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2010-02-23 Tessera, Nanium ink packaging license deal
Tessera Inc. has signed a technology licensing agreement with Nanium, S.A, formerly known as Qimonda Portugal.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB).
2015-01-21 Compact module packs 10 dies side-by-side in a 2 x 5 array
The module touts 200um edge spacings and uses the company's Fan-Out/embedded Wafer-Level BGA (eWLB) technology to bring about a compact module intended for medical devices.
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years.
2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
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