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total search35 articles
2013-01-02 Selecting scope for multi-lane MIPI M-PHY design
Understand the considerations in choosing the oscilloscope for validation of multi-lane M-PHY designs.
2010-08-27 DesignWare MIPI M-PHY IP now in 40-nm process tech
Synopsys, Inc. has just announced availability of the DesignWare MIPI M-PHY IP for next-generation high-speed interfaces based on the newly ratified MIPI Alliance M-PHY specification. Both DesignWare DigRF v4 controller and M-PHY IP answer the demand for higher throughput in LTE and WiMAX mobile devices .
2014-12-11 Cut down noise when making M-PHY measurements
To make useful measurements on M-PHY Gear 3, you should have a low-noise measurement system because of the low-amplitude signals. Read this article to find out more about it.
2012-03-21 Automated sol'n released for MIPI M-PHY testing
The Opt. M-PHYTX for Tektronix DPO/DSA/MSO70000 series oscilloscopes boasts automation of about 700 tests in regression of all high speed and PWM gears, amplitude and termination combinations.
2012-03-02 Agilent MOI for MIPI M-PHY conformance tests
Know the measurement procedures for the interface S-parameter and impedance tests defined in the MIPI Alliance Specification for M-PHY.
2014-10-14 Address M-PHY issues to boost test efficiency
Learn about the requirements of the M-PHY standard relevant to oscilloscope probing, and the tests required in the M-PHY Physical Layer Conformance Test Suite.
2011-06-08 Test solution validates at 5.8Gb/sec speed
Agilent Technologies announced a comprehensive Mobile Industry Processor Interface (MIPI) M-PHY test solution to help design engineers turn on, debug and validate all layers of mobile devices.
2015-09-24 Streamlining interconnections for compact designs
One challenge associated with the latest trends is the need to simplify the electronic interfaces that interconnect device chipsets and peripheral components. Find out how to address this.
2011-05-06 MIPI, USB 3.0 promoters collaborate on mobile chip interface
Designed for next-gen mobile silicon, the Superspeed Inter-Chip spec unites MIPI Alliance's M-PHY spec with USB 3.0's media access controller and higher layer software.
2015-03-05 Examining the advances in mobile storage
We cannot fully predict the types of architectures that future mobile and storage products will have. However, the possibilities enabled by technologies under development today are exciting.
2013-02-22 Agilent rolls out industry's first UFS Protocol-Decoder
Agilent's new protocol decoder provides and validation engineers with a fast, easy way to validate and debug their UFS interfaces.
2014-09-15 A peek at testing MIPI's latest PHY
MIPI is in the process of releasing a third PHY standard called C-PHY, which takes an interesting departure from the other MIPI PHYsone that is likely to present new test and measurement challenges.
2015-10-27 Fully-automated PHY test sol'n aimed at mobile storage apps
The M-PHY TX automated solutions from Tektronix promise to provide support for 100 per cent of tests as per M-PHY 3.1 and CTS 3.1 using the TekExpress 4.0 framework.
2013-03-11 Design, verification IP aimed at Mobile PCIe
The Cadence M-PCIe IP and VIP solution enables the PCI Express architecture to operate over MIPI M-PHY, extending battery life of mobile devices such as thin laptops, tablets and smartphones.
2010-12-14 40nm IP core complies with MIPI specs
Cosmic Circuits Pvt. Ltd announces the availability of its MIPI M-Phy core designed for implementation in a 40nm manufacturing process technology.
2013-09-23 UFS 2.0 boosts security, increases link bandwidth
Developed for mobile applications and computing systems, JEDEC's Universal Flash Storage version 2.0 enable significant improvements in throughput and system performance.
2012-10-05 Troubleshoot, verify 8b/10b encoded signals with real-time scope
Test equipment with features designed for serial bus test can dramatically improve productivity and lead to more reliable, higher performing designs.
2015-09-23 Synopsys rolls out IP line for TSMC 10nm FinFET process
The company said this milestone allows designers to speed the development of SoCs that incorporate USB 3.1, USB 3.0, USB 2.0, HSIC, PCI Express 3.0, PCI Express 2.0 and MIPI D-PHY interface IP.
2013-06-12 SilabTech uses Mentor Graphics' tool flow for 28nm PHY
SilabTech has achieved first silicon success for their latest 28nm high-speed, mixed-signal PHY IPs using Mentor Graphics' Pyxis, Eldo, and Calibre tools.
2014-04-29 Project Ara modular smartphones promote differentiation
Google's open-source modular smartphone concept could drive a shift from selling stand-alone products to simplified swappable modules performing the same functionalities that meet a user's end requirements.
2012-09-17 PCI Express to be in tablets and smartphones
PCI-SIG will be approving software that will enable PCI Express to become mobile-friendly
2015-05-28 Oscilloscope able to decode interfaces up to 6.25Gbit/s
Rohde & Schwarz added the R&S RTO-K52 option to expand the application field of its R&S RTO oscilloscope to help developers design, verify and debug modules with 8b/10b encoded buses.
2014-03-26 New SerDes chip shines spotlight on Intel's 14nm process
The 14nm version of the SerDes chips gives Intel a chance to reinforce its message of technical superiority, even in the absence of much of its other 14nm processor products.
2006-04-03 Mobile phone chip interface gets real
MIPI Alliance unveils plans to release interfaces for displays, PHY, audio and power management, and other peripherals in the next two years.
2012-01-20 MIPI releases mobile RF standards
The MIPI Alliance has releaed the DigRF v4 and the RFFE v1.10 specifications for digital modem and front-end radio.
2012-03-05 MIPI digital controller IP cuts mobile phone cost
Arteris FlexLLI offers point-to-point interconnect between two chips such as a mobile phone application processor and modem baseband processor, reducing compatibility risk.
2012-06-27 JEDEC releases updated UFS standard
JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications.
2011-03-01 JEDEC releases new flash memory spec
Governing embedded and removable flash memory-based storage, the Universal Flash Standard builds on the e.MMC standard and adds security, performance and power consumption features.
2011-07-28 Intel, Samsung, others license chip-to-chip spec
Intel, Samsung and other mobile vendors have licensed the Chip-to-Chip Link specification which was developed by Arteris and Texas Instruments.
2013-04-15 Fujitsu's mobile platform ships out with Synopsys' PHY IP
Synopsys and Fujitsu Semiconductor worked closely to maintain clear and consistent communication throughout the product development cycle to ensure a successful tape-out.
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