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2010-03-01 Nikon updates litho roadmap
Nikon outlined its lithography roadmap and devised a new lens for its latest 193nm immersion scanner and revised its roadmap for extreme ultraviolet (EUV) lithography.
2007-02-28 Nikon to ship EUV tools to Intel, Selete
Nikon outlined its roadmap in the EUV lithography arena and disclosed plans to ship two prototype tools by year's end to Intel Corp. and Selete.
2003-05-28 Intel drops 157 litho from roadmap
Intel dropped a bomb on the lithography industry when it said it has removed the 157nm lithography generation from its tech roadmap
2009-07-20 Globalfoundries details process roadmap
Taking on foundry giants, startup Globalfoundries Inc. has outlined its process roadmap and disclosed plans to break ground on its new U.S. fab
2010-03-22 Analyst offers peak into Intel 22nm litho roadmap
Arete Research analyst at Jagadish Iyer said Intel's 22nm node will require 45 "litho layers," of which 55 percent will need immersion.
2009-10-12 ASML details EUV lithograpohy roadmap
ASML showed a rough road map for extreme ultraviolet (EUV) lithography systems that could be ready for commercial use in late 2012.
2012-12-19 Lithography expert still not sold on EUV
It was the end of the semiconductor roadmap for 193nm lithographythe next generation would have to go to 157nm light
2006-08-01 Lithography efforts trailing 32nm target
The chip industry is enjoying a short reprieve as immersion lithography continues Moore's Law of scaling for the next few years. But for chips with a 32nm half-pitch, lithographers are counting on either extreme ultraviolet or immersion 193nm scanners enhanced with high-index fluids.
2010-02-24 Intel extends immersion litho to 11nm, delays EUV
Intel Corp.'s lithography roadmap plans to extend its 193nm immersion to the 11nm logic node and delay extreme ultraviolet (EUV)again
2007-02-27 IBM pushes for immersion at 22nm
IBM outlined last week its lithography roadmap, saying that it would extend 193nm immersion lithography down to the 22nm node for logic production
2015-12-17 TSMC begins work at 5nm, plans for EUV remain unclear
The foundry's initial development work at 5nm may be yet another indication that extreme ultraviolet lithography has been set back as an eventual replacement for immersion lithography.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and Ddelays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2015-07-21 Semicon West highlights 10 chip trends
During the recent Semicon West, executives from a number of chip companies discussed the ongoing developments on semiconductors technology.
2002-05-29 R&D association targets EUV lithography laser
Ten Japanese companies have formed an R&D association to develop a high-power laser technology by 2005 for use in extreme ultraviolet (EUV) lithography systems.
2008-07-16 Litho options falling behind process needs
Who killed high-index lithography, and was politics the cause? These questions remain for chipmakers looking for a route to next-gen manufacturing in a shifting lithography landscape.
2009-02-25 Intel: EUV litho roadblocks ahead
A top technologist at Intel Corp. warned that a lack of mask inspection gear for extreme ultraviolet (EUV) lithography is threatening the process' future viability in the market.
2009-06-16 Intel, TSMC to tap ASML's EUV litho tool
Hynix Semiconductor, IMEC, Intel, Samsung, Toshiba and possibly Taiwan Semiconductor Manufaturing Co. are the initial customers for ASML Holding NV's "pre-production" extreme ultraviolet (EUV) lithography tool.
2015-03-06 Intel recommends 2.5D, 3D integration for next-gen chips
Intel emphasised that heterogeneous integration enabled by 3D IC is essential to the development of future SoCs, especially in terms of scaling lithography processes.
2007-06-25 Intel drafts inverse litho to cover EUV delay
With the possible delay of its EUV lithography, Intel disclosed it is developing a DFM technology that could extend optical scanners to the 22nm node.
2002-07-25 Industry said to face steep lithography challenges
Many in the semiconductor industry underestimate the technical and economic challenges posed by new forms of lithography, said Phil Ware, senior fellow at Canon Inc.
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