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What does CSP stand for?
CSP stands for chip scale package or chip size package. It is a chip housing that is slightly larger than the chip itself.
total search10387 articles
2003-08-27 Zuken bundles routers into PCB package
Tool vendor Zuken Ltd has released a Cadstar desktop PCB design package that includes high-end routing technologies.
2007-05-10 Zigbee software package enables low-cost, one-box testing
LitePoint Corp.'s Zigbee software package is said to provide test support for Zigbee 802.15.4-based products and can be used with existing LitePoint IQview and IQflex Test Solutions.
2003-04-16 Zarlink packs timing module into 2.54-by-2.54mm DIL package
The ZL30462 timing module from Zarlink Semiconductor Inc. integrates a complete timing system into a 40-pin DIL package measuring 2.54-by-2.54mm.
2008-12-05 XMOS relays new package choice for G4 line
The folks at XMOS, the creators of what they refer to as "Software Defined Silicon", have released a new package option for their G4 programmable device, the first member of the XS1-G4 family.
2002-08-28 Xilinx overhauls FPGA software design package
A major upgrade of Xilinx Inc.'s Integrated Software Environment FPGA design tool package features new system-level design capabilities, improved performance, and new utilities to simplify FPGA design.
2013-12-05 Xilinx outs comprehensive functional safety design package
The company's functional safety package includes a TUV SUD certified design methodology and tools that promise to increase design productivity and reduce certification risks.
2006-09-06 Wirewound resistors housed in TO-220 package
The RoHS-compliant heatsinkable wirewound resistor series from Ohmite Manufacturing Company is housed in a TO-220 style package.
2005-12-05 Wirewound chip inductors pack performance in small package
Taiyo Yuden offers a new wirewound chip inductor series that is said to simplify designs, reduce part count and lower BOM costs by combining two devices into a single 3218-size package.
2008-07-28 White LEDs come in CLCC-2 flat ceramic package
Vishay Intertechnology Inc. claims the industry's first series of high-intensity white power SMD LEDs in the CLCC-2 flat ceramic package.
2007-07-24 White LED package achieves ultralow profile of 1.5mm
Designated the OVS5WBCR4 Series, the 0.5W surface mount white LED package from TT Electronics Optek Technology, features an ultra-low profile of just 1.5mm.
2009-03-11 WDFN6 2x2 ?Cool 506AP single MOSFET package board level application notes and thermal performance
This technical note discusses the single-channel WDFN6 506AP package overview, pad patterns, evaluation board layout and thermal performance.
2003-06-20 Wafer Level Package Technology
This application note discusses the properties and functions of the Wafer Level Package technology
2005-02-01 Vout DAC features I?C interface in 3-by-3mm package
Linear Tech said its 16bit I?C serial interface DAC in a 3-by-3mm DFN package can significantly reduce the size of portable products.
2006-01-27 Voltage reference housed in DFN package
Linear Technology announced what it touts as the industry's first precision series voltage reference to use the tiny 3-lead 2-by-2mm DFN package.
2005-04-22 Voltage divider in SOT-23 package eases board routing and layout problems
TT Electronics BI Technologies Electronic Component Division has developed a SOT-23 packaged precision voltage divider network for aerospace, industrial, military and medical industries.
2004-12-17 Vishay unveils new package type for rectifier, TVS products
Vishay disclosed that it has launched a new package type for its rectifier and transient voltage suppressor products.
2002-01-15 Vishay unveils additional package options to multilayer ferrite bead series
The company is offering four package options for the ILBB series multilayer ferrite beads, allowing designers to reduce EMI in telecommunications, computer and automotive applications.
2006-12-08 Vishay TMBS, Schottky rectifiers now in mini package
Vishay has launched a miniature package type for its TMBS and planar Schottky rectifiers that enables higher-current-density power supply designs with its compact dimensions and ability to handle up to 100V and 12A.
2002-02-11 Vishay single-package dc/dc converters cut down on mobile space
Vishay Intertechnology's FunctionPAKs for cell phones, notebook computers and digital cameras are complete synchronous dc/dc converters in a single 20-pin BGA/LGA package measuring 14.7-by-12mm with a 1.8mm-high profile.
2005-12-28 Vishay ships power MOSFETs in PolarPAK package
Vishay is shipping the first two power MOSFETs to be offered in its innovative PolarPAK package, which uses double-sided cooling to reducing thermal resistance, package resistance, and package inductance for a more efficient, faster switching power MOSFET.
2008-09-01 Vishay offers amber and yellow power LEDs in CLCC-2 package
Vishay Intertechnology Inc. claims it the industry's first series of high-intensity amber and yellow power SMD LEDs in the CLCC-2 flat ceramic package with driving currents up to 400mA.
2005-01-11 Vishay inductor with 'lowest DCR/?H for its package size'
Vishay announced the addition of a new low-profile, high-current inductor series to its line of space- and power-saving inductor solutions.
2011-05-13 USB 3.0 IC touts smallest package
Parade Technologies releases the PS8720, a Dual USB 3.0 Repeater/Redriver that supports two bi-directional USB ports on a single device.
2004-11-29 Upgraded tool speeds IC package analysis
Fluent's new offering may help prevent some of the packaging problems that have come to plague PCB designers.
2005-11-29 Upgraded SystemCrafter SC SystemC package now available
SystemCrafter and Orange Tree Technologies announced Version 2.0 of SystemCrafter's SC SystemC package. This new version has been developed to make managing and developing SystemC projects easier and simpler.
2007-07-10 Understanding flip-chip and chip-scale package technologies and their applications
This article first defines the terms "flip chip" and "chip-scale package" and explains the technical development of wafer-level packaging (WLP) technology.
2005-04-15 Ultra-bright LED comes in SMT package
Vishay Intertechnology says its new ultra-bright, low-current LEDs are the industry's first to meet demand for high brightness in a miniature 0603 size surface-mount package.
2005-11-28 Two-leaded SC-79 package now available from M/A-COM
Many of M/A-COM's high volume discrete diodes are now offered in the SC-79 small surface mount package, which are RoHS compliant and meet the 2600C maximum rating often required for Pb-free processing.
2000-07-01 Trends in multi-chip package integration
Wafer level packaging (WLP) technologies have recently attracted much development activity, innovation and investment. Here are some of the opportunities and obstacles for WLP and multi-chip package integration approaches.
2004-01-09 Transmeta launches processors in 21-by-21mm package
Transmeta has introduced its Crusoe TM5700 and TM5900 MPRs that feature an integrated Northbridge and are available in a 21-by-21mm package.
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