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2009-10-09 TSMC, IMEC team on More-than-Moore tech
The IMEC-TSMC Innovation Incubation Alliance creates a venue to convert concepts into packaged products.
2015-10-20 Shanghai opens incubator for More-than-Moore devices
SITRI's goal is to go beyond the process-node driven CMOS technologies that have defined the IC industry for decades and helped propel PC and smartphone market growth.
2010-05-12 IMEC, TSMC team on 'more-than-Moore' tech
IMEC president and CEO Luc van den Hove announced the research institute has entered into a partnership with TSMC to develop hybrid "more-than-Moore" process technologies.
2015-10-14 GloFo exec finds new 'sparkplug' in More-than-Moore
Rutger Wijburg, SVP and GM of Globalfoundries, said the era of the PC as a driver for the semiconductor industry is over, passing to role to smartphones, and now, the IoT.
2008-07-21 Chip industry preps for 'More than Moore' era
Chip and semiconductor equipment makers are at a crossroads as they face an era that might be called "More than Moore."
2015-11-19 X-Fab invests in Malaysian wafer fab
The More-than-Moore chipmaker will invest $114 million in its wafer fab in Kuching, Sarawak, Malaysia to meet demand for 0.18?m and 0.35?m manufacturing.
2012-09-17 Toshiba opens MtM foundry to EU fabs
Toshiba has extended foundry and process development services to EU clients and expanded NAND flash memory production.
2015-01-14 Specialty process expedites IoT design, rollout
A TSMC executive has indicated that the Internet of Things requires More-than-Moore technology, pioneered by smartphone chips, to create optimal IoT silicon.
2015-07-27 Semicon West highlights path towards 3D IC
The recent event underlined the significance of the move towards more advanced 3D IC technology, as well as the impact of the 'More than Moore' leading to this progress.
2008-09-01 3D-TSVs spark packaging revolution
Chips face the so-called "More-than-Moore" 3D integration route in order to pursue the continued aggressive scaling demanded by the historical law. 3D integration with through-silicon vias (3D-TSV) will accelerate the consolidation happening in CMOS wafer fabs and the shift toward the fabless foundry model.
2009-10-19 SVTC, TSMC join efforts on MEMS, biochips
SVTC and TSMC have teamed up on emerging technologies such as MEMS, biochips, new materials and novel structures.
2013-03-12 ST, CMP team up to deliver 130nm CMOS process
The H9A CMOS process is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
2013-06-03 Si2 set to unveil PDN Standard for 3D integrated ICs
The 3D IC Design Exchange Format Standard for Power Distribution Networks describes a unified interface protocol for both Power/Ground and signal ports for die-2-die and package-2-PCB interfaces.
2015-02-09 Sapphire market loses lustre
The bullish forecast for sapphires, with plans of its integration in various smartphone models, has now come to shaky ground as GTAT filed for bankruptcy and Apple said it would not use a sapphire display cover.
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors.
2011-07-19 Packing tech to drive auto MEMS sensors
MEMS-based technology faces several challenges, but with continuing innovation from MEMS companies and adding more functionality to traditional IC packages, the auto MEMS market is expected to boom.
2013-11-21 Malaysia foundry ready to take X-Fab to 180nm, 130nm
X-Fab Silicon's Rudi De Winter talks to EE Times Europe about his company's acquisition of 1st Silicon in Malaysia and its transition to 200mm wafer manufacturing.
2007-07-24 Keithley, French lab enter nanotech testing pact
Keithley has agreed to jointly develop advanced nanotechnology and chip materials testing technology with France's CEA Leti Laboratory.
2016-03-16 InVisage's Lee says start-up to focus on image sensors
The Menlo Park-based company has been developing image sensors using a quantum-dot material that replaces conventional silicon photodiodes but is integrated with supporting CMOS technology.
2015-07-21 Globalfoundries plans to start FD-SOI prod'n in Europe
Globalfoundries is investing $250 million to develop and its own variant of a fully-depleted silicon-on-insulator (FD-SOI) manufacturing process and get it into production in Europe.
2005-10-10 FSA keynoter eyes 'ambient intelligence'
Rudy Lauwereins, vice president for design technology at the Belgian IMEC research institute, came to the Fabless Semiconductor Association (FSA) Expo here Thursday with a
2009-05-07 Foundry startup CEO sketches bright future
While some observers state the foundry market is already overcrowded and consolidation is in evitable, particularly in Europe, startup Landshut Silicon Foundry GmbH co-founder and managing director Michael Lehnert, sketches out a bright future.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2014-02-03 Europractice MPW service features high voltage process
X-Fab, an analog and mixed-signal foundry, teamed with Imec to allow its Europractice IC service to offer a couple of high-voltage processes for manufacture using multi-project wafer runs.
2015-03-05 Embedded die in substrate shows promise in processing tech
Yole Dveloppement revealed that embedding die in laminate substrates is a promising packaging principle, but it has to overcome several challenges, which include the supply chain.
2010-06-23 Elpida, PTI, UMC team on 3D IC integration for 28nm
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.
2008-11-03 Electronics follow curves
There are many applications in which it would be useful for electronics to conform to curvilinear surfaces or to deform with use, especially in sensing.
2013-10-16 Dongbu HiTek makes quiet strides towards expansion
One of the industry's best kept secrets, speciality foundry Dongbu HiTek has been steadily sharpening its strategy and expanding capacity.
2010-06-23 DAC panelists deliberate on 3D TSV roadmap
Panelists at the Design Automation Conference (DAC) made an attempt to forecast a roadmap for 3D through-silicon-vias interconnects.
2012-01-30 Could 450mm wafers play away from the leading edge?
When the processing of integrated circuits on 450mm diameter wafer comes, many assume that it will do so first for the most advanced digital manufacturing processes.
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