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What are the steps in PCB design?
The input to the PCB design process is typically an electronic schematic and a list of parts that are to be used or the BOM. Modern PCB design is done on software or EDA tools that can be downloaded for free or bought from vendors. The output of the PCB design process is a set of files called Gerbers. These files are used by a fabricator to make the PCBs.
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2003-03-14 Alps tact switch fits portable devices
The SKRT series of side-push type tactile switches from Alps Electric Co. Ltd measures 4.46-by-3.55-by-3.3mm and is designed for use in portable apps.
2014-07-01 All systems go for Project Ara
Project Ara is now up and running after Google made a successful debut at I/O, in spite of a frozen home screen during the demonstration of the modular smartphone.
2008-09-19 Airwire antenna extends power transmission range
Wireless applications in the 2.4GHz band from remote controls to Zigbee industrial controllers to Wi-Fi nodes usually have to use a more powerful amplifier to expand their range.
2003-06-03 AIC PGA connector enables fewer board layer tests
The surface-mount, interstitial PGA connector from AIC involves the application of the patented BGA socket adapter system in an existing, molded PGA wafer.
2002-10-09 Agilent, Xilinx team on in-system debug of FPGAs
Xilinx Inc. and Agilent Technologies Inc. have teamed up to make in-system debugging of Xilinx FPGA designs a bit easier.
2005-01-24 Agilent to acquire power amplifier maker in South Korea
Agilent Technologies Inc. and South Korea-based Wavics have entered into an agreement under which Agilent will acquire Wavics, a designer and manufacturer of power amplifier modules for the worldwide mobile handset market.
2004-12-06 Agilent proves 6.25Gbps serdes core in 90nm process
Agilent Technologies Inc. has announced that it has validated its third-generation SerDes core in a 90nm CMOS process technology, making it possible for OEMs to embed as many SerDes channels (each operating at up to 6.25Gbps) as needed onto a single ASIC chip.
2004-09-03 Agilent optocoupler ships in SO-8 package
Agilent introduced a new version of its industry-standard HCPL-3700 voltage/current-sensing optocoupler.
2004-04-19 Agilent LEDs eye next-gen mobile phones, PDAs
Targeting the next-generation mobile phones and PDAs, Agilent has introduced what it claims as the industry's smallest ChipLED surface-mount LEDs.
2004-06-29 Agilent connectorless logic analyzer adopted as standard
Agilent announced that its Pro Series soft touch connectorless logic analyzer probe interface has been adopted by logic analyzer vendors as the industry standard.
2002-03-14 Agere, Nortel forge agreement for surface-mount 10Gbps receivers
Agere Systems and Nortel Networks have entered into a multi-source agreement to establish standards for surface-mount 10Gbps receivers.
2012-10-16 Advantages of JESD204B over parallel data formats
High-speed serial interfaces may still come with implementation issues, but the standardization reduces the adoption risk.
2005-08-22 Advancing the set-top box
Designers need to manage multiple specifications and integrate PVR, WLAN, cable modem, telephony and a host of other technologies in order to develop set-top boxes and residential gateways for worldwide markets.
2012-10-24 Advances in wireless bonding LED technology
Know how this LED technology provides greater brightness, superior heat dissipation and enhanced durability, while maintaining small footprints.
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation.
2012-11-14 Advances in embedded SW design re-use and IDEs
Learn how integrated development environments have evolved to include productivity-enhancing resources.
2013-04-18 Advances in capacitive touchscreen for mobiles
It is imperative to understand recent innovations that will lead to the development of truly inexpensive touchscreen products.
2008-01-07 AdvancedMC connector designed for high-speed data rates
Molex's AMC.0 B+ connectors support PIGMG AdvancedTCA industry specifications for next-generation mezzanine cards and are well suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA applications.
2004-10-07 Advanced process technology gains momentum in China, Taiwan
Global Sources and Gartner announced the results of their annual joint study, which indicates growing use of finer process technologies in the design of standard ICs and ASICs in mainland China and Taiwan.
2007-03-23 ADSL2+ SoC for CPE rolls for emerging markets
Infineon Technologies has announced a new ADSL2+ SoC for CPE that will help drive broadband penetration in emerging markets.
2004-02-13 ADI reference design simplifies mobile devices
Analog Devices has released a reference design for the development of GSM/GPRS wireless devices.
2015-07-30 ADI flaunts AFE devices with integrated 24bit ADCs
The AD7124-4 and AD7124-8 AFEs connect directly to all standard industrial signal sources and sensor inputs, while reducing power requirements by 40 per cent over comparable devices.
2002-06-11 ADI electro-optical interface ICs fit for fiber
Analog Devices Inc. has introduced three electro-optical interface ICs for use in fiber-optic metro and access networks.
2003-01-17 ADI digital synthesizers boast low power consumption
Analog Devices Inc. has expanded its portfolio of RF ICs with the addition of a family of DDS that deliver a clock speed of 400MHz.
2002-05-17 ADI CCD signal processor can speed digital camera design
Analog Devices Inc. says that its latest CCD signal processor allows designers of CCD-based digital still cameras to reduce camera size, lower parts costs and offer a variety of image resolutions.
2009-07-23 Addressing the heat dissipation issue
Heat dissipation, which must be approached from the component and system architecture standpoint, is a recurring issue that OEMs and silicon vendors have attempted to find solutions for.
2011-08-01 Addressing signal integrity issues in high-speed flash devices
Learn what can affect signal integrity and how to model and measure it.
2005-05-02 Addressing EDA's malaise
Today, when you hear the word EDA, what comes to mind? Failed companies. Flat revenues. Endless lawsuits. Marketing hype. Depressed market values.
2015-12-04 Addressing design concerns when using UVC LEDs
Know the fundamental differences with respect to the incumbent solution to realise the full benefits of this emerging UVC LED technology.
2014-10-14 Address M-PHY issues to boost test efficiency
Learn about the requirements of the M-PHY standard relevant to oscilloscope probing, and the tests required in the M-PHY Physical Layer Conformance Test Suite.
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