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2006-01-18 UMC offers 90nm MPW service via Europractice
The Europractice IC service operated by the Interuniversities Microelectronics Center is now offering access to 90nm CMOS manufacturing on multiproject wafers from UMC
2007-05-01 MPW eases analog/mixed-signal design
By understanding the nature of MPW services and adapting your design methodology to take advantage of them, you can save weeks or months of development time in getting a chip to market
2007-02-19 HeJian partners with Beijing IC Design Park on 0.18?m service
HeJian Technology (Suzhou) Co. Ltd will team up with Beijing IC Design Park to unveil multi-project wafer service
2014-02-03 Europractice MPW service features high voltage process
X-Fab, an analog and mixed-signal foundry, teamed with Imec to allow its Europractice IC service to offer a couple of high-voltage processes for manufacture using multi-project wafer runs
2013-11-15 Ams offers cost-efficient IC prototyping service
The prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, claims to deliver significant cost advantages for foundry customers.
2012-12-20 A*STAR offers 2.5D through-silicon-interposer MPW service
The service is aimed at providing a cost-effective platform to do research and development prototyping and proof-of-concept in 2.5D TSI technology
2013-10-03 Online quoting service drastically cuts MPW quote time
eSilicon's automated, instant, online quoting service for MPW Shuttle Services takes only around 15 minutes, a vast improvement from the usual process that takes 40 hours.
2002-10-22 IMEC, UMC enter foundry service agreement
IMEC and United Microelectronics Ltd have signed a three-year foundry service agreement which concerns IMEC's Europractice IC Service
2007-06-01 Cut your design time with multiproject wafer services
Using MPW services is not just about cutting the direct costs of development. The major cost saving is in design time. By adapting design priorities to take advantage of the speed and reduced cost at which respins can be undertaken, the whole development cycle shrinks
2002-02-08 AMS extends multi project wafer services
austriamicrosystems AG has extended multi project wafer services in its 200mm waferfab in Unterpremstaetten, Austria.
2008-12-09 austriamicrosystems brisks up ASIC prototyping
austriamicrosystems AG has announced to enhance its ASIC prototyping service. The company increases the number of wafer starts for multi-project wafers
2002-09-13 Tachyonics develops low noise RF transistor
Tachyonics Co. Ltd has announced that it has developed an RF transistor that features a NF <1dB at 2GHz, 2V.
2012-12-21 Nikon, IME to open lithography R&D lab in Singapore
Nikon has teamed up with A*STAR's Institute of Microelectronics for an R&D facility in Singapore that will develop advanced optical lithography technology for IC manufacturing.
2013-03-18 Imec offers fully integrated silicon photonics platform
The platform claims to enable cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) and optical sensing and life science applications.
2013-04-02 IME, UTAC team up for 2.5D TSI packaging solutions
United Test and Assembly Center will collaborate with A*STAR's IME to develop a 2.5D Through-Silicon-Interposer (TSI) platform for packaging solutions.
2008-10-01 Chip package options abound
When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer.
2005-03-03 1st Silicon begins 0.25?m embedded flash production
1st Silicon (Malaysia) Sdn. Bhd has completed qualification and begun production shipment of 0.25?m embedded flash technology.
2003-10-14 SMIC adopts design platform by VeriSilicon
VeriSilicon Inc. has released its Standard Design Platform for Semiconductor Mfg Int. Corp.'s 0.15&181;m generic and low-voltage CMOS process technologies.
2003-05-12 Mosis, Paragon IC forge distribution pact
Mosis has signed Paragon IC Solutions to provide sales and technical support for Mosis services in Singapore and Malaysia.
2013-10-10 Imec unveils 25Gb/s silicon photonics platform
Imec's portfolio includes low loss strip waveguides, highly efficient grating couplers, high-speed Germanium waveguide photodiodes, 25Gb/s Mach-Zhender and micro-ring modulators.
2007-07-18 IBM, HKSTP team to promote IC foundry services in APAC
IBM and Hong Kong Science and Technology Parks Corp. have partnered to promote semiconductor foundry services in the Asia Pacific region.
2008-07-23 HKSTP-IBM partnership sees extension
A new chapter awaits the Hong Kong Science and Technology Parks Corp. (HKSTP)-IBM partnership.
2012-05-08 Chinese firm builds MEMS wafer fab
Construction of the wafer fab started in March 2012 and the buildings will sit in the Hanking MEMS Industrial Park, which occupies about 647,497 square meters in Fushun Economic Development Zone.
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