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2004-10-14 3G phones shave costs, but integration path unclear
The latest crop of 3G cellphones shows the market is maturing with more integrated digital chipsets driving substantially lower handset costs.
2009-12-02 3G phone springs from 2G design overhaul
Released in Q1 08, Samsung's SGH-J750 tells a less-fleeting tale of OEM sourcing decisions, ASIC development strategies and foot-in-the-door approaches behind the cellphone market.
2008-05-13 3G PA powers up EGSM handsets
Anadigics has introduced a PA module designed specifically for use in 3G dual-band handsets for EGSM network deployments worldwide, especially Europe.
2006-07-13 3G in China taking longer than expected
3G development in China is taking longer than expected, and pundits are exasperated. Its commercialization will depend on the readiness of TD-SCDMA, which is considered the underdog standard. Will it take three generations for 3G to happen?
2010-12-15 3DS-IC group to fast-track TSV standards
SEMI worked with SEMATECH to launch the Three-Dimensional Stacked Integrated Circuits (3DS-IC) group to develop manufacturing standards for through-silicon via (TSV) technology.
2010-07-16 3D chip standard talks start at Semicon West
Participants of a Semicon West 2010 workshop took the first crack at outlining standards for 3D silicon chips to address design, yield and cost problems.
2015-06-03 3 becomes 2: Wireless power bodies A4WP, PMA announce merger
A4WP and PMA, two of the three major wireless charging standard groups, announced their plans to merge are official, leaving behind WPC's Qi platform as the sole alternative.
2010-12-11 2D/3D chip banks on 3D in smart phones, tablets
Dialog’s DA8223, which has a hardwired, dedicated architecture that puts no extra load on the host application processor and requires no external memory, can be plugged into existing portable devices.
2014-03-20 28nm node at the final frontier of Moore's Law
Zvi Or-Bach of MonolithIC 3D emphasises the need to recognise that 28nm is actually the last node of Moore's Law and that dimensional scaling is no longer the path for cost scaling.
2011-01-06 2011 forecast from Semico
Semico Research Co. reveals seven key predictions for the coming year. NAND flash, ASIC, SoCs get special mention.
2009-01-06 2009 IC fearless forecasts
2009 is just beginning to unfold in the electronics industry and there is already a looming uncertainty based on recent industry data.
2006-03-13 2005 fabless semi revenue topped $40 billion, says FSA
Fabless semiconductor company revenue topped $40 billion in 2005 for the first time, according to a report released last week by the Fabless Semiconductor Association.
2008-10-01 1H 08 shows revamp in IC ranking
A big shakeup in the top 20 semiconductor supplier ranking for 1H 08 has been reported by IC Insights Inc. Although the top four ranked companies stayed put in their spots, there were a number of "movers and shakers" up and down the list.
2006-10-17 19M low cost handsets to ship this year, says report
Nineteen million ultra low cost handsets will ship this year, with Motorola continuing to dominate the sector with an almost 80 percent share, according to Strategy Analytics.
2009-10-15 18Mpixel camera phone, anyone?
It won't be long before your camera phone will turn into a real camera with a real phone. But what will it take to make that happen? And will it affect alleven the most basic phones?
2013-09-30 16GB iPhone 5s carries $199 BoM
The iPhone 5s features a 64bit apps processor, low-power Double Data Rate 3 (LPDDR3) DRAM and a novel fingerprint sensor, but with a nearly similar BoM as iPhone 5 from last year.
2015-03-09 15 innovative things seen at MWC 2015
Here is a presentation of 15 curious things spotted at the recently concluded Mobile World Congress in Spain, which highlighted many connected devices and technologies.
2010-06-15 10 reasons to remain bullish, worried for 2010
So far, the electronics industry is seeing a big upturn, giving signs of a positive year. Still, there are some concerns. Here are 10 reasons why I'm bullishand worriedabout 2010.
2009-12-23 1.66GHz Atom packs graphics, memory controller
Intel Corp. is offering new versions of its Atom processor that integrate graphics and a memory controller on the same die as the x86 CPU.
2009-04-28 'Green' displays to take center stage
The Green Display Expo slated in July is set to explore how technology, standards and regulations will affect display use and disposal.
2009-04-28 'First' 22nm SRAM cells from EUV litho debut
IMEC has presented what it claims is to be the first functional 22nm CMOS SRAM cells made using extreme UV (EUV) lithography. The SRAM cells are made with FinFETs and have both the contact and metal-1 layer printed using a full-field EUV alpha demo tool from ASML.
2011-10-26 'ARM Dog' is out but Intel isn't running
Rather than jumping into ARM's bandwagon of high- and low-power core combo, Intel is working to cut transistor power altogether.
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