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2003-07-15 TEL transfers PVD equipment line to Metron
Tokyo Electron Ltd (TEL) has signed a LOI with Metron Technology N.V. which outlines the transfer of the Eclipse PVD equipment product line from TEL to Metron.
2013-09-09 PVD system enables power devices' 300mm transition
The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow.
2003-09-22 Metron purchases TEL's Eclipse PVD line
Metron Technology N.V. has completed its acquisition of the Eclipse PVD equipment product line from Tokyo Electron Ltd.
2014-05-30 Ionised PVD system facilitates void-free fill for TSVs
The system from Applied Materials employs improved ion density, directionality, and tunable energy to deposit barrier and copper seed layers inside high aspect ratio TSVs.
2011-02-04 Used gear supplier launches R&D foundry service
Aimed at discrete manufacturers, foundries, universities and fabless design houses, the new service covers fab and testing capabilities, PVD deposition capability, metrology and processing of various metals.
2013-01-25 Rolith enlists AGC to dev't anti-reflective glass
The advanced anti-reflective glass being developed by Rolith and AGC is based on the "moth eye" approach found in nature, an array of nanostructures mimicking an insect's eye.
2002-07-04 NEXX Systems joins SECAP
NEXX Systems has joined the Semiconductor Equipment Consortium for Advanced Packaging.
2016-03-17 Edwards introduces green, cost-efficient vacuum pumps
The iXM and IXL900R series are ideal for semiconductor etch and chemical vapour deposition (CVD) applications, and plasma vapour deposition (PVD) applications, respectively.
2010-10-15 Veeco bags HDD contracts
The company says its physical and chemical vapor deposition systems enable higher areal density for next generation thin film magnetic heads.
2003-01-02 Unaxis opens office in Shanghai
Unaxis has opened an office in China named Unaxis Shanghai Co. Ltd to act as the company's data storage facility.
2003-01-03 Unaxis opens office in Shanghai
Unaxis has opened an office in China named Unaxis Shanghai Co. Ltd. Unaxis Shanghai will handle the marketing of semiconductor, display, data storage and optical components.
2013-10-18 Ultra-high-res display makers switch to metal-oxide TFTs
The expensive low-temperature polysilicon process has prompted the ultra-high-res display industry to move to metal oxide TFTs.
2010-12-07 TSMC announces supplier awards
Nine companies received awards for being exceptional materials, equipment, and facilities service suppliers of TSMC during the company's 2010 supply chain management forum.
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2008-12-17 Tech firms detail high-k developments
IBM, Intel, TSMC and the NEC-Toshiba duo are expected to present papers on 32nm processes with high-k and metal gates at this week's International Electron Devices Meeting (IEDM).
2010-12-16 Solvent-free PV coating system allows contactless application
Plasmadust technology from Reinhausen Plasma allows solvent-free, dry and non-contacting deposition of busbars for back-contacting directly onto the aluminium layer of photovoltaics.
2009-10-27 Sematech installs tools in 450mm prototype fab
International Sematech has moved into the "test wafer generation" stage and installed the first tools in its 450mm prototype clean room, including metrology and wet-clean systems.
2004-06-01 Samsung develops CVD wiring process for 70nm DRAM
Samsung Electronics Co. Ltd has developed a chemical vapor deposition (CVD) method for depositing aluminum interconnect in DRAMs using a 70nm manufacturing process, the company said.
2012-03-15 PCM progress report no. 6: Recent advances in phase change memory (Part 2)
The second installment of this two-part series tackles other recent developments in PCM, including fabrication of a 1 Gb PCM array with a 4F2 cell size.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2014-03-28 On-chip interconnect costs head for further study
With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes.
2010-04-27 Novellus' Hill: IC market set for four-year growth cycle
Novellus is back on track after being hit hard by the downturn last year. The IC industry is set for a new and healthy three-to-four year growth cycle, according to Novellus CEO Rick Hill.
2004-12-08 Novellus unveils new solution for 65nm and below
Novellus introduced a single-system solution designed to meet contact and via-fill needs at 65nm and below.
2003-10-20 Novellus Systems co-establishes research center in China
Novellus Systems Inc. has signed a partnership agreement with Fudan University of Shanghai to establish a semiconductor technology research center.
2004-04-15 Novellus acquires ALD technology supplier
Novellus Systems Inc. has extended its copper barrier/seed roadmap with the acquisition of Angstron Systems Inc., a supplier of atomic layer deposition (ALD) technology for advanced semiconductor manufacturing.
2011-12-23 New material sought for PV apps
Imec and Flamac have combined capabilities to develop materials for solar cells as alternative to copper indium gallium and selenium.
2003-05-29 NEC fab to implement Yield Dynamics control platform
NEC Electronics America Inc. has announced that it has implemented Yield Dynamics' enTune run-to-run APC platform in its California fab.
2013-07-05 NAND flash scaling: 20nm node and below
Here are some of the fundamental cell design issues considered and addressed to arrive at this planar cell technology.
2005-07-21 Mixed signals seen in IC-equipment market
There are still plenty of mixed signals - and little visibility - in the chip-equipment market despite a sudden jump in Japan's fab-tool book-to-bill ratio.
2002-12-12 Microchip selects Applied Materials for service support
Applied Materials Inc. has announced a multi-year Total Support Package contract with Microchip Technology Inc.
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