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2003-08-19 Optical inspection system has additional load ports
Nikon's Semiconductor Inspection Technologies Group (SITECH) has introduced the Optistation 3200 semiconductor inspection system.
2006-07-13 Lithography vendors unveil next-gen scanners
Top lithography vendors are coming to market with next-generation immersion scanners for the 45nm node and beyond. Many will enter the arena at this week's Semicon West trade show.
2007-02-09 LCD equipment market continues to drop
The worldwide market for array processing equipment for flat-panel displays dropped 11 percent in 2006 and will decrease another 14 percent in 2007, according to The Information Network.
2006-11-07 Digital still camera runs on mixed-signal components
Far from what the product category name might imply, the digital still camera is loaded with mixed-signal design and components.
2008-02-06 Will EUV litho ever cross over from R&D to production?
The procurement of an R&D EUV lithography tool from Nikon has reportedly been put off by Intel, raising more questions about the viability of EUV for mass chip production.
2010-11-01 Intel litho buy seen at $1.5B
Nikon and ASML Holding are expected to share the lithography business for Intel's 22nm node, according to Barclays Capital.
2008-07-22 EUV delays drive shift to double-patterning
With the probable delays for EUV lithography, ASML, Canon and Nikon are racing each other to capitalize on the shift towards double-patterning technology at the 32nm node and beyond.
2009-02-26 Collaboration to bring 42nm flash optimization
Synopsys Inc. is collaborating with Powerchip and Nikon to deploy the Nikon Scanner Signature Files (NSSF) as a means to increase Proteus ProGen model accuracy on 42nm flash memory designs.
2012-04-03 ASML dominates litho market
ASML was responsible for 57 percent of the lithography tools shipped last year, with Nikon accounting for 28 percent and Canon 15 percent.
2005-08-16 ASML debuts hyper NA immersion
The XT1700i is ASML's answer to Nikon's efforts in the hyper numerical aperture market.
2011-04-13 Aftershock stops production at several Japan fabs
Fujitsu, Renesas, Sony, Elpida, Toshiba, Nikon and Tokyo Electron were among the companies reported to have suspended operations following the 7.1-magnitude quake that shook Japan on April 7.
2008-10-23 Who would not think it's Intel?
It's got to be Intel, right?
2005-06-15 VLSI releases IC-equipment customer satisfaction rankings
Tegal Corp. and Varian Semiconductor Equipment Associates Inc. are among the winners in terms of customer satisfaction within the chip-equipment industry for 2005, according to an annual survey conducted by VLSI Research Inc. (See below for ranking tables).
2015-12-17 TSMC begins work at 5nm, plans for EUV remain unclear
The foundry's initial development work at 5nm may be yet another indication that extreme ultraviolet lithography has been set back as an eventual replacement for immersion lithography.
2013-02-20 TransferJet prepped to demo lightspeed wireless at MWC
TransferJet is a low-power, proximity data transfer technology designed to deliver a transfer data rate of up to 560 Mbits per second using a radio carrier centre frequency of typically 4.48MHz.
2007-10-26 Toshiba taps optical lithography in fabs
Despite the hype surrounding EUV, nanoimprint and other next-generation technologies, Toshiba is still using optical lithography in its current production fabs.
2007-10-08 Toshiba mulls over 450mm fab, EUV litho
Aiming to maintain its edge in the IC market, Japan's Toshiba Corp. is exploring several new chip-production technologies, including 450-mm fabs and EUV lithography.
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2009-10-05 TI 300mm fab puts pressure on analog rivals
Texas Instruments Inc. is putting its analog rivals on notice with its latest a 300mm fab in the United States.
2005-06-21 TEL led display equipment rankings in '04
Japan's Tokyo Electron Ltd (TEL) was the world's top equipment supplier for flat-panel displays in a market dominated by Japanese vendors in 2004, according to VLSI Research Inc. (See rankings table below).
2007-11-26 TEAC buys MMP portfolio license
Japanese recording tech specialist TEAC Corp. has purchased a MMP portfolio license from the TPL Group, according to the Patriot Scientific Corp.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and Ddelays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2015-04-08 Sony tops CMOS image sensor market, Omnivision at No.2
Yole expects the CMOS image sensor market to grow at a CAGR of 10.6 per cent from 2014 to 2020 and reach an annual market value of $16.2 billion in 2020.
2008-07-21 Sony seeks alliance toward standardized UWB tech
Sony has rallied a group of 14 companiesmainly large Japanese consumer electronics firmsaround an ad hoc effort to standardize proprietary UWB technology it first demonstrated at the Consumer Electronics Show in January.
2008-11-24 Slowdown hits Japan fab-tool market, too
Japanese-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.81 in October, down from 0.95 in September, according to the Semiconductor Equipment Association of Japan.
2008-04-09 Slight changes mark IC-equipment ranking
The fab-tool rankings experienced a minor change in 2007, reports Gartner Inc.
2007-10-25 Signs point to fab-lite route for Renesas
Renesas Technology is quietly altering its fab and foundry strategies, seeking to make up ground at the 65nm node and beyond.
2010-02-17 Shortage looms in memory market
There is expected to be a tight supply of memory parts in 2010 due to rebound in demand; lack or under-investment of capital spending; and extended lead times for lithography gear from ASML.
2005-01-11 Sharp preps 8G LCD fab
In the latest example of display suppliers leapfrogging one another to build larger liquid crystal display (LCD) panels, Sharp Corp. of Japan apparently plans to build an 8G LCD fab.
2002-05-06 SEZ opens 300mm lab in Arizona
The SEZ Group has opened a 300mm applications lab in Phoenix, Arizona. The new lab will test 300mm wafer-cleaning processes and is anticipated to double SEZ's capacity for customer demos and R&D.
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