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Pb-free bumping technology Search results

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2006-12-21 AMD goes 'green' with Pb-free bumping tech
Advanced Micro Devices has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology.
2005-05-17 STATS ChipPAC to offer 300mm electroplated wafer bumping services
STATS ChipPAC Ltd announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete its full turnkey service offering for advanced flip chip applications
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