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2008-06-18 Packet switches tailored for high-bandwidth apps
IDT recently expanded its family of switches with the addition of a higher performance and higher bandwidth device, which may be suitable to diverse applications ranging from 3.5G and 4G wireless infrastructure to next-generation enterprise storage and imaging applications.
2007-04-02 PA Semi offers 25W PowerPC
Startup PA Semi is shipping chip samples that demonstrate its claim of taking the PowerPC architecture's power consumption to new lows for a range of embedded markets.
2006-11-15 New modular plugs/jacks meet Cat 7a standards
The new series of high-speed Category 7a modular plugs and jacks from Stewart Connector will initially consist of a cable-mounted plug and single-port, PCB-mounted jack.
2011-06-13 Network platform supports data traffic boom
Performance Technologies has developed a new open-standard solution set for next-generation network communications and services applications.
2007-10-02 Motorola sells embedded computing biz to Emerson
Emerson and Motorola have entered into a definitive agreement under which Emerson will acquire Motorola's Embedded Communications Computing business for $350 million in cash.
2008-04-18 Micro detect switch targets mezzanine card apps
C&K Components has released the HDT Series of microminiature surface mount detect switches, measuring 3.5mm off the PC board, designed for both top and side actuation.
2007-10-26 Memory module pair tops JEDEC specs
Virtium Technology has come up with a DDR3 VLP and DDR3 ULP blade memory modules for embedded computing applications.
2007-05-01 Mass storage module supports SATA, CompactFlash
Concurrent Technologies has developed the AdvancedMC mass storage module, supporting either two 2.5-inch serial ATA HDDs or two CompactFlash drives.
2009-02-23 Low-cost connectors back high-speed transmission
Molex Inc. introduces EdgeLine, a family of one-piece, low-cost connectors supporting high-speed signal transmissions using a card edge interface and a vertical or right angle insertion.
2008-10-08 Kontron takes over Intel's rackmount server biz
Kontron has reached an agreement with Intel to acquire its Communication Rackmount Server operation of 1U, 2U carrier-grade rackmount and IP network security server products.
2012-05-04 Kontron rolls Intel Core i7-based embedded computing platforms
Based on Intel's 22nm 3D tri-gate transistor technology, the processor-based boards offer up to 20 percent enhanced computing power and up to 40 percent higher performance/W compared to the previous generation.
2010-10-13 IEEE handles available in array of styles
Elma offers IEEE injector/ejector handles in standard, hot-swap and other versions
2006-10-10 Faraday launches 'state-of-the-art' structured ASIC
Faraday Technology recently launched NC Express, said to be the most state-of-the-art device in the company's Composer Structured ASIC product line targeting communication, networking and enterprise applications.
2009-03-31 Dual 10GbE AMC packs Virtex-5 FPGA
AdvancedIO Systems has announced the availability of the V3021 dual-channel 10GbE connectivity and packet processing advanced mezzanine card (AMC) module.
2008-03-10 DSPs vs. FPGAs for multiprocessing
This article will look at what's available for multiprocessor systems (which inevitably tends to mean the high-performance end of the market), and how you can make the best choice between DSP, FPGA or a hybrid mixture of the two.
2009-08-07 Detect switches flaunt ultralow profile
C&K Components has developed a new series of micro-miniature, side-actuated detect switches.
2007-07-25 DDR2 SO-DIMM has thermal heat-spreader
To improve convection cooling, Virtium Technology Inc. announced a thermal heat-spreader for its DDR2 SO-DIMM, SO-RDIMM and SO-CDIMM.
2007-05-04 DDR2 memory modules roll for blade servers
Virtium Technology announced its DDR2 VLP and DDR2 ULP blade memory modules for blade server systems.
2007-04-04 DDR2 blade modules eye embedded computing
Virtium Technology has announced its DDR2 Very Low Profile and DDR2 Ultra Low Profile blade memory modules for embedded computing applications.
2008-12-19 Customized DC/DC module cuts design time
Ericsson Power Modules has released the BMR653 3+ series of customized DC/DC modules under its Customer Specified Products group, which provides optimized solutions for applications where off-the-shelf products do not match 100% of the customers' specification.
2007-01-26 CP-TA, PICMG partner to promote open spec
Global organizations Communications Platforms Trade Association and PICMG have agreed to exchange information with goals to promote the implementation of open specifications in the telecom industry.
2007-09-06 Boards transition from SDH/SONET to packet switching
N.A.T. has introduced the newest members of its AMC telecom product range, which allow the transition from TDM-based SDH/SONET networks to packet switching-based infrastructures.
2007-10-26 ATCA advocates seek to open up software features
Proponents of the ATCA platform are pressing for new initiatives to woo more large telecom OEMs to open standards.
2007-07-10 AMC ref kit features dual-core PowerPC processor
GDA Technologies has developed an Advanced Mezzanine Card reference platform kit for Freescale Semiconductor's MPC8641D dual-core PowerPC processor built on Power Architecture technology.
2008-05-28 AMC processor boards eye carrier-grade platforms
Embedded Planet has released two SCOPE-compliant boards that are suitable for a broad range of demanding applications including wireless base stations, media gateways, enterprise network access systems, test and measurement systems, and server blades.
2008-06-27 AdvancedMC module features Core2 Duo processor
Adlink Technology Inc. has introduced the AMC-1000 combining a dual-core 64bit low-power processor and server-class integrated 3100 chipset to optimize power consumption, computing power and I/O bandwidth.
2008-12-19 Advanced Mezzanine Card targets wireless apps
CommAgility Ltd's new AMC-3C87F is a single-width Advanced Mezzanine Card providing a mix of multicore DSP and FPGA processing power together with flexible, high bandwidth I/O connectivity.
2008-04-10 Adlink tips Intel-based Com Express, ATCA boards
Adlink Technology is covering conferences from ESC to the Shanghai Intel Developers Forum, demonstrating new Intel-based boards in Com Express and ATCA form factors.
2008-08-26 Actel steps up to battle PLD giants
Seeking to elbow its way into the spotlight and re-energize its bottom line, Actel Corp. recently acquired Pigeon Point Systems Inc.a move that propels the FPGA house into the TCA components sector.
2009-04-03 6-slot ATCA backplane comes in Mesh topology
Elma Bustronic Corp. has introduced a 6-slot AdvancedTCA backplane in a Mesh topology. The flexible design also allows a Dual Star topology to be implemented.
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