Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > RF front-end

RF front-end Search results

?
?
total search544 articles
2003-03-13 ADI embeds VCOs on GSM/GPRS transceiver chip
Analog Devices Inc. (ADI) has released the latest member of its Othello transceiver line.
2004-07-01 Adaptive antennas gain in 60GHz band
The only practical way to achieve high antenna gain in a changing or mobile environment is to use an adaptive antenna array.
2011-06-28 28nm CMOS supports WLAN, Bluetooth
RFaxis rolls out its 28nm CMOS silicon multiband/multimode RF Front-end IC that supports WLAN and Bluetooth.
2007-04-02 Wi-Fi/Bluetooth combos flood market
Wireless chipmakers have unleashed a barrage of similar-sounding products for cellular handsets that offer simultaneous support for Bluetooth and WLANs.
2007-03-20 WEDGE transmit modules streamline 3G design
Anadigics has launched a new family of multichip front-end modules that promises to help streamline 3G designs by providing a complete transmit chain for W-CDMA/EDGE mobile handsets
2012-03-13 Transceiver module targets 915MHz AMR systems
The RF6559 has an integrated three-state PA with 42dB of gain and typical power output of 28dBm.
2007-07-16 Tips for a peaceful Bluetooth/Wi-Fi coexistence
Bluetooth and Wi-Fi operate in the unlicensed 2.4GHz ISM band, and send data in packet form. Although Bluetooth and Wi-Fi use the spectrum differently, interference still occurs. As the Bluetooth specification has developed, new techniques have been added. This article discusses the measures that have been implemented.
2013-08-28 TI rolls power chips with MIPI RFFE, maximise battery life
Integrating the MIPI Alliance's radio frequency front-end digital control interface, TI's latest RF power converters significantly reduce the heat and power consumption in RF power amplifiers.
2005-10-03 TI kit cuts WI development time
Texas Instruments recently introduced an easy-to-use radio frequency (RF) transmit signal chain demonstration kit that promises to speed time-to-market by cutting development time, risk and cost in wireless infrastructure apps
2015-04-24 TI bares FPGA alternative
The 66AK2L06 programmable system-on-chip offers efficient, direct connection to analogue front end (AFE) using Texas Instrument's integrated KeyStone technology and JESD204B-compliant standards
2007-03-01 Tap model-based design in DDC development
Model-based design provides an environment for creating executable specifications, which provide a high-level view of the design that can be used to explore system-level analysis and trade-offs, and detect potential design and implementation errors.
2005-09-16 Startup integrates DVB-T tuner tasks
RF Magic Inc. has taken all the circuitry required for a DVB-T tuner and integrated it onto an 8mm x 8mm QFN-lead IC
2004-11-01 Standard interface eases partitioning
Engineers opt for smart partitioning in wireless systems instead of integrating all components into a single system chip.
2013-09-02 SMC picks MaxLinears capture receiver for cable gateways
MaxLinear's MxL265 cable tuner is capable of receiving up to 680Mbit/s via 16 bonded downstream channels.
2005-09-29 Skyworks, Motorola to develop TETRA-based PA
Skyworks Solutions has signed an exclusive agreement with Motorola Inc. to jointly develop Terrestrial Trunked Radio (TETRA)-based power amplifiers.
2004-02-10 Shanghai Alps receives ISO certification
Shanghai Alps Electronics Co. Ltd, a joint venture of ALPS Electronics Co. Ltd, Shanghai Jinling Co. Ltd, and ALPS (China) Co. Ltd, has obtained ISO 14001 certification.
2010-12-01 Semiconductor equipment industry flounders (part 2)
The semiconductor capital equipment industry has not yet recovered its investment in 300mm wafer processing technology, thus, it is not yet prepared to develop 450mm tools.
2005-08-26 Samsung to offer a DVB-H chipset
Targeting the emerging TV-on-mobile market based on the DVB-H standard, Samsung Electronics announced early this week a new DVB-H front-end chipset
2011-02-21 Samsung selects RFMD parts for 3G/4G phones, tablets
RF Micro Devices reports that Samsung Electronics has selected RFMD's PowerSmart power platforms and WiFi components for its Galaxy S 2 smart phone and Galaxy Tab 10.1 tablet PC
2005-08-24 Samsung develops complete DVB-H solution
Samsung Electronics Co. Ltd has developed a digital video broadcasting for handhelds (DVB-H) front-end chipset
2006-03-16 Rx: New test techniques
New measurement approaches require faster and more efficient and reliable instrumentation and software.
2011-01-12 RFMD's PowerSmart power platforms attain 4G performance high
PowerSmart power platforms reshape the future of multi-band cellular RF designs, achieving HSPA+ 4G data upload speeds while drawing approximately 15 percent less current than competitive solutions
2010-10-15 RFMD to provide Samsung Galaxy tab components
Samsung selects RF Micro Devices to provide three Wi-Fi components for Galaxy Tab tablet
2007-04-26 RFMD Shanghai facility to include R&D
RF Micro Devices Inc. announced the addition of an R&D center in its Shanghai facility located in Zhanjiang High-Tech Park
2006-07-28 RFMD reports 50 percent growth in revenue for Q1
RF Micro Devices reported that it's quarterly revenue its fiscal 2007 first quarter ended June 30, grew approximately 50 percent year-over-year and 5.5 percent sequentially
2011-02-17 RFMD FEMs deal with high band count, harmonics
RF Micro Devices Inc. expands its line of front end modules for 3G and 4G switch and signal conditioning applications.
2003-11-27 RFMD device offered in 3-by-3mm footprint
RF Micro Devices has announced the availability of its RF2861 single-band receiver front-end with an integrated TX LO buffer amplifier designed for CDMA cellular, JCDMA, and CDMA450 applications.
2005-12-06 RFMD chipset ships in Motorola handset
RF Micro Devices announced shipments of its POLARIS 2 TOTAL RADIO chipset into the Motorola V360 EDGE handset
2002-08-27 RFMD CDMA receiver features 3-by-3mm footprint
The RF2870 CDMA front-end receiver features a transmit local oscillator buffer amplifier and occupies a 3-by-3mm footprint
2008-04-23 Renesas, IMEC collaborate on reconfigurable transceivers
A strategic collaboration to research on 45nm RF transceivers targeting Gbit/s cognitive radios and ADCs has been entered into by Renesas Technology Corp. and IMEC
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top