Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > NEMs

NEMs What does MEMS stand for? Search results

What does MEMS stand for?
MEMS stands for microelectromechanical systems. They are tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. They are used to make pressure, temperature, chemical and vibration sensors, light reflectors and switches as well as accelerometers for airbags, vehicle control, pacemakers and games.
total search23 articles
2012-09-05 IBM, STM to create NEMS-based logic process
The goal of NEMIAC project is to develop a logic process based on nanometer-scale relays suited for embedded systems and allowing 3-D integration with CMOS.
2013-02-19 A*STAR, Stanford to advance NEMS switches
The nanoelectromechanical systems (NEMS) switch technology is aimed at improving the energy efficiency of mobile devices and ultra low power digital systems.
2013-10-11 Switch takes computers to light-speed performance
The device developed at A*STAR can switch a light signal on or off extremely quickly, enabling all-optical computing and simplifying the interface between electronic and optical networks.
2005-12-16 Nanotubes bend to the task of electronic switching
Samsung and Cambridge University have formed switches that function like mechanical DRAM, dubbed as nanoelectromechanical system.
2013-09-03 EXFO rolls out first 400G test suite
The IQS-610P-HS-400G test solution provides flexibility to configure up to four 100Gbit/s client interfaces simultaneously with full traffic profiling, shaping and monitoring capabilities.
2009-12-11 Coming soon: Nanoelectromechanical systems
According to experts on emerging chip technologies, nanoelectromechanical systems, or NEMS are underappreciated and could be the next big thing in semiconductor technology.
2005-03-22 Agilent expands 1xEV-DO support
Agilent added three new capabilities to its test and measurement portfolio which will help NEMs streamline device transition from development to manufacturing.
2007-12-07 10GbE test module rolls for MACSec link security
Ixia's 10GbE MACSec Load Module allows chip vendors and NEMs to completely test their designs prior to integration and deployment.
2008-06-17 Tool tests multiple mobile RF specs
Agilent Technologies Inc. has today announced the latest addition to its GS-8800 family of RF design verification and conformance test solutions: the new GS-8852 2G RF Conformance Test system, a full-featured GSM, GPRS, EGPRS test system for mobile handset conformance test.
2010-09-10 Test service demand grows due to wireless
Complex wireless networks increase demand for test services
2008-11-18 Telescopic nanotubes work on RAM-flash fusion
Researchers believe they can combine the high-speed of RAM with the non-volatility of flash by using telescopic nanotubes.
2011-07-21 TCNL fabs ferroelectric nanostructures on plastic
Georgia Tech researchers have developed a way to fabricate nanometer-scale ferroelectric structures directly on substrates.
2008-08-27 RF solutions build reliable test set for 3G handsets
Agilent has launched the latest members of the GS-8800 family of RF design verification and conformance test solutions such as the GS-8853 3G RF Conformance Test system.
2011-11-30 Research reveals novel MEMS device fabrication
A research team studied the piezoelectric material lead magnesium niobate-lead titanate for application in nanoelectromechanical systems.
2003-04-23 Nanostructures eyed to identify biomolecules
Two research groups are collaborating on an attempt to find a general solution to the problem of identifying biomolecules.
2002-12-26 Nanoimprint lithography ready to make its mark
A potentially low-cost form of lithography affectionately known as
2015-06-05 MEMS innovation to spur IoT growth
The ramp of new MEMS designs to volume production may take too long and cost too much to meet IoT market expectations, unless the industry figures out ways to accelerate MEMS development.
2014-10-21 MEMS evolution is coming
A change is occurring in the technology options behind MEMS sensors. According to an analysis firm, the market for MEMS devices based on 3D packaging, novel materials and detection principles will see huge growth in 2019.
2007-04-17 Malaysia works with Taiwan, Korea on semicon, energy R&D
MIMOS, the Malaysian government's technology arm, is boosting its research into advanced semiconductor and energy solutions by partnering with its counterparts in South Korea and Taiwan.
2011-12-01 Euro project to up THz sensor capability
The TeraTOP project aims to develop a device that can reduce the cost and improve the capability of terahertz (THz) imaging in security applications.
2011-06-29 Coating tech improves ALD
Cambridge NanoTech has developed Self-Assembled Monolayers (SAMs) coatings that can be used in applications such as biocompatibility, electromechanical systems and sensitization.
2013-08-20 Chemical industry makes headway in printed electronics
An IDTechEx report addresses the need for chemical firms entering the electronic product space to identify the most profitable functional compounds and elements needed including allotropes of carbon.
2015-02-12 7 communications tech that will shape 2015
Developing technologies such as LTE and LTE-Advanced, voice over LTE, small cells, heterogeneous networks, NFV/SDN are predicted to make a huge impact this year.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top