that cuts latency.
2003-01-08 NEC samples 256Mb NOR Flash memories
NEC Corp. has announced that it is sampling two 1.8V NOR-type Flash memory devices that have a capacity of 256Mb.
2005-07-15 NOR continues to battle NAND flash memory in the handset
The features built into the handset should determine the flash memory choice.
2009-12-21 64Gbyte NAND flash packs dedicated controller
Toshiba Corp. launched a 64Gbyte embedded NAND flash memory module, claimed to achieve the highest capacity yet in the industry.
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