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2002-05-09 PECVD diamond films for use in silicon microstructures
This application note describes how the PECVD diamond films could be used in silicon microstructures.
2002-07-09 ASM receives patents for PECVD low-k dielectric technology
ASM Int. N.V. has been granted patents no. 6,352,945, 6,383,955 and 6,410,463 by the U.S. Patent & Trademark Office.
2012-10-11 SPTS signs JDP with Fraunhofer for 300mm 3D IC Apps
The program will use 300mm APM plasma enhanced chemical vapor deposition modules installed on a Versalis platform alongside SPTS etch chambers in the ASSID centre in Germany.
2016-05-04 Software brings novel features to conventional dry etching
CORIAL said the COSMA Pulse can control and pulse simultaneously from each other all process parameters, including gas flow rate, working pressure, RF power, LF power, or virtual process parameters.
2003-01-02 Unaxis opens office in Shanghai
Unaxis has opened an office in China named Unaxis Shanghai Co. Ltd to act as the company's data storage facility.
2003-01-03 Unaxis opens office in Shanghai
Unaxis has opened an office in China named Unaxis Shanghai Co. Ltd. Unaxis Shanghai will handle the marketing of semiconductor, display, data storage and optical components.
2013-10-18 Ultra-high-res display makers switch to metal-oxide TFTs
The expensive low-temperature polysilicon process has prompted the ultra-high-res display industry to move to metal oxide TFTs.
2014-11-04 The lowdown on manufacturing RRAM
Resistive memory technologies involving simple two-terminal devices can be incorporated into backend metal layers to provide an elegant solution for meeting density, capacity and cost challenges.
2008-09-04 Tegal secures products, IP for 3D packaging, MEMS
Tegal Corp. has signed an agreement with AMMS and Alcatel-Lucent to acquire products and the related intellectual property, directed at advanced 3D wafer-level packaging applications.
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems.
2003-10-20 Novellus Systems co-establishes research center in China
Novellus Systems Inc. has signed a partnership agreement with Fudan University of Shanghai to establish a semiconductor technology research center.
2002-05-14 Novellus opens manufacturing facility in Oregon
Novellus Systems Inc. has opened a manufacturing facility in Tualatin, Oregon, in a bid to expand its engineering and manufacturing infrastructure.
2008-04-25 Novellus exec sees the silver lining
Undaunted by reported downturns in the chip industry, Andrew Goh, president of Novellus' operations in Southeast Asia, remains optimistic about the growth prospects of the semiconductor industry.
2009-10-19 ITRI, Applied Materials push 3D IC dev't
Applied and ITRI will work together as members of the Stacked-System and Application Consortium
2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
2009-03-23 Here comes a thin-film tech breakthrough
Novellus Systems Inc. has developed a thin-film deposition technology that delivers a 5 percent lower k-effective value than alternative approaches and requires no complex material changes.
2014-07-08 Deposition, etch equipment revs up 3D NAND ramp-up
The equipment from Lam Research addresses the need for three of the most critical steps in forming 3D NAND memory cells: stack deposition, vertical channel etching, and tungsten wordline deposition.
2011-11-15 Ceramic hard mask to replace titanium nitride?
Novellus has developed a new material for sub-22nm patterning that claims to beat TiN in terms of compatibility and deformation.
2004-06-04 AUO to start equipment installation at 6G plant
AU Optronics Corp. will start installing the first batch of equipment in its 6G TFT-LCD plant at the Central Taiwan Science Park (CTSP) this July.
2007-09-05 Applied drives down cost of solar module production
Using 5.7m? panels, the Applied SunFab Thin Film Line can reduce the cost of utility-scale and building-integrated photovoltaic system installations by more than 20 percent.
2009-03-03 22nm chips to be developed by trio
IBM Corp., Applied Materials Inc. and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany have agreed to jointly develop process modeling technology for manufacturing 22nm logic and memory chips.
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