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2016-05-06 Will drones fill Intel's smartphone market void?
Coming on the heels of its recent announcement of massive layoffs and cancelling of mobile SoC platforms, Intel turns a new leaf with drones.
2013-01-15 Will ARM stay on top of core licensing?
ARM has had steady success in licensing pre-developed processor cores but changing market dynamics could prove challenging.
2009-01-06 Will 2009 welcome a cheaper iPhone?
A lower-cost version of Apple Inc.'s popular iPhone, unofficially dubbed the "iPhone Nano" by some, could be hitting stores by Q2 09, according to a Wall Street analyst.
2015-08-07 Who wants to buy Marvell's mobile business?
Marvell's search for suitors illustrates a dramatic change in the global smartphone business. Nobody seems winning big. Even for a chip vendor with solid technology, it's tougher to get fair value.
2009-12-08 Who takes the cake in netbook processor arena?
So, who are the winners and losers in the netbook and mobile Internet device thus far? At present, it appears that all chip vendors are both winnersand losers.
2011-05-31 Where is ARM on the Imec landscape?
While it is not involved with Imec in terms of funding research, ARM admits it must partner with Imec to research manufacturing technologies such as in areas of FinFETs and graphene.
2014-09-02 What's switching: Nine takeaways from Hot Interconnects
The event sizzled with announcements and discussionsFacebook introduced its high-profile switch, critics attacked Ethernet's shortfalls, experts scrutinised Wi-Fi, and silicon photonics took centre stage.
2011-10-19 What's next for Intel after DTV?
The Envisioneering Group's Rick Doherty identifies the victims of Intel's decision to leave the Smart TV chip space and discusses what the future holds for Intel.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2008-03-25 Weak memory segment drags chip market
Surprising weakness in the memory chip market in Q4 took the wind out of the sails of the global semiconductor market, causing growth in 2007 to fall short of expectations, according to iSuppli.
2007-03-14 Vista-optimized motherboards feature AMD graphics chipset
Advanced Micro Devices' manufacturing partners have introduced four motherboards with the company's 690G chipset, one of a recently released line of processors optimized for running Windows Vista.
2011-01-04 Virtualization software for Sandy Bridge
LucidLogix Technologies launched Virtu, software designed specifically to support Sandy Bridge processors in working with external GPUs.
2011-08-23 Viewpoint: Mobile era has begun
Rick Merritt believes that HP's possible change in priorities and Google's acquisition of Motorola officially started the mobile era in technology.
2012-03-19 Viewpoint: China could save ST-Ericsson
For mobile chip companies in China or Taiwan, ST-Ericsson could bring the means to address the standard as well as access to additional patents with which to address 3G and 4G markets around the world, depending on how the deal is structured.
2002-07-10 Verification startup wants everyone to go 'formal'
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2009-06-05 Vendors fuel netbook hype at Computex
A handful of semiconductor companies announced new chips and software for netbooks and other mobile systems at the opening day of Computex.
2011-11-23 USB-to-Ethernet controller cuts BOM, power use
The LAN9730 links SoCs and peripherals, and are targeted for low power applications.
2008-08-19 USB 3.0 controller spec revealed
Intel Corp. has released a nearly complete specification for a USB 3.0 controller chip.
2015-04-17 US builds world's fastest supercomputer
The Collaboration of Oak Ridge, Argonne and Lawrence Livermore (CORAL) project financed by the U.S. Department of Energy aims to one-up the Chinese with up to 200petaflops systems by 2018.
2002-02-08 UMC to cut spending, increase advanced capacity
United Microelectronics Corp. intends to cut capital spending this year by 27 percent, joining its foundry rivals in tightening purses for what they expect to be a slow recovery in 2002.
2002-02-12 UMC seeks control of Japan joint-venture fab
United Microelectronics Corp. is seeking to gain management control of its 300mm wafer joint venture with Hitachi Ltd, UMC chairman and chief executive Robert Tsao said Friday (Feb. 8).
2012-07-03 UMC looks to catch up with competitors with IBM deal
UMC looks to drastically improve its position with 20nm low power process with FinFET development license from IBM.
2003-04-30 TSMC takes wraps off 65nm plans
In the face of stiff competition and a few lost customers, Taiwan Semiconductor Mfg Co. Ltd has become more aggressive in making its case as a technology leader.
2010-03-01 TSMC takes on 40nm yields, high-k, litho issues
At the TSMC Japan Executive Forum in Yokohama, Shang-Yi Chiang, senior VP of R&D at TSMC, addressed several issues about the silicon foundry giant.
2011-04-08 TSMC rolls first high-performance mobile process
TSMC introduces what could be the industry's first manufacturing process optimized for chips used in smartphones and tablets.
2008-11-19 TSMC ramps 40nm volume production
TSMC Ltd. has announced the volume production of the first semiconductor foundry 40nm logic manufacturing process with the successful ramp of its 40nm General Purpose (G) and Low Power (LP) versions.
2004-12-07 TSMC claims inventory pressure to ease by year-end 2004
Taiwan Semiconductor Mfg Co. (TSMC) announced that inventory pressure would ease by year-end 2004 after several months of inventory level adjustment from customers.
2012-04-20 TSMC CEO: Issues with 28nm cap is over
Morris Chang, chair and CEO of foundry firm admitted problems with the 28nm node, but said the problems were related to capacity, not yield.
2009-11-10 TSMC 40nm yield woes continue
Taiwan Semiconductor Manufacturing Co. Ltd is still having yield issues with its 40nm process, according to analysts.
2014-11-14 TSMC 'ahead of schedule' in 16FF+ production
Taiwan Semiconductor Manufacturing Co. has entered risk production for its 16nm FinFET Plus process, which, according to analysts, is yet another sign that the chip foundry is ahead of schedule with its first 3D chips that will be at the core of smaller, more powerful mobile devices.
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