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2006-09-15 Spansion, Freescale collaborate on PoP flash to reduce handset size
Spansion announced a collaboration with Freescale Semiconductor for package-on-package flash memory that will enable handset manufacturers to reduce wireless handset size
2007-01-10 Toshiba offers four NAND flash solutions
To address the rapidly growing market for embedded flash solutions in consumer electronics and other handheld systems, TAEC is rolling out four embedded NAND solutions
2007-02-20 ST rolls out 'smallest' 65nm NOR flash memory
STMicroelectronics is sampling 1Gbit and 512Mbit 65nm NOR flash with what is claims is the smallest die size available on the market
2006-12-01 Pack your pocket gadget with PoP
In applications requiring a small form factor and high performance, the PoP provides a way for the components to follow an independent development path. Additionally, the two elements can be separated, giving flexibility greater than that achieved by an SiP or SoC solution
2008-09-01 NAND flash benefits multimedia phones
Today's multimedia phones require the density, cost and write performance advantages that NAND flash offers. Because of these, NAND flash has become mainstream within mobile phones through the growing use of additional high-density embedded storage chips card slots
2006-01-20 Flash memory subsystems combine best of NAND, NOR
Spansion entered the NAND flash memory portion of the cellphone market through a family of memory subsystems that integrate 90nm MirrorBit ORNAND flash memory with its NOR flash devices
2007-03-01 Boost ECC, solve NAND flash issues
Toshiba Corp. is rolling out four enabling technologies in a multipronged drive into the booming embedded NAND flash-memory market
2007-06-26 ARM debugger adds flash memory breakpoints
Embedded software tool developer Crossware has added software flash memory breakpoints to its ARM Development Suite
2008-05-01 Use analog switches for multimedia cellphone design
Several application examples are cited in this article to guide system designers with reducing pop noise, detecting chargers and improving USB eye-pattern opening in cellphones
2005-09-21 Spansion, Atheros packaging solution reduces size of mobile phones
Spansion LLC and Atheros Communications Inc. have developed an innovative packaging solution that is designed to reduce the size of dual-mode cellular/wireless LAN (WLAN) mobile phones.
2014-05-28 Parallel NOR trumps SPI in embedded applications
While the SPI provides several benefits including lower overall system costs, parallel NOR performs better in application uses where speed and performance are a factor.
2006-10-03 16bit MCUs target motor control, security apps
The new ZNEO Z16F family of flash MCUs from ZiLOG targets specific markets such as high-end motor control and domestic security applications
2013-06-26 Xbox 360 E mimics predecessor
Xbox 360 E adopts Xbox One's looks and may have cured Red Ring of Death, says teardown team at iFixit.
2016-05-19 Wearable toy takes full advantage of kids' imaginations
In addition to being an ideal toy to get kids up and moving and doing "stuff," the Mover Kit also a wearable that's designed to take full advantage of their imaginations.
2014-07-28 Utilising ARM Cortex-M based SoCs (Part 2)
The second instalment compares the capabilities of a standard microcontroller approach to the design of an embedded application to that of a system on chip approach.
2009-10-15 USB accessory switch packs charger detection
Fairchild Semiconductor has developed the smallest USB accessory switch with built-in charger detection that integrates all of the key multimedia functionality into a low-profile UMLP package.
2004-12-17 Tiny board computer has CompactFlash form-factor
Cdata Solutions is debuting a very small single-board computer for embedded system designers.
2012-09-27 The iPhone 5 inside out
Apple's iPhone 5 A1428 model, torn apart for a closer inspection
2015-04-16 Teardown: Galaxy S6 Edge exceeds build cost of iPhone 6 Plus
According to the latest teardown from IHS, the Samsung Galaxy S6 Edge smartphone has a manufacturing cost amounting to $5.60 while the iPhone 6 Plus only costs $4.01 to build.
2006-09-01 Solving the MCP memory test challenge
Multichip packages (MCPs) are the standard for cellphones, with nearly all modern cellphones having at least one MCP. Using MCPs allows manufacturers to offer the new multifunction devices while maintaining small form factors.
2005-08-05 Sensor IC packs 8051 core
As a 'smart sensor' conditioner, the SSP1492 from Sensor Platforms gives any sensor the ability for self-identification.
2011-03-17 Researchers use carbon nanotubes to scale PCM
Non-volatile memory bits can be made by applying phase-change material to previously created nanometer-scale gaps in carbon nanotube filamentary conductors, according to a paper.
2006-07-05 Power, audio controls merge in one IC
Dialog Semiconductor has launched a new combined power management and audio IC designed to support the latest-generation mobile processors.
2014-08-18 Parrot drone gets GPS teardown
The Drone uses the combination of Bosch BMA150 Accelerometer and BMP180 Barometric Pressure Sensor, Invensense IMU-3000 Gyro & Motion Processor, and Microchip PIC24HJ Microcontroller.
2007-12-28 Newsmakers: The (not so) golden Apple
Apple outdid itself this year with the heavily hyped rollout of three electronic eye candiesthe Apple TV, the iPhone and the iPod Touchtriggering a frenzy in the consumer market that reverberated to the supply chain.
2014-09-24 Microsemi rolls DSP platform for intelligent processing apps
The Timberwolf platform allows Microsemi to use its voice communications portfolio to bridge into new and emerging hands-free applications that require clear speech, free of noise and echo.
2007-06-29 Judgment day: Can the Apple iPhone deliver?
Perhaps not since the invention of wireless communication has a cellphone been the subject of this much frenzy. Could the iPhone truly fulfill its promise? Today, consumers will judge.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2014-11-24 Improve software through memory-oriented code optimisation
In this instalment, we will explore different software code and compiler optimisation techniques that can be used to boost memory performance in embedded systems.
2007-10-04 Image sensor, processing at heart of digital SLR
Three layers of vertically stacked pixels, each layer embedded in silicon, allowing it to show full color at every point on the captured imageit was these features that encouraged Sigma to select the Foveon X3 14.1Mpixel image sensor for its advanced Sigma SD14 DSLR.
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