Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > RF SoC

RF SoC Search results

?
?
total search410 articles
2008-07-16 Cadence Virtuoso aids analog, mixed-signal SoC designs
The latest version of Cadence Design Systems Inc.'s Virtuoso custom design platform has been deployed by Matsushita Electric Industrial Co. Ltd for analog and mixed-signal advanced node designs.
2005-09-14 First true' One-Chip ZigBee SoC
Measuring 7-by-7mm, Chipson's CC2430 combines a robust radio, programmable microcontroller, flash memory, and both IEEE802.15.4 and ZigBee software all in one easy-to-use and cost-effective chip.
2012-07-06 Wireless ICs deliver 50% less power consumption
New Nordic Semiconductor wireless ICs feature higher performance and low power.
2002-09-16 Smart partitioning could be path to integration
The paper talks about the trade-offs of implementing RF inside the chip against surrounding the mainly digital chip with the needed RF circuits
2010-02-08 DSP-equipped transceiver rolls for wireless nets
CSEM has developed a 1V RF transceiver with an integrated DSP tailored for portable wireless communications such as wireless sensor networks and body area networks
2005-06-15 Credence to establish engineering training center in China
Credence Systems Corp., a provider of test solutions from design to production for the semiconductor industry, has entered into a partnership with the North China University of Technology (NCUT) in Beijing to provide valuable training to engineering students.
2014-04-02 Audio streaming with karaoke for DVDs, STBs
Read about CC853x, a 2.4GHz RF SoC for wireless audio streaming.
2003-06-23 Agilent launches project to aid Taiwan-based manufacturers
Agilent Technologies has received a government grant from the Taiwan MOEA to spur communications product R&D through an initiative called the Agilent Integrated Platform Service Project.
2006-05-31 ZigBee transceivers use TI SoCs
AeroComm is offering OEMs two ZigBee RF transceivers based on Texas Instruments' recently released IEEE-802.15.4 SoC and Z-Stack firmware.
2002-03-20 VIA sets eyes on mobile phone applications
In a bid to move into the mobile phone market, VIA, the Taiwan-based PC chipset vendor, has began to put its effort on the development of mobile phone chipsets since the second half of last year.
2006-04-19 USB dongle sweeps 2.4GHz ISM band
MetaGeek's less-than-$100 Wi-Spy plug-in is just the ticket for rudimentary analysis of IEEE-802.11 b/g/n Wi-Fi networks.
2006-12-18 Ultralow-cost handsets call for single chip
The market for ultralow-cost handsets is expected to grow quickly over the next three to four years, as more than two-thirds of new subscribers come from developing countries.
2010-07-30 Two-way audio communications using the CC2510
This application note describes a two-way audio communications link between a Master and a Slave, based on the Texas Instruments CC2510 SoC low-power RF transceiver.
2007-06-28 TSMC, Cadence team on 65nm wireless design flow
Cadence and TSMC have teamed on nanometer wireless design and produced a new TSMC 65nm RF PDK compatible with the new Cadence Virtuoso custom design platform
2004-06-30 Toshiba extends bulk CMOS life to 22nm
Toshiba Corp. has developed technologies that it says will extend the life of bulk CMOS as far as the 22nm technology node, which won't reach production until 2016, according to the timetable set out in the 2003 edition of the International Technology Roadmap for Semiconductors (ITRS).
2003-01-29 TI launches first 90nm-based chip
Texas Instruments Inc. has delivered a fully-functional wireless digital baseband IC from its next-gen, 90nm process.
2006-01-30 TI completes Chipcon acquisition
Texas Instruments has completed its previously announced acquisition of Chipcon, a company that designs short-range, low-power wireless RF transceiver devices
2000-02-01 The future of mixed-signal design
I hear two contradictory things regarding mixed-signal IC design. One set of voices says the systems-on-chip (SoC) of the future will be large mixed-signal systems, and the proportion of these being built will double from about 33 percent currently to 66 percent by 2005. The other set of voices says everything will be big digital chips constructed in ever-deeper submicron CMOS, in that the ASICs of the future will use as many 15 million logic gates, but that the analog and mixed-signal circuitry will be left off-chip
2006-12-18 Tester, ICs boost TD-SCDMA's chances in China
China-based Tektronix Inc. and Rising Microelectronics Co. Ltd will have TD-SCDMA transceiver technology available, casting aside a few more roadblocks on China's domestic third-generation standard.
2002-09-20 Taiwan hosts EDA&T 2002
The 10th Electronic Design Automation & Test Expo (EDA&T) is set to be held in Hsin Chu, considered by many as Taiwan's
2002-03-12 Synopsys, UMC develop signal-integrity test chip
Synopsys and UMC announced they have developed the ATG-SI test chip for researching signal-integrity effects on designs developed in UMC's 0.13?m Fusion process.
2001-04-01 Startup set to roll Bluetooth module-on-a-chip
A CMOS device said to pack nearly all the components needed to build a Bluetooth module has been launched by a year-old Silicon Valley startup.
2005-09-16 Startup integrates DVB-T tuner tasks
RF Magic Inc. has taken all the circuitry required for a DVB-T tuner and integrated it onto an 8mm x 8mm QFN-lead IC
2004-03-16 Software becomes manager of power
The biggest roadblock to continuing integration of highly mobile devices is the analog and simple digital functions necessary to support the SoC and RF components.
2003-09-04 SoCs remains driving force of consumer electronics
Looking into the next 3-5 years, we see the further commercialization of electronics in China.
2003-01-16 SoCs no panacea for comms infrastructure
Unlike battery-powered handsets, the room-size cellular basestations and telecom switching stations that make up the real comms infrastructure have scant need for highly integrated, small-form-factor, low-power ICs.
2004-02-02 SoCs challenge production test methods
The success of the SoC has driven down direct silicon costs as a component of system cost, it has accentuated the very factor engineers are struggling to control: test cost
2005-02-16 SiPs offer alternative to SoCs for comms
The key to bringing the different parts together to create integrated plug-and-play system solutions lies in SiP technology.
2005-09-16 SiP: a window of opportunity for passives
In the great debate of SoC vs. SiP, design engineers usually get tangled in the delicate technical intricacies while missing an important pointthe implications on the passive component industry
2007-06-08 Single-chip tuner suits high-def TV sets
Hybrid TV tuner specialist Xceive Corp. is launching a new line of analog-digital tuners, the XC5000, intended for high-end TV applications that need noise performance exceeding that of can tuners.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top